EE PLD, 15ns, PAL-Type, CMOS, PQCC28, PLASTIC, LCC-28
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
零件包装代码 | QLCC |
包装说明 | PLASTIC, LCC-28 |
针数 | 28 |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
其他特性 | PAL WITH MACROCELLS; 10 MACROCELLS; REGISTER PRELOAD; POWER-UP RESET |
架构 | PAL-TYPE |
最大时钟频率 | 45 MHz |
JESD-30 代码 | S-PQCC-J28 |
JESD-609代码 | e0 |
长度 | 11.5062 mm |
湿度敏感等级 | 1 |
专用输入次数 | 10 |
I/O 线路数量 | 10 |
输入次数 | 20 |
输出次数 | 10 |
产品条款数 | 80 |
端子数量 | 28 |
最高工作温度 | 75 °C |
最低工作温度 | |
组织 | 10 DEDICATED INPUTS, 10 I/O |
输出函数 | MACROCELL |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | QCCJ |
封装等效代码 | LDCC28,.5SQ |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER |
电源 | 5 V |
可编程逻辑类型 | EE PLD |
传播延迟 | 15 ns |
认证状态 | Not Qualified |
座面最大高度 | 4.57 mm |
最大供电电压 | 5.25 V |
最小供电电压 | 4.75 V |
标称供电电压 | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL EXTENDED |
端子面层 | Tin/Lead (Sn85Pb15) |
端子形式 | J BEND |
端子节距 | 1.27 mm |
端子位置 | QUAD |
宽度 | 11.5062 mm |
Base Number Matches | 1 |
GAL20RA10-15LJ | GAL20RA10-15LP | GAL20RA10-20LJI | GAL20RA10-20LJ | GAL20RA10-20LPI | GAL20RA10-20LP | GAL20RA10-30LJ | GAL20RA10-30LP | |
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描述 | EE PLD, 15ns, PAL-Type, CMOS, PQCC28, PLASTIC, LCC-28 | EE PLD, 15ns, PAL-Type, CMOS, PDIP24, PLASTIC, DIP-24 | EE PLD, 20ns, PAL-Type, CMOS, PQCC28, PLASTIC, LCC-28 | EE PLD, 20ns, PAL-Type, CMOS, PQCC28, PLASTIC, LCC-28 | EE PLD, 20ns, PAL-Type, CMOS, PDIP24, PLASTIC, DIP-24 | EE PLD, 20ns, PAL-Type, CMOS, PDIP24, PLASTIC, DIP-24 | EE PLD, 30ns, PAL-Type, CMOS, PQCC28, PLASTIC, LCC-28 | EE PLD, 30ns, PAL-Type, CMOS, PDIP24, PLASTIC, DIP-24 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
零件包装代码 | QLCC | DIP | QLCC | QLCC | DIP | DIP | QLCC | DIP |
包装说明 | PLASTIC, LCC-28 | PLASTIC, DIP-24 | PLASTIC, LCC-28 | PLASTIC, LCC-28 | PLASTIC, DIP-24 | PLASTIC, DIP-24 | PLASTIC, LCC-28 | PLASTIC, DIP-24 |
针数 | 28 | 24 | 28 | 28 | 24 | 24 | 28 | 24 |
Reach Compliance Code | unknown | not_compliant | unknown | unknown | not_compliant | not_compliant | unknown | not_compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
其他特性 | PAL WITH MACROCELLS; 10 MACROCELLS; REGISTER PRELOAD; POWER-UP RESET | PAL WITH MACROCELLS; 10 MACROCELLS; REGISTER PRELOAD; POWER-UP RESET | PAL WITH MACROCELLS; 10 MACROCELLS; REGISTER PRELOAD; POWER-UP RESET | PAL WITH MACROCELLS; 10 MACROCELLS; REGISTER PRELOAD; POWER-UP RESET | PAL WITH MACROCELLS; 10 MACROCELLS; REGISTER PRELOAD; POWER-UP RESET | PAL WITH MACROCELLS; 10 MACROCELLS; REGISTER PRELOAD; POWER-UP RESET | PAL WITH MACROCELLS; 10 MACROCELLS; REGISTER PRELOAD; POWER-UP RESET | PAL WITH MACROCELLS; 10 MACROCELLS; REGISTER PRELOAD; POWER-UP RESET |
架构 | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE |
最大时钟频率 | 45 MHz | 45 MHz | 33.3 MHz | 33.3 MHz | 33.3 MHz | 33.3 MHz | 20 MHz | 20 MHz |
JESD-30 代码 | S-PQCC-J28 | R-PDIP-T24 | S-PQCC-J28 | S-PQCC-J28 | R-PDIP-T24 | R-PDIP-T24 | S-PQCC-J28 | R-PDIP-T24 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
长度 | 11.5062 mm | 31.855 mm | 11.5062 mm | 11.5062 mm | 31.855 mm | 31.855 mm | 11.5062 mm | 31.855 mm |
专用输入次数 | 10 | 10 | 10 | 10 | 10 | 10 | 10 | 10 |
I/O 线路数量 | 10 | 10 | 10 | 10 | 10 | 10 | 10 | 10 |
输入次数 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
输出次数 | 10 | 10 | 10 | 10 | 10 | 10 | 10 | 10 |
产品条款数 | 80 | 80 | 80 | 80 | 80 | 80 | 80 | 80 |
端子数量 | 28 | 24 | 28 | 28 | 24 | 24 | 28 | 24 |
最高工作温度 | 75 °C | 75 °C | 85 °C | 75 °C | 85 °C | 75 °C | 75 °C | 75 °C |
组织 | 10 DEDICATED INPUTS, 10 I/O | 10 DEDICATED INPUTS, 10 I/O | 10 DEDICATED INPUTS, 10 I/O | 10 DEDICATED INPUTS, 10 I/O | 10 DEDICATED INPUTS, 10 I/O | 10 DEDICATED INPUTS, 10 I/O | 10 DEDICATED INPUTS, 10 I/O | 10 DEDICATED INPUTS, 10 I/O |
输出函数 | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | QCCJ | DIP | QCCJ | QCCJ | DIP | DIP | QCCJ | DIP |
封装等效代码 | LDCC28,.5SQ | DIP24,.3 | LDCC28,.5SQ | LDCC28,.5SQ | DIP24,.3 | DIP24,.3 | LDCC28,.5SQ | DIP24,.3 |
封装形状 | SQUARE | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR |
封装形式 | CHIP CARRIER | IN-LINE | CHIP CARRIER | CHIP CARRIER | IN-LINE | IN-LINE | CHIP CARRIER | IN-LINE |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
可编程逻辑类型 | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD |
传播延迟 | 15 ns | 15 ns | 20 ns | 20 ns | 20 ns | 20 ns | 30 ns | 30 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 4.57 mm | 4.57 mm | 4.57 mm | 4.57 mm | 4.57 mm | 4.57 mm | 4.57 mm | 4.57 mm |
最大供电电压 | 5.25 V | 5.25 V | 5.5 V | 5.25 V | 5.5 V | 5.25 V | 5.25 V | 5.25 V |
最小供电电压 | 4.75 V | 4.75 V | 4.5 V | 4.75 V | 4.5 V | 4.75 V | 4.75 V | 4.75 V |
标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | NO | YES | YES | NO | NO | YES | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | INDUSTRIAL | COMMERCIAL EXTENDED | INDUSTRIAL | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED |
端子面层 | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) |
端子形式 | J BEND | THROUGH-HOLE | J BEND | J BEND | THROUGH-HOLE | THROUGH-HOLE | J BEND | THROUGH-HOLE |
端子节距 | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm |
端子位置 | QUAD | DUAL | QUAD | QUAD | DUAL | DUAL | QUAD | DUAL |
宽度 | 11.5062 mm | 7.62 mm | 11.5062 mm | 11.5062 mm | 7.62 mm | 7.62 mm | 11.5062 mm | 7.62 mm |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
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