To all our customers
Regarding the change of names mentioned in the document, such as Mitsubishi
Electric and Mitsubishi XX, to Renesas Technology Corp.
The semiconductor operations of Hitachi and Mitsubishi Electric were transferred to Renesas
Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog
and discrete devices, and memory chips other than DRAMs (flash memory, SRAMs etc.)
Accordingly, although Mitsubishi Electric, Mitsubishi Electric Corporation, Mitsubishi
Semiconductors, and other Mitsubishi brand names are mentioned in the document, these names
have in fact all been changed to Renesas Technology Corp. Thank you for your understanding.
Except for our corporate trademark, logo and corporate statement, no changes whatsoever have been
made to the contents of the document, and these changes do not constitute any alteration to the
contents of the document itself.
Note : Mitsubishi Electric will continue the business operations of high frequency & optical devices
and power devices.
Renesas Technology Corp.
Customer Support Dept.
April 1, 2003
keep safety first in your circuit designs !
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Mitsubishi Electric Corporation puts the maximum effort into making semiconductor
products better and more reliable, but there is always the possibility that trouble
may occur with them. Trouble with semiconductors may lead to personal injury,
fire or property damage. Remember to give due consideration to safety when
making your circuit designs, with appropriate measures such as (i) placement
of substitutive, auxiliary circuits, (ii) use of non-flammable material or (iii) prevention
against any malfunction or mishap.
Notes regarding these materials
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These materials are intended as a reference to assist our customers in the
selection of the Mitsubishi semiconductor product best suited to the customer’s
application; they do not convey any license under any intellectual property rights,
or any other rights, belonging to Mitsubishi Electric Corporation or a third party.
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Mitsubishi Electric Corporation assumes no responsibility for any damage, or
infringement of any third-party’s rights, originating in the use of any product
data, diagrams, charts or circuit application examples contained in these materials.
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All information contained in these materials, including product data, diagrams
and charts, represent information on products at the time of publication of these
materials, and are subject to change by Mitsubishi Electric Corporation without
notice due to product improvements or other reasons. It is therefore recommended
that customers contact Mitsubishi Electric Corporation or an authorized Mitsubishi
Semiconductor product distributor for the latest product information before
purchasing a product listed herein.
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Mitsubishi Electric Corporation semiconductors are not designed or manufactured
for use in a device or system that is used under circumstances in which human
life is potentially at stake. Please contact Mitsubishi Electric Corporation or an
authorized Mitsubishi Semiconductor product distributor when considering the
use of a product contained herein for any specific purposes, such as apparatus
or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea
repeater use.
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The prior written approval of Mitsubishi Electric Corporation is necessary to
reprint or reproduce in whole or in part these materials.
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If these products or technologies are subject to the Japanese export control
restrictions, they must be exported under a license from the Japanese government
and cannot be imported into a country other than the approved destination.
Any diversion or reexport contrary to the export control laws and regulations of
JAPAN and/or the country of destination is prohibited.
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Please contact Mitsubishi Electric Corporation or an authorized Mitsubishi
Semiconductor product distributor for further details on these materials or the
products contained therein.
BEFORE USING THIS USER’S MANUAL
This user’s manual consists of the following three chapters. Refer to the chapter appropriate to your conditions,
such as hardware design or software development.
1. Organization
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CHAPTER 1 HARDWARE
This chapter describes features of the microcomputer and operation of each peripheral function.
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CHAPTER 2 APPLICATION
This chapter describes usage and application examples of peripheral functions, based mainly on setting
examples of related registers.
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CHAPTER 3 APPENDIX
This chapter includes precautions for systems development using the microcomputer, the mask ROM
confirmation forms (mask ROM version), ROM programming confirmation forms (One Time PROM version)
and mark specification forms which are to be submitted when ordering.
Be sure to refer to this chapter because this chapter also includes necessary information for systems
development.
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