RJK0348DSP
Silicon N Channel Power MOS FET
Power Switching
REJ03G1644-0201
Rev.2.01
Apr 24, 2008
Features
Capable of 4.5 V gate drive
Low drive current
High density mounting
Low on-resistance
R
DS(on)
= 2.6 m
Ω
typ. (at V
GS
= 10 V)
•
Pb-free
•
•
•
•
Outline
RENESAS Package code: PRSP0008DD-D
(Package name: SOP-8<FP-8DAV>)
87
65
5 6 7 8
D D D D
3
12
4
4
G
1, 2, 3
Source
4
Gate
5, 6, 7, 8 Drain
S S S
1 2 3
Absolute Maximum Ratings
(Ta = 25°C)
Item
Drain to source voltage
Gate to source voltage
Drain current
Drain peak current
Body-drain diode reverse drain current
Avalanche current
Avalanche energy
Channel dissipation
Channel to ambient thermal impedance
Channel temperature
Storage temperature
Symbol
V
DSS
V
GSS
I
D
I
D(pulse)
I
DR
Note1
Ratings
30
±20
22
176
22
22
48.4
2.5
50
150
–55 to +150
Unit
V
V
A
A
A
A
mJ
W
°C/W
°C
°C
I
AP Note 2
E
AR Note 2
Pch
Note3
θch-a
Note3
Tch
Tstg
Notes: 1. PW
≤
10
µs,
duty cycle
≤
1%
2. Value at Tch = 25°C, Rg
≥
50
Ω
3. When using the glass epoxy board (FR4 40 x 40 x 1.6 mm), PW
≤
10s
REJ03G1644-0201 Rev.2.01 Apr 24, 2008
Page 1 of 6
RJK0348DSP
Electrical Characteristics
(Ta = 25°C)
Item
Drain to source breakdown voltage
Gate to source leak current
Zero gate voltage drain current
Gate to source cutoff voltage
Static drain to source on state
resistance
Forward transfer admittance
Input capacitance
Output capacitance
Reverse transfer capacitance
Gate Resistance
Total gate charge
Gate to source charge
Gate to drain charge
Turn-on delay time
Rise time
Turn-off delay time
Fall time
Body–drain diode forward voltage
Body–drain diode reverse recovery
time
Notes: 4. Pulse test
Symbol
V
(BR)DSS
I
GSS
I
DSS
V
GS(off)
R
DS(on)
R
DS(on)
|y
fs
|
Ciss
Coss
Crss
Rg
Qg
Qgs
Qgd
t
d(on)
t
r
t
d(off)
t
f
V
DF
t
rr
Min
30
—
—
1.2
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Typ
—
—
—
—
2.6
3.2
60
5100
980
315
1.4
34
12.5
7.0
13
5.8
69
10
0.78
35
Max
—
± 0.1
1
2.5
3.4
4.5
—
—
—
—
—
—
—
—
—
—
—
—
1.02
—
Unit
V
µA
µA
V
mΩ
mΩ
S
pF
pF
pF
Ω
nC
nC
nC
ns
ns
ns
ns
V
ns
Test Conditions
I
D
= 10 mA, V
GS
= 0
V
GS
= ±20 V, V
DS
= 0
V
DS
= 30 V, V
GS
= 0
V
DS
= 10 V, I
D
= 1 mA
I
D
= 11 A, V
GS
= 10 V
Note4
I
D
= 11 A, V
GS
= 4.5 V
Note4
I
D
= 11 A, V
DS
= 10 V
Note4
V
DS
= 10 V
V
GS
= 0
f = 1 MHz
V
DD
= 10 V
V
GS
= 4.5 V
I
D
= 22 A
V
GS
= 10 V, I
D
= 11 A
V
DD
≅
10 V
R
L
= 0.91
Ω
Rg = 4.7
Ω
I
F
= 22 A, V
GS
= 0
Note4
I
F
= 22 A, V
GS
= 0
di
F
/ dt = 100 A/
µs
REJ03G1644-0201 Rev.2.01 Apr 24, 2008
Page 2 of 6
RJK0348DSP
Main Characteristics
Power vs. Temperature Derating
4.0
Maximum Safe Operation Area
500
Channel Dissipation Pch (W)
I
D
(A)
3.0
Test Condition :
When using the glass epoxy board
(FR4 40x40x1.6 mm), PW
≤
10 s
10 µs
100
PW
1m
10
Drain Current
10
DC
2.0
Op
era
t
=1
0m
ion
(P
s
0µ
s
s
N
< 1
ote
0s
5
)
1
Operation in
this area is
limited by R
DS(on)
W
1.0
0.1
0.01
0.1 0.3
1
3
10 30 100
Drain to Source Voltage V
DS
(V)
Note 5 :
When using the glass epoxy board
(FR4 40x40x1.6 mm)
Ta = 25 °C
1 shot Pulse
0
50
100
150
200
Ambient Temperature Ta (°C)
Typical Output Characteristics
50
4.5 V
10 V
Typical Transfer Characteristics
50
V
DS
= 10 V
Pulse Test
Pulse Test
2.9 V
I
D
(A)
2.8 V
30
2.7 V
I
D
(A)
Drain Current
40
40
30
Drain Current
20
20
25°C
Tc = 75°C
–25°C
10
V
GS
= 2.6 V
10
0
2
4
6
8
10
0
1
2
3
4
5
Drain to Source Voltage
V
DS
(V)
Gate to Source Voltage
V
GS
(V)
Drain to Source Saturation Voltage vs.
Gate to Source Voltage
200
Static Drain to Source on State Resistance
vs. Drain Current
Drain to Source on State Resistance
R
DS (on)
(mΩ)
Drain to Source Saturation Voltage
V
DS (on)
(mV)
10
Pulse Test
Pulse Test
V
GS
= 4.5 V
3
10 V
150
100
1
50
I
D
= 20 A
10 A
5A
0.3
0
0.1
1
3
4
8
12
16
20
10
30
100
300 1000
Gate to Source Voltage
V
GS
(V)
Drain Current
I
D
(A)
REJ03G1644-0201 Rev.2.01 Apr 24, 2008
Page 3 of 6
RJK0348DSP
Static Drain to Source on State Resistance
vs. Temperature
10
Pulse Test
10000
3000
Ciss
Static Drain to Source on State Resistance
R
DS (on)
(mΩ)
Typical Capacitance vs.
Drain to Source Voltage
Capacitance C (pF)
8
1000
Coss
300
Crss
100
30
10
0
V
GS
= 0
f = 1 MHz
10
20
30
6
I
D
= 5 A, 10 A, 20 A
4
V
GS
= 4.5 V
2
0
–25
10 V
5 A, 10 A, 20 A
0
25
50
75
100 125 150
Case Temperature
Tc
(
°
C)
Drain to Source Voltage V
DS
(V)
Reverse Drain Current vs.
Source to Drain Voltage
V
GS
(V)
20
50
Dynamic Input Characteristics
V
DS
(V)
50
V
GS
16
Reverse Drain Current I
DR
(A)
I
D
= 22 A
V
DD
= 25 V
10 V
Pulse Test
10 V
40
5V
40
Drain to Source Voltage
30
V
DS
20
12
Gate to Source Voltage
30
8
20
V
GS
= 0, –5 V
10
V
DD
= 25 V
10 V
0
40
80
120
160
4
10
0
0
200
0
0.4
0.8
1.2
1.6
2.0
Gate Charge
Qg (nc)
Source to Drain Voltage V
SD
(V)
Maximum Avalanche Energy vs.
Channel Temperature Derating
Repetitive Avalanche Energy E
AR
(mJ)
100
I
AP
= 22 A
80
V
DD
= 15 V
duty < 0.1 %
Rg
≥
50
Ω
60
40
20
0
25
50
75
100
125
150
Channel Temperature Tch (°C)
REJ03G1644-0201 Rev.2.01 Apr 24, 2008
Page 4 of 6
RJK0348DSP
Normalized Transient Thermal Impedance vs. Pulse Width
Normalized Transient Thermal Impedance
γ
s (t)
10
1
D=1
0.5
0.2
0.1
0.1
0.05
0.02
0.01
0.01
θch
- f(t) =
γs
(t) x
θch
- f
θch
- f = 83.3°C/W, Ta = 25°C
When using the glass epoxy board
(FR4 40 x 40 x 1.6 mm)
lse
PDM
PW
T
0.001
1s
ho
u
tp
D=
PW
T
0.0001
10
µ
100
µ
1m
10 m
100 m
1
10
100
1000
10000
Pulse Width PW (s)
Avalanche Test Circuit
Avalanche Waveform
1
2
L
•
I
AP2
•
V
DSS
V
DSS
– V
DD
V
(BR)DSS
I
AP
V
DD
V
DS
V
DS
Monitor
L
I
AP
Monitor
E
AR
=
Rg
D. U. T
I
D
Vin
15 V
50
Ω
0
V
DD
Switching Time Test Circuit
Vin Monitor
D.U.T.
Rg
R
L
V
DS
= 10 V
Vin
Vout
Vin
10 V
Vout
Monitor
Switching Time Waveform
90%
10%
10%
10%
90%
td(on)
tr
90%
td(off)
tf
REJ03G1644-0201 Rev.2.01 Apr 24, 2008
Page 5 of 6
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