EE PLD, 30ns, PLS-Type, CMOS, PQCC28, PLASTIC, LCC-28
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
零件包装代码 | QLCC |
包装说明 | QCCJ, LDCC28,.5SQ |
针数 | 28 |
Reach Compliance Code | compliant |
ECCN代码 | EAR99 |
其他特性 | PAL WITH MACROCELLS; 38 MACROCELLS; 2 EXTERNAL CLOCKS; INPUT MACROCELLS; BURIED MACROCELLS |
架构 | PLS-TYPE |
最大时钟频率 | 27 MHz |
JESD-30 代码 | S-PQCC-J28 |
JESD-609代码 | e0 |
长度 | 11.5062 mm |
湿度敏感等级 | 1 |
专用输入次数 | 10 |
I/O 线路数量 | 10 |
输入次数 | 20 |
输出次数 | 10 |
产品条款数 | 75 |
端子数量 | 28 |
最高工作温度 | 75 °C |
最低工作温度 | |
组织 | 10 DEDICATED INPUTS, 10 I/O |
输出函数 | MACROCELL |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | QCCJ |
封装等效代码 | LDCC28,.5SQ |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER |
电源 | 5 V |
可编程逻辑类型 | EE PLD |
传播延迟 | 30 ns |
认证状态 | Not Qualified |
座面最大高度 | 4.57 mm |
最大供电电压 | 5.25 V |
最小供电电压 | 4.75 V |
标称供电电压 | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL EXTENDED |
端子面层 | Tin/Lead (Sn85Pb15) |
端子形式 | J BEND |
端子节距 | 1.27 mm |
端子位置 | QUAD |
宽度 | 11.5062 mm |
Base Number Matches | 1 |
GAL6001-30J | GAL6001-35P | GAL6001-35J | GAL6001-30P | |
---|---|---|---|---|
描述 | EE PLD, 30ns, PLS-Type, CMOS, PQCC28, PLASTIC, LCC-28 | EE PLD, 35ns, PLS-Type, CMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24 | EE PLD, 35ns, PLS-Type, CMOS, PQCC28, PLASTIC, LCC-28 | EE PLD, 30ns, PLS-Type, CMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 |
零件包装代码 | QLCC | DIP | QLCC | DIP |
包装说明 | QCCJ, LDCC28,.5SQ | DIP, DIP24,.3 | QCCJ, LDCC28,.5SQ | 0.300 INCH, PLASTIC, DIP-24 |
针数 | 28 | 24 | 28 | 24 |
Reach Compliance Code | compliant | not_compliant | compliant | not_compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
其他特性 | PAL WITH MACROCELLS; 38 MACROCELLS; 2 EXTERNAL CLOCKS; INPUT MACROCELLS; BURIED MACROCELLS | PAL WITH MACROCELLS; 38 MACROCELLS; 2 EXTERNAL CLOCKS; INPUT MACROCELLS; BURIED MACROCELLS | PAL WITH MACROCELLS; 38 MACROCELLS; 2 EXTERNAL CLOCKS; INPUT MACROCELLS; BURIED MACROCELLS | PAL WITH MACROCELLS; 38 MACROCELLS; 2 EXTERNAL CLOCKS; INPUT MACROCELLS; BURIED MACROCELLS |
架构 | PLS-TYPE | PLS-TYPE | PLS-TYPE | PLS-TYPE |
最大时钟频率 | 27 MHz | 22.9 MHz | 22.9 MHz | 27 MHz |
JESD-30 代码 | S-PQCC-J28 | R-PDIP-T24 | S-PQCC-J28 | R-PDIP-T24 |
JESD-609代码 | e0 | e0 | e0 | e0 |
长度 | 11.5062 mm | 31.855 mm | 11.5062 mm | 31.855 mm |
专用输入次数 | 10 | 10 | 10 | 10 |
I/O 线路数量 | 10 | 10 | 10 | 10 |
输入次数 | 20 | 20 | 20 | 20 |
输出次数 | 10 | 10 | 10 | 10 |
产品条款数 | 75 | 75 | 75 | 75 |
端子数量 | 28 | 24 | 28 | 24 |
最高工作温度 | 75 °C | 75 °C | 75 °C | 75 °C |
组织 | 10 DEDICATED INPUTS, 10 I/O | 10 DEDICATED INPUTS, 10 I/O | 10 DEDICATED INPUTS, 10 I/O | 10 DEDICATED INPUTS, 10 I/O |
输出函数 | MACROCELL | MACROCELL | MACROCELL | MACROCELL |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | QCCJ | DIP | QCCJ | DIP |
封装等效代码 | LDCC28,.5SQ | DIP24,.3 | LDCC28,.5SQ | DIP24,.3 |
封装形状 | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR |
封装形式 | CHIP CARRIER | IN-LINE | CHIP CARRIER | IN-LINE |
电源 | 5 V | 5 V | 5 V | 5 V |
可编程逻辑类型 | EE PLD | EE PLD | EE PLD | EE PLD |
传播延迟 | 30 ns | 35 ns | 35 ns | 30 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 4.57 mm | 4.57 mm | 4.57 mm | 4.57 mm |
最大供电电压 | 5.25 V | 5.25 V | 5.25 V | 5.25 V |
最小供电电压 | 4.75 V | 4.75 V | 4.75 V | 4.75 V |
标称供电电压 | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | NO | YES | NO |
技术 | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED |
端子面层 | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) |
端子形式 | J BEND | THROUGH-HOLE | J BEND | THROUGH-HOLE |
端子节距 | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm |
端子位置 | QUAD | DUAL | QUAD | DUAL |
宽度 | 11.5062 mm | 7.62 mm | 11.5062 mm | 7.62 mm |
Base Number Matches | 1 | 1 | 1 | 1 |
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