RJK0368DPA
Silicon N Channel Power MOS FET
Power Switching
REJ03G1658-0400
Rev.4.00
Aug 05, 2008
Features
High speed switching
Capable of 4.5 V gate drive
Low drive current
High density mounting
Low on-resistance
R
DS(on)
= 11 m
Ω
typ. (at V
GS
= 10 V)
•
Pb-free
•
•
•
•
•
Outline
RENESAS Package code: PWSN0008DA-A
(Package name: WPAK)
5 6 7 8
D D D D
5 6 7 8
4
G
4 3 2 1
1, 2, 3
Source
4
Gate
5, 6, 7, 8 Drain
S S S
1 2 3
Absolute Maximum Ratings
(Ta = 25°C)
Item
Drain to source voltage
Gate to source voltage
Drain current
Drain peak current
Body-drain diode reverse drain current
Avalanche current
Avalanche energy
Channel dissipation
Channel to case thermal resistance
Channel temperature
Storage temperature
Notes: 1. PW
≤
10
µs,
duty cycle
≤
1%
2. Value at Tch = 25°C, Rg
≥
50
Ω
3. Tc = 25°C
Symbol
V
DSS
V
GSS
I
D
I
D(pulse)
I
DR
Note1
Ratings
30
±20
20
80
20
9
8.1
25
5
150
–55 to +150
Unit
V
V
A
A
A
A
mJ
W
°C/W
°C
°C
I
AP Note 2
E
AR Note 2
Pch
θch-c
Note3
Tch
Tstg
Note3
REJ03G1658-0400 Rev.4.00 Aug 05, 2008
Page 1 of 6
RJK0368DPA
Electrical Characteristics
(Ta = 25°C)
Item
Drain to source breakdown voltage
Gate to source leak current
Zero gate voltage drain current
Gate to source cutoff voltage
Static drain to source on state
resistance
Forward transfer admittance
Input capacitance
Output capacitance
Reverse transfer capacitance
Gate Resistance
Total gate charge
Gate to source charge
Gate to drain charge
Turn-on delay time
Rise time
Turn-off delay time
Fall time
Body–drain diode forward voltage
Body–drain diode reverse recovery
time
Notes: 4. Pulse test
Symbol
V
(BR)DSS
I
GSS
I
DSS
V
GS(off)
R
DS(on)
R
DS(on)
|y
fs
|
Ciss
Coss
Crss
Rg
Qg
Qgs
Qgd
t
d(on)
t
r
t
d(off)
t
f
V
DF
t
rr
Min
30
—
—
1.2
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Typ
—
—
—
—
11
16
35
730
140
45
1.2
6.2
1.9
1.3
5
3.5
31.4
4.1
0.88
20
Max
—
± 0.1
1
2.5
14.3
22.4
—
—
—
—
—
—
—
—
—
—
—
—
1.15
—
Unit
V
µA
µA
V
mΩ
mΩ
S
pF
pF
pF
Ω
nC
nC
nC
ns
ns
ns
ns
V
ns
Test Conditions
I
D
= 10 mA, V
GS
= 0
V
GS
= ±20 V, V
DS
= 0
V
DS
= 30 V, V
GS
= 0
V
DS
= 10 V, I
D
= 1 mA
I
D
= 10 A, V
GS
= 10 V
Note4
I
D
= 10 A, V
GS
= 4.5 V
Note4
I
D
= 10 A, V
DS
= 10 V
Note4
V
DS
= 10 V
V
GS
= 0
f = 1 MHz
V
DD
= 10 V
V
GS
= 4.5 V
I
D
= 20 A
V
GS
= 10 V, I
D
= 10 A
V
DD
≅
10 V
R
L
= 1
Ω
Rg = 4.7
Ω
I
F
= 20 A, V
GS
= 0
Note4
I
F
=20 A, V
GS
= 0
di
F
/ dt = 100 A/
µs
REJ03G1658-0400 Rev.4.00 Aug 05, 2008
Page 2 of 6
RJK0368DPA
Main Characteristics
Power vs. Temperature Derating
40
1000
Maximum Safe Operation Area
Pch (W)
I
D
(A)
30
100
10
Channel Dissipation
1
10
PW = 10 ms
10
µ
s
m
20
Drain Current
s
0
µ
s
DC
O
tio
ra
pe
10
1
Operation in
this area is
limited by R
DS(on)
n
0
50
100
150
200
Tc = 25°C
0.1 1 shot Pulse
0.1
1
10
100
Case Temperature
Tc (°C)
Drain to Source Voltage
V
DS
(V)
Typical Output Characteristics
20
4.5 V
10 V
Pulse Test
20
Typical Transfer Characteristics
V
DS
= 10 V
Pulse Test
I
D
(A)
12
3.0 V
8
2.8 V
I
D
(A)
Drain Current
16
3.2 V
16
12
Drain Current
8
25°C
Tc = 75°C
–25°C
4
4
V
GS
= 2.6 V
0
2
4
6
8
10
0
1
2
3
4
5
Drain to Source Voltage
V
DS
(V)
Gate to Source Voltage
V
GS
(V)
Drain to Source Saturation Voltage vs.
Gate to Source Voltage
200
Static Drain to Source on State Resistance
vs. Drain Current
Drain to Source on State Resistance
R
DS (on)
(mΩ)
100
Pulse Test
Drain to Source Saturation Voltage
V
DS (on)
(mV)
Pulse Test
150
30
V
GS
= 4.5 V
10
10 V
100
I
D
= 10 A
5A
50
2A
3
0
4
8
12
16
20
1
1
3
10
30
100
300 1000
Gate to Source Voltage
V
GS
(V)
Drain Current
I
D
(A)
REJ03G1658-0400 Rev.4.00 Aug 05, 2008
Page 3 of 6
RJK0368DPA
Static Drain to Source on State Resistance
vs. Temperature
50
Pulse Test
10000
3000
Static Drain to Source on State Resistance
R
DS (on)
(mΩ)
Typical Capacitance vs.
Drain to Source Voltage
Capacitance C (pF)
40
10 A
I
D
= 2 A, 5 A
V
GS
= 4.5 V
1000
Ciss
300
100
30
V
GS
= 0
f = 1 MHz
10
20
Coss
Crss
30
30
20
10
10 V
0
–25
0
25
50
2 A, 5 A, 10 A
75
100 125 150
10
0
Case Temperature
Tc
(
°
C)
Drain to Source Voltage V
DS
(V)
Reverse Drain Current vs.
Source to Drain Voltage
V
GS
(V)
20
20
Dynamic Input Characteristics
V
DS
(V)
50
Reverse Drain Current I
DR
(A)
I
D
= 20 A
V
GS
16
V
DD
= 25 V
10 V
Pulse Test
10 V
16
5V
40
Drain to Source Voltage
30
V
DS
12
Gate to Source Voltage
12
20
8
8
V
GS
= 0, –5 V
10
V
DD
= 25 V
10 V
0
8
16
24
32
4
4
0
40
0
0
0.4
0.8
1.2
1.6
2.0
Gate Charge
Qg (nc)
Source to Drain Voltage V
SD
(V)
Maximum Avalanche Energy vs.
Channel Temperature Derating
Repetitive Avalanche Energy E
AR
(mJ)
20
I
AP
= 9 A
16
V
DD
= 15 V
duty < 0.1 %
Rg
≥
50
Ω
12
8
4
0
25
50
75
100
125
150
Channel Temperature Tch (°C)
REJ03G1658-0400 Rev.4.00 Aug 05, 2008
Page 4 of 6
RJK0368DPA
Normalized Transient Thermal Impedance vs. Pulse Width
Normalized Transient Thermal Impedance
γ
s (t)
3
Tc = 25°C
1
D=1
0.5
0.3
0.2
0.1
0.1
5
0.0
02
0.
01
0.
ul
se
θch
– c (t) =
γ
s (t) •
θch
– c
θch
– c = 5.0°C/W, Tc = 25°C
P
DM
PW
T
100
µ
1m
10 m
100 m
1
10
D=
PW
T
0.03
0.01
10
µ
1s
ho
tp
Pulse Width PW (s)
Avalanche Test Circuit
Avalanche Waveform
1
2
L
•
I
AP2
•
V
DSS
V
DSS
– V
DD
V
(BR)DSS
I
AP
V
DD
V
DS
V
DS
Monitor
L
I
AP
Monitor
E
AR
=
Rg
D. U. T
I
D
Vin
15 V
50
Ω
0
V
DD
Switching Time Test Circuit
Vin Monitor
D.U.T.
Rg
R
L
V
DS
= 10 V
Vin
Vout
Vin
10 V
Vout
Monitor
Switching Time Waveform
90%
10%
10%
10%
90%
td(on)
tr
90%
td(off)
tf
REJ03G1658-0400 Rev.4.00 Aug 05, 2008
Page 5 of 6
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