Freescale Semiconductor
Technical Data
Document order number: MM908E626
Rev.4.0, 9/2008
Integrated Stepper Motor Driver
with Embedded MCU and LIN
Serial Communication
The 908E626 is an integrated single-package solution that includes
a high performance HC08 microcontroller with a
SMARTMOS
TM
analog control IC. The HC08 includes flash memory, a timer, enhanced
serial communications interface (ESCI), an analog-to-digital converter
(ADC), serial peripheral interface (SPI) (only internal), and an internal
clock generator (ICG) module. The analog control die provides fully
protected H-bridge outputs, voltage regulator, autonomous watchdog,
and local interconnect network (LIN) physical layer.
The single-package solution, together with LIN, provides optimal
application performance adjustments and space-saving PCB design. It
is well suited for the control of automotive stepper applications like
climate control and light-levelling.
Features
• High performance M68HC08EY16 core
• 16 K bytes of on-chip flash memory
• 512 bytes of RAM
• Internal clock generation module
• Two 16-bit, 2-channel timers
• 10-Bit Analog-to-Digital converter
• Four low R
DS(ON)
half-bridge outputs
• 13 microcontroller I/Os
• Pb-free packaging designated by suffix code EK
908E626
STEPPER MOTOR DRIVER
WITH EMBEDDED MCU AND LIN
DWB SUFFIX
EK SUFFIX (PB-FREE)
98ARL10519D
54-PIN SOICWB-EP
ORDERING INFORMATION
Device
MM908E626AVEK
MM908E626AVDWB
Temperature
Range (T
A
)
-40°C to 115°C
Package
54 SOICW
EP
908E626 Simplified Application Diagram
908E626
LIN
VREFH
VDDA
EVDD
VDD
VREFL
VSSA
EVSS
VSS
RST
RST_A
IRQ
IRQ_A
SS
PTB1/AD1
RXD
PTE1/RXD
PTD1/TACH1
FGEN
BEMF
PTD0/TACH0/BEMF
VSUP[1:3]
HB1
HB2
HB3
HB4
S
N
Bipolar
Step
Motor
HVDD
Switchable Internal
V
DD
Output
GND[1:2] EP
Port A I/Os
Port B I/Os
Port C I/Os
Microcontroller
Ports
Figure 1. 908E626 Simplified Application Diagram
* This document contains certain information on a new product.
Specifications and information herein are subject to change without notice.
© Freescale Semiconductor, Inc., 2005-2008. All rights reserved.
2
PTD0/TACH0
PTB1/AD1
VSUP1-3
BEMF
GND1-2
RST_A
IRQ_A
FGEN
SS
VREFL
PTD1/TACH1
PTE1/RXD
VSSA
RXD
RST
LIN
IRQ
Single Breakpoint
Break Module
Voltage
Regulator
PTE0/TXD
Switched VDD
Driver &
Diagnostic
TXD
LIN Physical
Layer
5-Bit Keyboard
Interrupt Module
2-channel Timer
Interface Module A
2-channel Timer
Interface Module B
Enhanced Serial
Communication
Interface Module
Computer Operating
Properly Module
PTC0/MISO
PTC1/MOSI
MOSI
SPSCK
BEMF
FGEN
Half Bridge
Driver &
Diagnostic
Autonomous
Watchdog
Chip Temp
VSUP
Prescaler
BEMF
BEMF
FGEN
Half Bridge
Driver &
Diagnostic
VSUP
HB4
PTA5/SPSCK
MISO
BEMF
FGEN
Half Bridge
Driver &
Diagnostic
VSUP
HB3
SPI
&
CONTROL
Serial Peripheral
Interface Module
Configuration
Register Module
Periodic Wake-up
Timebase Module
Arbiter Module
Prescaler Module
BEMF Module
SS
Interrupt
Control
Module
FGEN
Half Bridge
Driver &
Diagnostic
VSUP
HB2
VSUP
HB1
Reset
Control
Module
VSS
VDD
HVDD
Internal Bus
PORT C
DDRC
DDRA
PORT A
PTC4/OSC1
PTC3/OSC2
PTC2/MCLK
PTC1/MOSI
PTC0/MISO
PTD1/TACH1
PTB0/AD0
PTD0/TACH0
PTE1/RXD
PTE0/TXD
Analog Die
ADOUT
Analog
Multiplexer
PORT D PORT E
DDRD
DDRE
DDRB
PORT B
908E626
VREFH
VDDA
M68HC08 CPU
CPU
ALU
Registers
EVDD
EVSS
PTA0/KBD0
Control and Status
Register, 64 Bytes
User Flash, 15,872 Bytes
User RAM, 512 Bytes
Monitor ROM, 310 Bytes
Flash programming
(Burn-in), 1024 Bytes
PTA1/KBD1
User Flash Vector
Space, 36 Bytes
PTA2/KBD2
OSC2 Internal Clock
OSC1 Generator Module
PTA3/KBD3
RST
PTA4/KBD4
24 Integral System
Integration Module
IRQ
PTB3/AD3
Single External
IRQ Module
PTB4/AD4
PTB5/AD5
VREFH
VDDA 10 Bit Analog-to-
VREFL Digital Converter
Module
VSSA
VDD
POWER
VSS
PTB6/AD6/TBCH0
Power-ON
Reset Module
PTB7/AD7/TBCH1
Security Module
Figure 2. Figure 1. 908E626 Simplified Internal Block Diagram
PTC2/MCLK
PTC3/OSC2
PTC4/OSC1
Analog Integrated Circuit Device Data
Freescale Semiconductor
FLSVPP
PTA6/SS
PTA5/SPSCK
PTA4/KBD4
PTA3/KBD3
PTA2/KBD2
PTA1/KBD1
PTA0/KBD0
PTB7/AD7/TBCH1
PTB6/AD6/TBCH0
PTB5/AD5
PTB4/AD4
PTB3/AD3
PTB2/AD2
PTB0/AD0
MCU Die PTB0/AD0
PIN CONNECTIONS
PIN CONNECTIONS
Transparent Top
View of Package
PTB7/AD7/TBCH1
PTB6/AD6/TBCH0
PTC4/OSC1
PTC3/OSC2
PTC2/MCLK
PTB5/AD5
PTB4/AD4
PTB3/AD3
IRQ
RST
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
54
53
52
51
50
49
48
47
46
45
44
43
42
PTB1/AD1
PTD0/TACH0/BEMF
PTD1/TACH1
NC
FGEN
BEMF
RST_A
IRQ_A
SS
Exposed
Pad
41
40
39
38
37
36
35
34
33
32
31
30
29
28
LIN
NC
NC
HB1
VSUP1
GND1
HB2
VSUP2
PTA0/KBD0
PTA1/KBD1
PTA2/KBD2
FLSVPP
PTA3/KBD3
PTA4/KBD4
VREFH
VDDA
EVDD
EVSS
VSSA
VREFL
PTE1/RXD
RXD
VSS
NC
VDD
NC
NC
NC
HVDD
NC
HB4
VSUP3
GND2
HB3
NC
Figure 3. 908E626 Pin Connections
Table 1. 908E626 PIN DEFINITIONS
A functional description of each pin can be found in the Functional Pin Description section beginning on
page 14.
Die
MCU
Pin
1
2
6
7
8
11
3
4
5
9
10
12
13
Pin Name
PTB7/AD7/TBCH1
PTB6/AD6/TBCH0
PTB5/AD5
PTB4/AD4
PTB3/AD3
PTB1/AD1
PTC4/OSC1
PTC3/OSC2
PTC2/MCLK
IRQ
RST
PTD0/TACH0/BEMF
PTD1/TACH1
Formal Name
Port B I/Os
Definition
These pins are special function, bidirectional I/O port pins that are
shared with other functional modules in the MCU.
MCU
Port C I/Os
These pins are special function, bidirectional I/O port pins that are
shared with other functional modules in the MCU.
This pin is an asynchronous external interrupt input pin.
This pin is bidirectional, allowing a reset of the entire system. It is
driven low when any internal reset source is asserted.
These pins are special function, bidirectional I /O port pins that are
shared with other functional modules in the MCU.
MCU
MCU
MCU
External Interrupt
Input
External Reset
Port D I /Os
908E626
Analog Integrated Circuit Device Data
Freescale Semiconductor
3
PIN CONNECTIONS
Table 1. 908E626 PIN DEFINITIONS
A functional description of each pin can be found in the Functional Pin Description section beginning on
page 14.
Die
–
Pin
14, 21, 22,
28, 33, 35,
36, 37, 39
42
43
48
44
47
45
46
49
50
52
53
54
51
15
16
17
18
19
20
23
26
29
32
24
27
31
25
30
34
38
40
41
EP
Pin Name
NC
Formal Name
No Connect
Not connected.
Definition
MCU
MCU
MCU
MCU
MCU
PTE1/ RXD
VREFL
VREFH
VSSA
VDDA
EVSS
EVDD
PTA4/KBD4
PTA3/KBD3
PTA2/KBD2
PTA1/KBD1
PTA0/KBD0
FLSVPP
FGEN
BEMF
RST_A
IRQ_A
Port E I /O
ADC References
ADC Supply Pins
MCU Power Supply
Pins
Port A I /Os
This pin is a special function, bidirectional I/O port pin that can is
shared with other functional modules in the MCU.
These pins are the reference voltage pins for the analog-to-digital
converter (ADC).
These pins are the power supply pins for the analog-to-digital
converter.
These pins are the ground and power supply pins, respectively. The
MCU operates from a single power supply.
These pins are special function, bidirectional I/O port pins that are
shared with other functional modules in the MCU.
MCU
Analog
Analog
Analog
Analog
Analog
Analog
Analog
Test Pin
Current Limitation
Frequency Input
Back Electromagnetic
Force Output
Internal Reset
Internal Interrupt
Output
Slave Select
LIN Bus
Half-bridge Outputs
For test purposes only. Do not connect in the application.
This is the input pin for the half-bridge current limitation PWM
frequency.
This pin gives the user information about back electromagnetic force
(BEMF).
This pin is the bidirectional reset pin of the analog die.
This pin is the interrupt output pin of the analog die indicating errors
or wake-up events.
This pin is the SPI slave select pin for the analog chip.
This pin represents the single-wire bus transmitter and receiver.
This device includes power MOSFETs configured as four half-bridge
driver outputs. These outputs may be configured for step motor
drivers, DC motor drivers, or as high side and low side switches.
These pins are device power supply pins.
SS
LIN
HB1
HB2
HB3
HB4
VSUP1
VSUP2
VSUP3
GND1
GND2
HVDD
VDD
VSS
RXD
Exposed Pad
Analog
Power Supply Pins
Analog
Analog
Analog
Analog
Analog
–
Power Ground Pins
Switchable V
DD
Output
Voltage Regulator
Output
Voltage Regulator
Ground
LIN Transceiver
Output
Exposed Pad
These pins are device power ground connections.
This pin is a switchable V
DD
output for driving resistive loads
requiring a regulated 5.0V supply; e.g., 3 pin Hall-effect sensors.
The + 5.0V voltage regulator output pin is intended to supply the
embedded microcontroller.
Ground pin for the connection of all non-power ground connections
(microcontroller and sensors).
This pin is the output of LIN transceiver.
The exposed pad pin on the bottom side of the package conducts
heat from the chip to the PCB board.
908E626
4
Analog Integrated Circuit Device Data
Freescale Semiconductor
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. MAXIMUM RATINGS
All voltages are with respect to ground unless otherwise noted. Exceeding limits on any pin may cause permanent damage to
the device.
Rating
ELECTRICAL RATINGS
Supply Voltage
Analog Chip Supply Voltage under Normal Operation (Steady-
state)
Analog Chip Supply Voltage under Transient Conditions
(1)
Microcontroller Chip Supply Voltage
Input Pin Voltage
Analog Chip
Microcontroller Chip
Maximum Microcontroller Current per Pin
All Pins Except VDD, VSS, PTA0 : PTA6, PTC0 : PTC1
Pins PTA0 : PTA6, PTC0 : PTC1
Maximum Microcontroller V
SS
Output Current
Maximum Microcontroller V
DD
Input Current
LIN Supply Voltage
Normal Operation (Steady-state)
Transient Conditions
(1)
ESD Voltage
Human Body Model
(2)
Machine Model
(3)
Charge Device Model
(4)
THERMAL RATINGS
Storage Temperature
Operating Case Temperature
(5)
Operating Junction Temperature
(6)
Peak Package Reflow Temperature During Solder Mounting
(7)
T
STG
T
C
T
J
T
SOLDER
- 40 to 150
- 40 to 115
- 40 to 135
245
°C
°C
°C
°C
V
ESD1
V
ESD2
V
ESD3
± 3000
± 150
± 500
V
BUS(SS)
V
BUS(DYNAMIC)
-18 to 28
40
V
I
PIN
(1)
I
PIN
(2)
I
MVSS
I
MVDD
±15
± 25
100
100
mA
mA
V
V
IN
(ANALOG)
V
IN
(MCU)
- 0.3 to 5.5
V
SS
- 0.3 to V
DD
+ 0.3
mA
V
V
SUP(
SS
)
V
SUP(
PK
)
V
DD
- 0.3 to 28
- 0.3 to 40
- 0.3 to 6.0
V
Symbol
Value
Unit
Notes
1. Transient capability for pulses with a time of t < 0.5 sec.
2. ESD1 testing is performed in accordance with the Human Body Model (C
ZAP
= 100pF, R
ZAP
= 1500Ω).
3.
4.
5.
6.
7.
ESD2 testing is performed in accordance with the Machine Model (C
ZAP
= 200pF, R
ZAP
= 0Ω).
ESD3 testing is performed in accordance with Charge Device Model, robotic (C
ZAP
= 4.0pF).
The limiting factor is junction temperature, taking into account the power dissipation, thermal resistance, and heat sinking.
The temperature of analog and MCU die is strongly linked via the package, but can differ in dynamic load conditions, usually because
of higher power dissipation on the analog die. The analog die temperature must not exceed 150°C under these conditions
Pin soldering temperature is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
908E626
Analog Integrated Circuit Device Data
Freescale Semiconductor
5
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