Two-wire serial interface 8k EEPROM (1-kword 】 8-bit)/16k EEPROM (2-kword 】 8-bit) 32k EEPROM (4-kword 】 8-bit)/64k EEPROM (8-kword 】 8-bit)
| 参数名称 | 属性值 |
| 厂商名称 | Renesas(瑞萨电子) |
| 零件包装代码 | SOIC |
| 包装说明 | 0.150 INCH, LEAD FREE, PLASTIC, SOP-8 |
| 针数 | 8 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 最大时钟频率 (fCLK) | 0.4 MHz |
| JESD-30 代码 | R-PDSO-G8 |
| 长度 | 4.89 mm |
| 内存密度 | 32768 bit |
| 内存集成电路类型 | EEPROM |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 字数 | 4096 words |
| 字数代码 | 4000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 4KX8 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 并行/串行 | SERIAL |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.73 mm |
| 串行总线类型 | I2C |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 1.8 V |
| 标称供电电压 (Vsup) | 2.5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 宽度 | 3.9 mm |
| 最长写入周期时间 (tWC) | 15 ms |
| Base Number Matches | 1 |

| HN58X2432FPIAGE | HN58X2408FPIAG | HN58X2408FPIAGE | HN58X2416FPIAGE | HN58X2464FPIAG | HN58X2464FPIAGE | HN58X2432 | HN58X2416 | HN58X2408 | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | Two-wire serial interface 8k EEPROM (1-kword 】 8-bit)/16k EEPROM (2-kword 】 8-bit) 32k EEPROM (4-kword 】 8-bit)/64k EEPROM (8-kword 】 8-bit) | Two-wire serial interface 8k EEPROM (1-kword 】 8-bit)/16k EEPROM (2-kword 】 8-bit) 32k EEPROM (4-kword 】 8-bit)/64k EEPROM (8-kword 】 8-bit) | Two-wire serial interface 8k EEPROM (1-kword 】 8-bit)/16k EEPROM (2-kword 】 8-bit) 32k EEPROM (4-kword 】 8-bit)/64k EEPROM (8-kword 】 8-bit) | Two-wire serial interface 8k EEPROM (1-kword 】 8-bit)/16k EEPROM (2-kword 】 8-bit) 32k EEPROM (4-kword 】 8-bit)/64k EEPROM (8-kword 】 8-bit) | Two-wire serial interface 8k EEPROM (1-kword 】 8-bit)/16k EEPROM (2-kword 】 8-bit) 32k EEPROM (4-kword 】 8-bit)/64k EEPROM (8-kword 】 8-bit) | Two-wire serial interface 8k EEPROM (1-kword 】 8-bit)/16k EEPROM (2-kword 】 8-bit) 32k EEPROM (4-kword 】 8-bit)/64k EEPROM (8-kword 】 8-bit) | Two-wire serial interface 8k EEPROM (1-kword 】 8-bit)/16k EEPROM (2-kword 】 8-bit) 32k EEPROM (4-kword 】 8-bit)/64k EEPROM (8-kword 】 8-bit) | Two-wire serial interface 8k EEPROM (1-kword 】 8-bit)/16k EEPROM (2-kword 】 8-bit) 32k EEPROM (4-kword 】 8-bit)/64k EEPROM (8-kword 】 8-bit) | Two-wire serial interface 8k EEPROM (1-kword 】 8-bit)/16k EEPROM (2-kword 】 8-bit) 32k EEPROM (4-kword 】 8-bit)/64k EEPROM (8-kword 】 8-bit) |
| 厂商名称 | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | - | - | - |
| 零件包装代码 | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC | - | - | - |
| 包装说明 | 0.150 INCH, LEAD FREE, PLASTIC, SOP-8 | SOP, | 0.150 INCH, LEAD FREE, PLASTIC, SOP-8 | 0.150 INCH, LEAD FREE, PLASTIC, SOP-8 | SOP, | 0.150 INCH, LEAD FREE, PLASTIC, SOP-8 | - | - | - |
| 针数 | 8 | 8 | 8 | 8 | 8 | 8 | - | - | - |
| Reach Compliance Code | compliant | compli | compli | compliant | compli | compli | - | - | - |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | - | - | - |
| 最大时钟频率 (fCLK) | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz | - | - | - |
| JESD-30 代码 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | - | - | - |
| 长度 | 4.89 mm | 4.9 mm | 4.89 mm | 4.89 mm | 4.9 mm | 4.89 mm | - | - | - |
| 内存密度 | 32768 bit | 8192 bi | 8192 bi | 16384 bit | 65536 bi | 65536 bi | - | - | - |
| 内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | - | - | - |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | - | - | - |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | - | - | - |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | - | - | - |
| 字数 | 4096 words | 1024 words | 1024 words | 2048 words | 8192 words | 8192 words | - | - | - |
| 字数代码 | 4000 | 1000 | 1000 | 2000 | 8000 | 8000 | - | - | - |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | - | - | - |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | - | - | - |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | - | - | - |
| 组织 | 4KX8 | 1KX8 | 1KX8 | 2KX8 | 8KX8 | 8KX8 | - | - | - |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | - | - |
| 封装代码 | SOP | SOP | SOP | SOP | SOP | SOP | - | - | - |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | - | - |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | - | - | - |
| 并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | - | - | - |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | - | - |
| 座面最大高度 | 1.73 mm | 1.75 mm | 1.73 mm | 1.73 mm | 1.75 mm | 1.73 mm | - | - | - |
| 串行总线类型 | I2C | I2C | I2C | I2C | I2C | I2C | - | - | - |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | - | - | - |
| 最小供电电压 (Vsup) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | - | - | - |
| 标称供电电压 (Vsup) | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | - | - | - |
| 表面贴装 | YES | YES | YES | YES | YES | YES | - | - | - |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | - | - | - |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - | - | - |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | - | - | - |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | - | - | - |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | - | - | - |
| 宽度 | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm | - | - | - |
| 最长写入周期时间 (tWC) | 15 ms | 15 ms | 15 ms | 15 ms | 15 ms | 15 ms | - | - | - |
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