Serial Peripheral Interface 512K EEPROM (64-Kword 】 8-bit) Electrically Erasable and Programmable Read Only Memory
HN58X25512I | HN58X25512TI | HN58X25512FPI | |
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描述 | Serial Peripheral Interface 512K EEPROM (64-Kword 】 8-bit) Electrically Erasable and Programmable Read Only Memory | Serial Peripheral Interface 512K EEPROM (64-Kword 】 8-bit) Electrically Erasable and Programmable Read Only Memory | Serial Peripheral Interface 512K EEPROM (64-Kword 】 8-bit) Electrically Erasable and Programmable Read Only Memory |
零件包装代码 | - | TSSOP | SOIC |
包装说明 | - | TSSOP, | 5.30 X 5.65 MM, 1.27 MM PITCH, LEAD FREE, PLASTIC, SOP-8 |
针数 | - | 14 | 8 |
Reach Compliance Code | - | unknow | compli |
ECCN代码 | - | EAR99 | EAR99 |
最大时钟频率 (fCLK) | - | 5 MHz | 5 MHz |
JESD-30 代码 | - | R-PDSO-G14 | R-PDSO-G8 |
长度 | - | 5 mm | 5.65 mm |
内存密度 | - | 524288 bi | 524288 bi |
内存集成电路类型 | - | EEPROM | EEPROM |
内存宽度 | - | 8 | 8 |
功能数量 | - | 1 | 1 |
端子数量 | - | 14 | 8 |
字数 | - | 65536 words | 65536 words |
字数代码 | - | 64000 | 64000 |
工作模式 | - | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | - | 85 °C | 85 °C |
最低工作温度 | - | -40 °C | -40 °C |
组织 | - | 64KX8 | 64KX8 |
封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | - | TSSOP | SOP |
封装形状 | - | RECTANGULAR | RECTANGULAR |
封装形式 | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE |
并行/串行 | - | SERIAL | SERIAL |
认证状态 | - | Not Qualified | Not Qualified |
座面最大高度 | - | 1.1 mm | 1.73 mm |
串行总线类型 | - | SPI | SPI |
最大供电电压 (Vsup) | - | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | - | 1.8 V | 1.8 V |
标称供电电压 (Vsup) | - | 3.3 V | 3.3 V |
表面贴装 | - | YES | YES |
技术 | - | CMOS | CMOS |
温度等级 | - | INDUSTRIAL | INDUSTRIAL |
端子形式 | - | GULL WING | GULL WING |
端子节距 | - | 0.65 mm | 1.27 mm |
端子位置 | - | DUAL | DUAL |
宽度 | - | 4.4 mm | 5.3 mm |
最长写入周期时间 (tWC) | - | 5 ms | 5 ms |
Base Number Matches | - | 1 | 1 |
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