Delay Line, 1-Func, 5-Tap, Hybrid, PDSO8
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 包装说明 | SOP, GWDIP8,.4 |
| Reach Compliance Code | unknown |
| JESD-30 代码 | R-PDSO-G8 |
| JESD-609代码 | e0 |
| 功能数量 | 1 |
| 抽头/阶步数 | 5 |
| 端子数量 | 8 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | GWDIP8,.4 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 电源 | 5 V |
| 最大电源电流（ICC） | 75 mA |
| 可编程延迟线 | NO |
| Prop。Delay @ Nom-Sup | 50 ns |
| 认证状态 | Not Qualified |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | HYBRID |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| Base Number Matches | 1 |
| SMT08CA500 | SMT08CA250 | SMT08CA501 | ST08CB101 | ST08CB250 | ST08CB251 | ST08CB501 | |
|---|---|---|---|---|---|---|---|
| 描述 | Delay Line, 1-Func, 5-Tap, Hybrid, PDSO8 | Delay Line, 1-Func, 5-Tap, Hybrid, PDSO8 | Delay Line, 1-Func, 5-Tap, Hybrid, PDSO8 | Delay Line, 1-Func, 5-Tap, Hybrid, PDIP8 | Delay Line, 1-Func, 5-Tap, Hybrid | Delay Line, 1-Func, 5-Tap, Hybrid | Delay Line, 1-Func, 5-Tap, Hybrid |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 包装说明 | SOP, GWDIP8,.4 | SOP, GWDIP8,.4 | SOP, GWDIP8,.4 | DIP, DIP8,.3 | , SIP8,.06 | , SIP8,.06 | , SIP8,.06 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 抽头/阶步数 | 5 | 5 | 5 | 5 | 5 | 5 | 5 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装等效代码 | GWDIP8,.4 | GWDIP8,.4 | GWDIP8,.4 | DIP8,.3 | SIP8,.06 | SIP8,.06 | SIP8,.06 |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 最大电源电流（ICC） | 75 mA | 75 mA | 75 mA | 150 mA | 75 mA | 75 mA | 75 mA |
| 可编程延迟线 | NO | NO | NO | NO | NO | NO | NO |
| Prop。Delay @ Nom-Sup | 50 ns | 25 ns | 500 ns | 100 ns | 25 ns | 250 ns | 500 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | NO | NO | NO | NO |
| 技术 | HYBRID | HYBRID | HYBRID | HYBRID | HYBRID | HYBRID | HYBRID |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | SINGLE | SINGLE | SINGLE |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| JESD-30 代码 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDIP-T8 | - | - | - |
| 封装代码 | SOP | SOP | SOP | DIP | - | - | - |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | - | - |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | - | - | - |
| 端子形式 | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | - | - | - |
电子竞赛
FPGA/CPLD
Microchip MCU
DSP 与 ARM 处理器
FPGA/CPLD
DSP 与 ARM 处理器
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
