SOIC to TO Adapter
FEATURES:
• 8-position SOIC footprint on the top and a circular, 8-pin
TO can male pin footprint on the bottom. ICs now
available only in 8-position SOIC packages can be
readily mounted on boards having TO thru-hole foot-
prints without having to redesign the board.
• Consult factory for mounting of consigned chips.
SPECIFICATIONS:
• Adapter board is FR-4, .062 [1.58] thick, with
1 ounce Copper traces both sides.
• Male pin is Brass Alloy 360 1/2 hard per UNS C36000
ASTM-B16-85.
• Male pin plating is 200μ [5.08μm] min. Tin per MIL-T-
10727 Type 1 or Tin/Lead 90/10 MIL-P-81728 over
100μ [2.54μm] Nickel per QQ-N-290.
• Operating temperature=221°F [105°C].
MOUNTING CONSIDERATIONS:
• Suggested PCB hole size=.028 ± .003 [.71±.08] dia.
Note: Aries specializes in custom design and production. In addition to the
standard products shown on this page, special materials, platings, sizes, and
configurations can be furnished, depending on quantities. Aries reserves the
right to change product specifications without notice.
ORDERING INFORMATION
A
LL DIMENSIONS
:
INCHES
[
MILLIMETERS
]
All tolerances ± .005 [.13]
unless otherwise specified
DIP to TO adapter also
available. Consult Data
Sheet No. 18012.
Part Number
1109814
8-301296-10
8-305479-10
Dim. "C"
.200 [5.08]
.300 [7.62]
.270 [6.85]
18013
REV.E
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