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TAAD08JU21BCLUL3A

产品描述ATM/SONET/SDH IC, CMOS, PBGA520,
产品类别无线/射频/通信    电信电路   
文件大小3MB,共199页
制造商Broadcom(博通)
下载文档 详细参数 选型对比 全文预览

TAAD08JU21BCLUL3A概述

ATM/SONET/SDH IC, CMOS, PBGA520,

TAAD08JU21BCLUL3A规格参数

参数名称属性值
包装说明BGA, BGA520,31X31,50
Reach Compliance Codecompliant
JESD-30 代码S-PBGA-B520
端子数量520
最高工作温度70 °C
最低工作温度
封装主体材料PLASTIC/EPOXY
封装代码BGA
封装等效代码BGA520,31X31,50
封装形状SQUARE
封装形式GRID ARRAY
电源1.5,3.3 V
认证状态Not Qualified
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子形式BALL
端子节距1.27 mm
端子位置BOTTOM
Base Number Matches1

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Data Sheet, Rev. 1
November 25, 2003
TAAD08JU21BCLUL3A
T1/E1/J1 ATM Processor, Versions 2.1 and 3.1
1 Features
s
s
System-on-a-chip integrated circuit supports low-
speed ATM access for next-generation wireless
base transmission station (BTS), base station con-
troller (BSC), node-B, radio network controller
(RNC), and remote access concentrator (RAC)
applications.
IC provides an integrated octal framer that sup-
ports T1/E1/J1formats.
Supports inverse multiplexing for ATM (IMA) over
selected group and link mappings ranging from
four two-link groups up to one eight-link group per
ATM Forum AF-PHY-0086.001.
Integrates an ATM adaptation layer 2 (AAL2) seg-
mentation and reassembly (SAR) function for sup-
port of low-speed data or voice traffic per ITU
I.363.2.
Provides AAL5 SAR functionality per ITU I.363.5.
Provides quality of service (QoS) connection iden-
tifier (CID) multiplexing per ITU I.366.1.
Enables ATM layer user network interface (UNI) or
IMA mode, selectable on a per-link basis for flexi-
ble transport of delay critical voice and data traffic.
Guarantees QoS for a variety of traffic types
(including delay-sensitive voice, real-time data,
non-real-time data, and signaling information)
through an advanced hierarchical three-level prior-
ity scheduler and per-VC queueing.
Supports 512 bidirectional AAL2 CIDs.
Supports 2032 bidirectional high-speed data con-
nections or virtual circuits (VCs) via embedded
context memory; filters control cells and accepts
control cells via a host microprocessor interface.
On-board memory is used for connection manage-
ment and queue data storage. No external memory
is needed.
s
s
Software package includes the following:
— Device manager source code (C-based device
manager ready-to-use with host RTOS).
— Setup file utility to provision
TAAD08JU21BCLUL3A.
— Firmware for embedded controller (executable
binary).
— API reference manual available for device man-
ager software.
Designed in 0.16 µm, low-power CMOS
technology.
s
2 Physical
s
s
s
s
3.3 V digital I/O compatibility; 1.5 V core power
520 enhanced ball-grid array (EBGA) package
–40
o
C to +85
o
C temperature range
s
s
3 Standards
ITU I.363.2, ITU I.363.5, ITU I.366.1, ITU I.366.2,
ITU I.432, ITU I.361, ITU I.371, ITU G.703, ITU
G.704, ITU G.804, ITU G.732, ITU G.706, ITU I.610,
ITU G.775, ITU G.733, ITU G.735, ITU G.965,
ITU O.162,
ANSI
®
T1.403,
ANSI
T1.231,
ATM Forum AF-PHY-0086.001
ATM Forum AF-PHY-0039.000
ATM Forum AF-TM-0121.000
ETS 300.417-1-1
s
s
s
s
s

TAAD08JU21BCLUL3A相似产品对比

TAAD08JU21BCLUL3A
描述 ATM/SONET/SDH IC, CMOS, PBGA520,
包装说明 BGA, BGA520,31X31,50
Reach Compliance Code compliant
JESD-30 代码 S-PBGA-B520
端子数量 520
最高工作温度 70 °C
封装主体材料 PLASTIC/EPOXY
封装代码 BGA
封装等效代码 BGA520,31X31,50
封装形状 SQUARE
封装形式 GRID ARRAY
电源 1.5,3.3 V
认证状态 Not Qualified
表面贴装 YES
技术 CMOS
温度等级 COMMERCIAL
端子形式 BALL
端子节距 1.27 mm
端子位置 BOTTOM
Base Number Matches 1

 
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