D ts e t
aa h e
R c e t r lc r nc
o h se Ee to is
Ma u a t r dCo o e t
n fc u e
mp n n s
R c e tr b a d d c mp n ns ae
o h se rn e
o oet r
ma ua trd u ig ete dewaes
n fcue sn i r i/ fr
h
p rh s d f m te oiia s p l r
uc a e r
o h r n l u pi s
g
e
o R c e tr waes rce td f m
r o h se
fr e rae r
o
te oiia I. Al rce t n ae
h
r nl P
g
l e rai s r
o
d n wi tea p o a o teOC
o e t h p rv l f h
h
M.
P r aetse u igoiia fcoy
at r e td sn r n la tr
s
g
ts p o rmso R c e tr e eo e
e t rga
r o h se d v lp d
ts s lt n t g aa te p o u t
e t oui s o u rne
o
rd c
me t o e c e teOC d t s e t
es r x e d h
M aa h e.
Qu l yOv riw
ai
t
e ve
• IO- 0 1
S 90
•A 92 cr ct n
S 1 0 et ai
i
o
• Qu l e Ma ua trr Ls (
ai d
n fcues it QML MI- R -
) LP F
385
53
•C a sQ Mitr
ls
lay
i
•C a sVS a eL v l
ls
p c ee
• Qu l e S p l r Ls o D sr uos( L )
ai d u pi s it f it b tr QS D
e
i
•R c e trsacic l u pir oD A a d
o h se i
r ia s p l t L n
t
e
me t aln u t a dD A sa d r s
es lid sr n L tn ad .
y
R c e tr lcrnc , L i c mmi e t
o h se Ee t is L C s o
o
tdo
t
s p ligp o u t ta s t f c so r x e t-
u pyn rd cs h t ai y u tme e p ca
s
t n fr u lya daee u loto eoiial
i s o q ai n r q a t h s r n l
o
t
g
y
s p l db id sr ma ua trr.
u pi
e yn ut
y n fcues
T eoiia ma ua trr d ts e t c o a yn ti d c me t e e t tep r r n e
h r n l n fcue’ aa h e a c mp n ig hs o u n r cs h ef ma c
g
s
o
a ds e ic t n o teR c e tr n fcue v rino ti d vc . o h se Ee t n
n p c ai s f h o h se ma ua trd eso f hs e ie R c e tr lcr -
o
o
isg aa te tep r r n eo i s mio d co p o u t t teoiia OE s e ic -
c u rne s h ef ma c ft e c n u tr rd cs o h r n l M p c a
o
s
g
t n .T pc lv le aefr eee c p r o e o l. eti mii m o ma i m rt g
i s ‘y ia’ au s r o rfrn e up s s ny C r n nmu
o
a
r xmu ai s
n
ma b b s do p o u t h rceiain d sg , i lt n o s mpetsig
y e a e n rd c c aa tr t , e in smuai , r a l e t .
z o
o
n
© 2 1 R cetr l t n s LC Al i t R sre 0 1 2 1
0 3 ohs E cr i , L . lRg s eevd 7 1 0 3
e e oc
h
T l r m r, l s v iw wrcl . m
o e n oe p ae it w . e c o
a
e
s
o ec
Freescale Semiconductor
Data Sheet: Technical Data
Document Number: MCF51AC256
Rev.7, 9/2011
MCF51AC256 Series
ColdFire Microcontroller
Covers:MCF51AC256A
MCF51AC256B
MCF51AC128A
MCF51AC128C
The MCF51AC256 series are members of the
ColdFire
®
family of 32-bit variable-length reduced
instruction set (RISC) microcontroller. This
document provides an overview of the
MCF51AC256 series, focusing on its highly
integrated and diverse feature set.
The MCF51AC256 series are based on the V1
ColdFire core and operates at processor core speeds
up to 50.33 MHz. As part of Freescale’s Controller
Continuum
®
, it is an ideal upgrade for designs
based on the MC9S08AC128 series of 8-bit
microcontrollers.
The MCF51AC256 features the following
functional units:
• V1 ColdFire core with background debug
module
• Up to 256 KB of flash memory
• Up to 32 KB of static RAM (SRAM)
• Up to two analog comparators (ACMP)
• Analog-to-digital converter (ADC) with up
to 24 channels
• Controller-area network (CAN)
• Cyclic redundancy check (CRC)
• Inter-integrated circuit (IIC)
• Keyboard interrupt (KBI)
• Multipurpose clock generator (MCG)
• Rapid general-purpose input/output
(RGPIO)
•
•
•
•
MCF51AC256
80 LQFP
14 mm
14 mm
64 LQFP
10 mm
10 mm
44 LQFP
10 mm
10 mm
64 QFP
14 mm
14 mm
Two serial communications interfaces (SCI)
Up to two serial peripheral interfaces (SPI)
Two flexible timer modules (FTM)
Timer pulse-width modulator (TPM)
This document contains information on a product under development. Freescale reserves the
right to change or discontinue this product without notice.
© Freescale Semiconductor, Inc., 2008-2011. All rights reserved.
Table of Contents
1
MCF51AC256 Family Configurations . . . . . . . . . . . . . . . . . . . .3
1.1 Device Comparison. . . . . . . . . . . . . . . . . . . . . . . . . . . . .3
1.2 Block Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
1.3 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
1.3.1 Feature List . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
1.4 Part Numbers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
1.5 Pinouts and Packaging . . . . . . . . . . . . . . . . . . . . . . . . .12
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
2.1 Parameter Classification . . . . . . . . . . . . . . . . . . . . . . . .17
2.2 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . .17
2.3 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . .18
2.4 Electrostatic Discharge (ESD) Protection Characteristics
19
2.5 DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . .20
2.6 Supply Current Characteristics . . . . . . . . . . . . . . . . . . .25
2.7 Analog Comparator (ACMP) Electricals . . . . . . . . . . . .27
2.8 ADC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .28
2.9 External Oscillator (XOSC) Characteristics . . . . . . . . .31
2.10 MCG Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . .32
2.11 AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . .33
2.11.1 Control Timing . . . . . . . . . . . . . . . . . . . . . . . . . .34
2.11.2 Timer (TPM/FTM) Module Timing . . . . . . . . . . .35
2.11.3 MSCAN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35
2.12 SPI Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . .36
2.13 Flash Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . .38
2.14 EMC Performance. . . . . . . . . . . . . . . . . . . . . . . . . . . . .39
2.14.1 Radiated Emissions . . . . . . . . . . . . . . . . . . . . . .39
Mechanical Outline Drawings . . . . . . . . . . . . . . . . . . . . . . . . .40
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .41
Figure 8. Typical I
OH
vs. V
DD
–V
OH
at V
DD
= 5 V
(High Drive, PTxDSn = 1) . . . . . . . . . . . . . . . . . . . . . .
Figure 9. Typical Run IDD vs. System Clock Freq.
for FEI and FBE Modes . . . . . . . . . . . . . . . . . . . . . . . .
Figure 10.ADC Input Impedance Equivalency Diagram. . . . . . .
Figure 11.Reset Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Figure 12.IRQ/KBIPx Timing . . . . . . . . . . . . . . . . . . . . . . . . . . .
Figure 13.Timer External Clock . . . . . . . . . . . . . . . . . . . . . . . . .
Figure 14.Timer Input Capture Pulse . . . . . . . . . . . . . . . . . . . . .
Figure 15.SPI Master Timing (CPHA = 0) . . . . . . . . . . . . . . . . .
Figure 16.SPI Master Timing (CPHA =1) . . . . . . . . . . . . . . . . . .
Figure 17.SPI Slave Timing (CPHA = 0) . . . . . . . . . . . . . . . . . .
Figure 18.SPI Slave Timing (CPHA = 1) . . . . . . . . . . . . . . . . . .
24
27
29
34
34
35
35
37
37
38
38
2
List of Tables
Table 1. MCF51AC256 Series Device Comparison . . . . . . . . . . 3
Table 2. MCF51AC256 Series Functional Units . . . . . . . . . . . . . 6
Table 3. Orderable Part Number Summary. . . . . . . . . . . . . . . . 10
Table 4. Pin Availability by Package Pin-Count . . . . . . . . . . . . . 14
Table 5. Parameter Classifications . . . . . . . . . . . . . . . . . . . . . . 17
Table 6. Absolute Maximum Ratings. . . . . . . . . . . . . . . . . . . . . 18
Table 7. Thermal Characteristics. . . . . . . . . . . . . . . . . . . . . . . . 18
Table 8. ESD and Latch-up Test Conditions . . . . . . . . . . . . . . . 20
Table 9. ESD and Latch-Up Protection Characteristics. . . . . . . 20
Table 10.DC Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Table 11. Supply Current Characteristics. . . . . . . . . . . . . . . . . . 25
Table 12.Analog Comparator Electrical Specifications. . . . . . . . 27
Table 13.5 Volt 12-bit ADC Operating Conditions . . . . . . . . . . . 28
Table 14.5 Volt 12-bit ADC Characteristics
(V
REFH
= V
DDA
, V
REFL
= V
SSA
) . . . . . . . . . . . . . . . . . . 29
Table 15.Oscillator Electrical Specifications
(Temperature Range = –40 to 105
C
Ambient) . . . . . 31
Table 16.MCG Frequency Specifications
(Temperature Range = –40 to 105
C
Ambient) . . . . . 32
Table 17.Control Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Table 18.TPM/FTM Input Timing . . . . . . . . . . . . . . . . . . . . . . . . 35
Table 19.MSCAN Wake-Up Pulse Characteristics . . . . . . . . . . . 35
Table 20.SPI Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Table 21.Flash Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Table 22.Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Table 23.Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
3
4
List of Figures
Figure 1. MCF51AC256 Series Block Diagram . . . . . . . . . . . . . . 5
Figure 2. MCF51AC256 Series ColdFire Microcontroller
80-Pin LQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 3. MCF51AC256 Series ColdFire Microcontroller
64-Pin QFP/LQFP. . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 4. MCF51AC256 Series ColdFire Microcontroller
44-Pin LQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 5. Typical I
OH
vs. V
DD
–V
OH
at V
DD
= 3 V
(Low Drive, PTxDSn = 0) . . . . . . . . . . . . . . . . . . . . . . 22
Figure 6. Typical I
OH
vs. V
DD
–V
OH
at V
DD
= 3 V
(High Drive, PTxDSn = 1) . . . . . . . . . . . . . . . . . . . . . . 23
Figure 7. Typical I
OH
vs. V
DD
–V
OH
at V
DD
= 5 V
(Low Drive, PTxDSn = 0) . . . . . . . . . . . . . . . . . . . . . . 23
MCF51AC256 ColdFire Microcontroller Data Sheet, Rev.7
2
Freescale Semiconductor
MCF51AC256 Family Configurations
1
1.1
MCF51AC256 Family Configurations
Device Comparison
Table 1. MCF51AC256 Series Device Comparison
MCF51AC256A
Feature
80-pin 64-pin
80-pin 64-pin 44-pin
256
32
Yes
Yes
Yes
24
Yes
20
24
Yes
20
No
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
69
54
16
69
54
36
12
Yes
Yes
Yes
No
6
6
2
6
2
Yes
No
4
2
6
2
Yes
No
6
6
2
Yes
No
4
2
69
54
16
69
54
36
12
No
9
24
Yes
20
Yes
24
20
No
No
9
80-pin
64-pin
80-pin
128
32 or 16
1
64-pin
44-pin
MCF51AC256B
MCF51AC128A
MCF51AC128C
The MCF51AC256 series is summarized in
Table 1.
Flash memory size (Kbytes)
RAM size (Kbytes)
V1 ColdFire core with BDM (background
debug module)
ACMP1 (analog comparator)
ACMP2 (analog comparator)
ADC (analog-to-digital converter) channels
(12-bit)
CAN (controller area network)
COP (computer operating properly)
CRC (cyclic redundancy check)
RTI
DBG (debug)
IIC1 (inter-integrated circuit)
IRQ (interrupt request input)
INTC (interrupt controller)
KBI (keyboard interrupts)
LVD (low-voltage detector)
MCG (multipurpose clock generator)
OSC (crystal oscillator)
Port I/O
2
RGPIO (rapid general-purpose I/O)
SCI1, SCI2 (serial communications
interfaces)
SPI1 (serial peripheral interface)
SPI2 (serial peripheral interface)
FTM1 (flexible timer module) channels
FTM2 channels
MCF51AC256 ColdFire Microcontroller Data Sheet, Rev.7
Freescale Semiconductor
3
MCF51AC256 Family Configurations
Table 1. MCF51AC256 Series Device Comparison (continued)
MCF51AC256A
Feature
80-pin 64-pin
TPM3 (timer pulse-width modulator)
channels
VBUS (debug visibility bus)
1
MCF51AC256B
80-pin 64-pin 44-pin
MCF51AC128A
80-pin
2
64-pin
MCF51AC128C
80-pin
64-pin
44-pin
Yes
No
Yes
No
Yes
No
Yes
No
The members of MCF51AC128A with CAN support have 32 KB RAM. The other members have 16 KB RAM.
2
Up to 16 pins on Ports E and F are shared with the ColdFire Rapid GPIO module.
1.2
Block Diagram
Figure 1
shows the connections between the MCF51AC256 series pins and modules.
MCF51AC256 ColdFire Microcontroller Data Sheet, Rev.7
4
Freescale Semiconductor
电源技术
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
