PKF 4000 I
3–7 W DC/DC Power Modules
48 V Input Series
• SMD and through-hole versions
with ultra low component height
8.0 mm (0.315 in)
• 83% efficiency (typ at 5V)
• 1,500 V dc isolation voltage
• MTBF > 4.9 million hours at
+50°C pin temperature (+40°C
ambient)
• Low EMI in conformance with class
A in CISPR 22 and FCC part 15J
Patents
US: D357901 DE: M94022763
The MacroDensÔ 3 –7 W PKF 4000 I series true com-
ponent level on-board DC/DC power modules are
intended as distributed power sources in decentralized
– 48 V and – 60 V DC power systems. Utilization of
thick film technology and a high degree of silicon
integration has made it possible to achieve a MTBF of
more than 4.9 million hours.
The high reliability and the very low height of these
DC/DC power modules makes them particularly
suited for Information Technology and Telecom
(IT&T) applications, with board spacing down to 15
mm or 0.6 in. The over-moulded rugged design
makes them also suitable for other demanding
industrial applications. They are optimized for free
convection cooling and have an operational ambient
temperature range in compliance with present and
future application needs, including non temperature
controlled environments. The mechanical design
offers the choice of surface mount or through-hole
versions, delivered in ready-to-use tubes, trays or tape
& reel package and compatibility with semi and fully
aqueous cleaning processes.
The PKF series is manufactured using highly auto-
mated manufacturing lines with a world-class quality
commitment and a five-year warranty.
Ericsson Microelectronics AB has been an ISO 9001
certified supplier since 1991.
For a complete product
program please reference the back cover.
E
General
Absolute Maximum Ratings
Characteristics
T
P
T
S
V
I
V
ISO
W
tr
V
RC
V
adj
Pin temperature at full output power
1)
Storage temperature
Continuous input voltage
2)
Isolation voltage
(input to output test voltage)
Transient input energy
3)
Remote control voltage pin 10, 11
Output adjust voltage pin 8, 9
–5
–5
min
–45
– 55
– 0.5
1,500
0.1
+ 40
+ 40
max
+95
+125
+ 75
Unit
°C
°C
V dc
V dc
Ws
V dc
V dc
Stress in excess of Absolute Maximum Rat-
ings may cause permanent damage. Absolute
Maximum Ratings, sometimes referred to as
no destruction limits, are normally tested
with one parameter at a time exceeding the
limits of Output data or Electrical Charac-
teristics. If exposed to stress above these
limits, function and performance may de-
grade in an unspecified manner.
Input
T
P
< T
P max
unless otherwise specified
NOTES
:
Characteristics
V
I
V
I off
V
I on
C
I
P
Ii
P
RC
Input voltage
range
2) 4)
Conditions
min
38
30
34.5
36.5
1.4
I
O
=0, T
P
= –30...+85°C
T
P
= –30... +85 °C,
RC connected to pin 17
(V
I
= 53 V)
(V
I
= 67 V)
(V
I
= 53 V)
(V
I
= 67 V)
25
30
130
170
typ
max
72
36
38
Unit
V
V
V
mF
2)
1)
Turn-off input voltage
(See typical characteristics)
Turn-on input voltage
(See typical characteristics)
Input capacitance
Input idling power
mW
Input stand-by power
mW
Environmental Characteristics
Characteristics
Vibration
(Sinusoidal)
JESD 22-B103
(IEC 68-2-6 F
c
)
3)
4)
Test procedure & conditions
Frequency
Amplitude
Acceleration
Number of cycles
Frequency
Acceleration density
spectrum
Duration
Reproducability
Peak acceleration
Shock duration
Temperature
Number of cycles
Temperature
Humidity
Duration
Temperature, solder
Duration
Duration
Temperature
Concentration
10…500 Hz
0.75 mm
10 g
10 in each axis
10…500 Hz
0.5 g
2
/Hz
10 min in 3 directions
medium (IEC 62-2-36)
200 g
3 ms
–40°C…+125°C
500
85°C
85% RH
1000 hours
260°C
10…13 s
96 h
35°C
5%
5)
T
P
, is defined as the maximum temperature
on the connection pins at the PB (Printed
Board) solder joint, mounted on a
5– 8 dm
2
(1 dm
2
=15.5 in
2
) multi-layer PB
(>4 layers), with 20 mm (0.8 in) board-pitch
and free convection cooling. Corresponding
ambient temperature range (T
A
) at full output
power is – 45…+85°C.
The input voltage range 38…72 V dc meets
the European Telecom Standard prETS
300 132-2 Nominal input voltage range in
48V and 60 Vdc power systems, –40.5…
–57.0V and –50.0... –72.0V respectively. At
input voltages exceeding 72V (abnormal
voltage) the power loss will be higher than at
normal input voltage and T
P
must be limited
to max +85°C. Absolute max continuous input
voltage is 75 Vdc. Output characteristics will
be marginally affected at input voltages
exceeding 72 V.
For more information see page 5.
The power modules will operate down to
V
I
£
36 V, when V
I
decreases, but will turn on
at V
I
£
38 V, when V
I
increases (see also
Operating information).
The test is applicable for through-hole versions.
Random
vibration
MIL-STD-883
Method 2026
(IEC 68-2-34 E
d
)
Shock
(Half sinus)
Temperature
change
Accelerated
damp heat
Solder
resistability
5)
Aggressive
environment
JESD 22-B104
(IEC 68-2-27 E
a
)
JESD 22-A104
(IEC 68-2-14 N
a
)
JESD 22-A101
(IEC 68-2-3 C
a
with bias)
JESD 22-B106
(IEC 68-2-20 T
b
1A)
IEC 68-2-11 K
a
2
EN/LZT 146 33 R1A (Replaces EN/LZT 137 09 R7) © Ericsson Microelectronics AB, June 2000
Mechanical Data
Through-hole version
Surface-mount version
Foot print Component side
Foot print Component side
1
2
3
4
5
6
7
8
9
5.0 [0.197]
40.0 [1.575]
3.6 [0.142]
Dimensions in mm (in)
24.0 [0.945]
29.6 [1.165]
18 17 16 15 14 13 12 11 10
2.8 [0.110]
Dimensions in mm (in)
Connections
Pin
1
2
3
4–6
7
8
9
10
11
12–16
17
18
Designation
Out 1
Rtn
Out 2
NC
Aux
V
adj
NOR
TOA
RC
NC
– In
+ In
Function
Output 1. Positive voltage ref. to Rtn.
Output return.
Output 2 (+ or –). Not connected in single output models.
Galvanically isolated from input pins.
Not connected.
Not connected.
Output voltage adjust. To set typical output voltage (V
O i
)
connect pin 8 to pin 9.
Connection of Nominal Output voltage Resistor. (See Operating
Information, Output Voltage Adjust).
Turn-on/off input voltage adjust (V
Ion
/V
Ioff
). Used to decrease the
turn-on/off input voltage threshold. (See Operating Information).
Remote control and turn-on/off input voltage adjust. Used to turn-on
and turn-off output and to set the turn-on/off input voltage threshold.
Not connected.
Negative input.
Positive input.
Weight
Maximum 20 g (0.71 oz).
Case
The case consists of semiconductor grade
epoxy with embedded pins.
Coefficient of thermal expansion (CTE) is
typ. 15 ppm/°C.
Connection Pins
Base material is copper (Cu), first plating is
nickel (Ni) and second (outer) plating is
palladium (Pd).
3
EN/LZT 146 33 R1A (Replaces EN/LZT 137 09 R7) © Ericsson Microelectronics AB, June 2000
Thermal Data
Two-parameter model
This model provides a more precise description of the thermal charac-
teristics to be used for thermal calculations.
Thermally the power module can be considered as a component and
the case temperature can be used to characterize the properties. The
thermal data for a power module with the substrate in contact with
the case can be described with two thermal resistances. One from case
to ambient air and one from case to PB (Printed circuit Board).
The thermal characteristics temperature can be calculated from the
following formula:
T
PB
= (T
C
–T
A
)×(R
th C–PB
+R
th C–A
)/R
th C–A
–P
d
×R
th C–PB
+T
A
Where:
dissipated power, calculated as P
O
×(l/h–1)
max average case temperature
ambient air temperature at the lower side of the power
module
temperature in the PB between the PKF connection pins
T
PB
:
R
th C-PB
: thermal resistance from case to PB under the power
module
R
th C-A
: thermal resistance from case to ambient air
v:
velocity of ambient air
R
th C-PB
is constant and R
th C-A
is dependent on the air velocity.
Free convection is equal to an air velocity of approx. 0.2 – 0.3 m/s.
See figure below.
P
d
:
T
C
:
T
A
:
Reflow Soldering Information
The PKF series of DC/DC power modules are manufactured in surface
mount technology. Extra precautions must therefore be taken when
reflow soldering the surface mount version. Neglecting the soldering
information given below may result in permanent damage or signifi-
cant degradation of power module performance.
The PKF series can be reflow soldered using IR, Natural Convection,
Forced Convection or Combined IR/Convection Technologies. The
high thermal mass of the component and its effect on
DT
(°C) requires
that particular attention be paid to other temperature sensitive com-
ponents.
IR Reflow technology may require the overall profile time to be ex-
tended to approximately 8–10 minutes to ensure an acceptable
DT.
Higher activity flux may be more suitable to overcome the increase in
oxidation and to avoid flux burn-up.
The general profile parameters detailed in the diagram, with this ex-
tended time to reach peak temperatures, would then be suitable.
Note!
These are maximum parameters. Depending on process varia-
tions, an appropriate margin must be added.
Palladium plating is used on the terminal pins. A pin temperature
(T
p
) in excess of the solder fusing temperature (+183°C for Sn/Pb
63/37) for more than 25 seconds and a peak temperature above
195°C, is required to guarantee a reliable solder joint.
Both pin 1 and pin 9 must be monitored.
No responsibility is assumed if these recommendations are not
strictly followed.
4
EN/LZT 146 33 R1A (Replaces EN/LZT 137 09 R7) © Ericsson Microelectronics AB, June 2000
Safety
The PKF Series DC/DC power modules are designed in accordance
with EN 60 950,
Safety of information technology equipment including
electrical business equipment.
SEMKO certificate no. 9709166.
The PKF power modules are recognized by UL and meet the applica-
ble requirements in UL 1950
Safety of information technology equipment,
the applicable Canadian safety requirements and UL 1012
Standard
for power supplies.
The DC/DC power module shall be installed in an end-use equip-
ment and considerations should be given to measuring the pin tem-
perature to comply with T
Pmax
when in operation. Abnormal compo-
nent tests are conducted with the input protected by an external 3 A
fuse. The need for repeating these tests in the end-use appliance shall
be considered if installed in a circuit having higher rated devices.
When the supply to the DC/DC power module meets all the require-
ments for SELV (<60 V dc), the output is considered to remain within
SELV limits (level 3). The isolation is an operational insulation in
accordance with EN 60 950.
The DC/DC power module is intended to be supplied by isolated
secondary circuitry and shall be installed in compliance with the
requirements of the ultimate application. If they are connected to a
60 V DC system reinforced insulation must be provided in the power
supply that isolates the input from the mains. Single fault testing in
the power supply must be performed in combination with the
DC/DC power module to demonstrate that the output meets the
requirement for SELV. One pole of the input and one pole of the
output is to be grounded or both are to be kept floating.
The terminal pins are only intended for connection to mating con-
nectors of internal wiring inside the end-use equipment.
These DC/DC power modules may be used in telephone equipment
in accordance with paragraph 34 A.1 of UL 1459 (Standard for Tele-
phone Equipment, second edition).
The galvanic isolation is verified in an electric strength test. Test
voltage (V
ISO
) between input and output is 1,500 V dc for 60 s. In
production the test duration may be decreased to 1 s.
The capacitor between input and output has a value of 1 nF and the
leakage current is less than 1µA @ 53 V dc.
The case is designed in non-conductive epoxy. Its flammability
rating meets UL 94V-0. The oxygen index is 34%
.
Dual output (negative output 2)
Dual output (positive output 2)
Typical input characteristics
HF Attenuation (input to output)
Transient input voltage
130
Electrical Data
Transient voltage
120
110
100
90
80
70
1
×
10
-6
Fundamental circuit diagrams
Single output
1
×
10
-4
1
×
10
-2
1
1
×
10
2
Transient duration (s)
Single voltage pulse at +25 °C ambient temperature.
EN/LZT 146 33 R1A (Replaces EN/LZT 137 09 R7) © Ericsson Microelectronics AB, June 2000
5
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