To all our customers
Regarding the change of names mentioned in the document, such as Hitachi
Electric and Hitachi XX, to Renesas Technology Corp.
The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas
Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog
and discrete devices, and memory chips other than DRAMs (flash memory, SRAMs etc.)
Accordingly, although Hitachi, Hitachi, Ltd., Hitachi Semiconductors, and other Hitachi brand
names are mentioned in the document, these names have in fact all been changed to Renesas
Technology Corp. Thank you for your understanding. Except for our corporate trademark, logo and
corporate statement, no changes whatsoever have been made to the contents of the document, and
these changes do not constitute any alteration to the contents of the document itself.
Renesas Technology Home Page: http://www.renesas.com
Renesas Technology Corp.
Customer Support Dept.
April 1, 2003
Cautions
Keep safety first in your circuit designs!
1.
Renesas Technology Corporation puts the maximum effort into making semiconductor products better and more reliable, but
there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or
property damage.
Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement
of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap.
Notes regarding these materials
1.
These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corporation
product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any
other rights, belonging to Renesas Technology Corporation or a third party.
2.
Renesas Technology Corporation assumes no responsibility for any damage, or infringement of any third-party's rights,
originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in
these materials.
3.
All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents
information on products at the time of publication of these materials, and are subject to change by Renesas Technology
Corporation without notice due to product improvements or other reasons. It is therefore recommended that customers contact
Renesas Technology Corporation or an authorized Renesas Technology Corporation product distributor for the latest product
information before purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors.
Renesas Technology Corporation assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies
or errors.
Please also pay attention to information published by Renesas Technology Corporation by various means, including the
Renesas Technology Corporation Semiconductor home page (http://www.renesas.com).
4.
When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and
algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the
information and products. Renesas Technology Corporation assumes no responsibility for any damage, liability or other loss
resulting from the information contained herein.
5.
Renesas Technology Corporation semiconductors are not designed or manufactured for use in a device or system that is used
under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corporation or an
authorized Renesas Technology Corporation product distributor when considering the use of a product contained herein for any
specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater
use.
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8.
Please contact Renesas Technology Corporation for further details on these materials or the products contained therein.
Hitachi Single-Chip Microcomputer
H8/3827R Series, H8/3827S Series
H8/3827R
H8/3827S
H8/3826R
H8/3826S
H8/3825R
H8/3825S
H8/3824R
H8/3824S
H8/3823R
H8/3822R
HD6473827R, HD6433827R,
HCD6433827R
HD6433827S, HCD6433827S
HD6433826R, HCD6433826R
HD6433826S, HCD6433826S
HD6433825R, HCD6433825R
HD6433825S, HCD6433825S
HD6433824R, HCD6433824R
HD6433824S, HCD6433824S
HD6433823R, HCD6433823R
HD6433822R, HCD6433822R
Hardware Manual
ADE-602-196A
Rev. 2.0
3/19/03
Hitachi Ltd.
The revision list can be viewed directly by clicking
the title page.
The revision list summarizes the locations of
revisions and additions. Details should always be
checked by referring to the relevant text.
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s
patent, copyright, trademark, or other intellectual property rights for information contained in
this document. Hitachi bears no responsibility for problems that may arise with third party’s
rights, including intellectual property rights, in connection with use of the information
contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you
have received the latest product standards or specifications before final design, purchase or
use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability.
However, contact Hitachi’s sales office before using the product in an application that
demands especially high quality and reliability or where its failure or malfunction may directly
threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear
power, combustion control, transportation, traffic, safety equipment or medical equipment for
life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi
particularly for maximum rating, operating supply voltage range, heat radiation characteristics,
installation conditions and other characteristics. Hitachi bears no responsibility for failure or
damage when used beyond the guaranteed ranges. Even within the guaranteed ranges,
consider normally foreseeable failure rates or failure modes in semiconductor devices and
employ systemic measures such as fail-safes, so that the equipment incorporating Hitachi
product does not cause bodily injury, fire or other consequential damage due to operation of
the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document
without written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi
semiconductor products.
Preface
The H8/3827 Series is a high-performance single-chip microcomputer that integrates peripheral
functions necessary for system configuration with an H8/300L CPU core.
The on-chip peripheral functions include ROM, RAM, six timers, 14-bit PWM, a serial
communication interface (SCI), an A/D converter, LCD controller/driver, and I/O ports, providing
an ideal configuration as a microcomputer for embedding in sophisticated control systems. PROM
(Z-TAT™*) and mask ROM are available as on-chip ROM, enabling users to respond quickly and
flexibly to changing application specifications and the demands of the transition from initial to
full-fledged volume production.
Note: * Z-TAT is a trademark of Hitachi, Ltd.
Intended Readership: This manual is intended for users undertaking the design of an application
system using the H8/3827 Series. Readers using this manual require a basic
knowledge of electrical circuits, logic circuits, and microcomputers.
Purpose:
The purpose of this manual is to give users an understanding of the hardware
functions and electrical characteristics of the H8/3827 Series.Details of
execution instructions can be found in the H8/300L Series Programming
Manual, which should be read in conjunction with the present manual.
Using this Manual:
•
For an overall understanding of the H8/3827 Series's functions
Follow the Table of Contents.This manual is broadly divided into sections on the CPU, system
control functions, peripheral functions, and electrical characteristics.
•
For a detailed understanding of CPU functions
Refer to the separate publication H8/300L Series Programming Manual.
Note on bit notation: Bits are shown in high-to-low order from left to right.
Related Material:
The latest information is available at our Web Site. Please make sure that you
have the most up-to-date information available.
(http://www.hitachisemiconductor.com/)
FPGA/CPLD
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