Octal Buffer/Line Driver with 3-State Output
HD74ACT240 | HD74AC240FPEL | HD74AC240 | HD74AC240P | HD74AC240RPEL | HD74AC240TELL | |
---|---|---|---|---|---|---|
描述 | Octal Buffer/Line Driver with 3-State Output | Octal Buffer/Line Driver with 3-State Output | Octal Buffer/Line Driver with 3-State Output | Octal Buffer/Line Driver with 3-State Output | Octal Buffer/Line Driver with 3-State Output | Octal Buffer/Line Driver with 3-State Output |
是否无铅 | - | 含铅 | - | 不含铅 | 含铅 | 含铅 |
是否Rohs认证 | - | 符合 | - | 不符合 | 不符合 | 不符合 |
厂商名称 | - | Renesas(瑞萨电子) | - | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) |
零件包装代码 | - | SOIC | - | DIP | SOIC | TSSOP |
包装说明 | - | SOP-20 | - | DIP-20 | SOP, SOP20,.4 | TSSOP, TSSOP20,.25 |
针数 | - | 20 | - | 20 | 20 | 20 |
Reach Compliance Code | - | compliant | - | unknown | unknow | unknow |
控制类型 | - | ENABLE LOW | - | ENABLE LOW | ENABLE LOW | ENABLE LOW |
系列 | - | AC | - | AC | AC | AC |
JESD-30 代码 | - | R-PDSO-G20 | - | R-PDIP-T20 | R-PDSO-G20 | R-PDSO-G20 |
长度 | - | 12.6 mm | - | 24.5 mm | 12.8 mm | 6.5 mm |
负载电容(CL) | - | 50 pF | - | 50 pF | 50 pF | 50 pF |
逻辑集成电路类型 | - | BUS DRIVER | - | BUS DRIVER | BUS DRIVER | BUS DRIVER |
最大I(ol) | - | 0.012 A | - | 0.012 A | 0.012 A | 0.012 A |
位数 | - | 4 | - | 4 | 4 | 4 |
功能数量 | - | 2 | - | 2 | 2 | 2 |
端口数量 | - | 2 | - | 2 | 2 | 2 |
端子数量 | - | 20 | - | 20 | 20 | 20 |
最高工作温度 | - | 85 °C | - | 85 °C | 85 °C | 85 °C |
最低工作温度 | - | -40 °C | - | -40 °C | -40 °C | -40 °C |
输出特性 | - | 3-STATE | - | 3-STATE | 3-STATE | 3-STATE |
输出极性 | - | INVERTED | - | INVERTED | INVERTED | INVERTED |
封装主体材料 | - | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | - | SOP | - | DIP | SOP | TSSOP |
封装等效代码 | - | SOP20,.3 | - | DIP20,.3 | SOP20,.4 | TSSOP20,.25 |
封装形状 | - | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | - | SMALL OUTLINE | - | IN-LINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度) | - | NOT SPECIFIED | - | NOT SPECIFIED | 225 | NOT SPECIFIED |
电源 | - | 3.3/5 V | - | 3.3/5 V | 3.3/5 V | 3.3/5 V |
传播延迟(tpd) | - | 9 ns | - | 9 ns | 9 ns | 9 ns |
认证状态 | - | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | - | 2.2 mm | - | 5.08 mm | 2.65 mm | 1.1 mm |
最大供电电压 (Vsup) | - | 6 V | - | 6 V | 6 V | 6 V |
最小供电电压 (Vsup) | - | 2 V | - | 2 V | 2 V | 2 V |
标称供电电压 (Vsup) | - | 3.3 V | - | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | - | YES | - | NO | YES | YES |
技术 | - | CMOS | - | CMOS | CMOS | CMOS |
温度等级 | - | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子形式 | - | GULL WING | - | THROUGH-HOLE | GULL WING | GULL WING |
端子节距 | - | 1.27 mm | - | 2.54 mm | 1.27 mm | 0.65 mm |
端子位置 | - | DUAL | - | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | - | 5.5 mm | - | 7.62 mm | 7.5 mm | 4.4 mm |
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