S Prefix for Automotive and Other Applications Requiring Unique
http://onsemi.com
Site and Control Change Requirements
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant*
CASE 463
SC−75/SOT−416
STYLE 4
MAXIMUM RATINGS
(T
A
= 25C)
Rating
Reverse Voltage
Forward Current
Peak Forward Surge Current
Symbol
V
R
I
F
I
FM(surge)
Max
70
200
500
Unit
Vdc
mAdc
mAdc
3
ANODE
CATHODE
1
2
CATHODE
THERMAL CHARACTERISTICS
Characteristic
Total Device Dissipation,
FR−4 Board (Note 1), T
A
= 25C
Derated above 25C
Thermal Resistance, Junction−to−Ambient
(Note 1)
Total Device Dissipation,
FR−4 Board (Note 2), T
A
= 25C
Derated above 25C
Thermal Resistance, Junction−to−Ambient
(Note 2)
Junction and Storage
Temperature Range
Symbol
P
D
Max
225
1.8
555
Unit
mW
mW/C
C/W
A1
M
G
MARKING DIAGRAM
A1 M
G
G
1
= Specific Device Code
= Date Code*
= Pb−Free Package
R
JA
P
D
360
2.9
345
−55
to +150
mW
mW/C
C/W
C
(Note: Microdot may be in either location)
*Date Code orientation may vary depending upon
manufacturing location.
R
JA
T
J
, T
stg
ORDERING INFORMATION
Device
BAW56TT1G
SBAW56TT1G
Package
SC−75/SOT−416
(Pb−Free)
SC−75/SOT−416
(Pb−Free)
Shipping
†
3,000 /
Tape & Reel
3,000 /
Tape & Reel
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR−4 @ Minimum Pad
2. FR−4 @ 1.0
1.0 Inch Pad
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
Semiconductor Components Industries, LLC, 2011
November, 2011
−
Rev. 4
1
Publication Order Number:
BAW56TT1/D
BAW56TT1G, SBAW56TT1G
ELECTRICAL CHARACTERISTICS
(T
A
= 25C unless otherwise noted)
Characteristic
OFF CHARACTERISTICS
Reverse Breakdown Voltage
(I
(BR)
= 100
mAdc)
Reverse Voltage Leakage Current
(V
R
= 25 Vdc, T
J
= 150C)
(V
R
= 70 Vdc)
(V
R
= 70 Vdc, T
J
= 150C)
Diode Capacitance
(V
R
= 0, f = 1.0 MHz)
Forward Voltage
(I
F
= 1.0 mAdc)
(I
F
= 10 mAdc)
(I
F
= 60 mAdc)
(I
F
= 150 mAdc)
Reverse Recovery Time
(I
F
= I
R
= 10 mAdc, R
L
= 100
W,
I
R(REC)
= 1.0 mAdc) (Figure 1)
V
(BR)
I
R
70
−
−
−
−
−
−
−
−
−
−
30
2.5
50
2.0
715
855
1000
1250
6.0
Vdc
mAdc
Symbol
Min
Max
Unit
C
D
V
F
pF
mVdc
t
rr
ns
820W
+10 V
2.0 k
100
mH
0.1
mF
DUT
50
W
OUTPUT
PULSE
GENERATOR
50
W
INPUT
SAMPLING
OSCILLOSCOPE
V
R
INPUT SIGNAL
90%
I
R
i
R(REC)
= 1.0 mA
OUTPUT PULSE
(I
F
= I
R
= 10 mA; MEASURED
at i
R(REC)
= 1.0 mA)
I
F
0.1
mF
t
r
10%
t
p
t
I
F
t
rr
t
Notes: 1. A 2.0 kW variable resistor adjusted for a Forward Current (I
F
) of 10 mA.
Notes:
2. Input pulse is adjusted so I
R(peak)
is equal to 10 mA.
Notes:
3. t
p
» t
rr
Figure 1. Recovery Time Equivalent Test Circuit
http://onsemi.com
2
BAW56TT1G, SBAW56TT1G
100
IF, FORWARD CURRENT (mA)
IR , REVERSE CURRENT (A)
10
T
A
= 150C
1.0
T
A
= 125C
10
T
A
= 85C
T
A
= 25C
1.0
T
A
= - 40C
T
A
= 85C
0.1
T
A
= 55C
0.01
T
A
= 25C
0.1
0.2
0.4
0.6
0.8
1.0
V
F
, FORWARD VOLTAGE (VOLTS)
1.2
0.001
0
10
20
30
40
V
R
, REVERSE VOLTAGE (VOLTS)
50
Figure 2. Forward Voltage
Figure 3. Leakage Current
1.75
CD, DIODE CAPACITANCE (pF)
1.5
1.25
1.0
0.75
0
2
4
6
8
V
R
, REVERSE VOLTAGE (VOLTS)
Figure 4. Capacitance
r(t), NORMALIZED TRANSIENT THERMAL RESISTANCE
1.0
D = 0.5
0.2
0.1
0.05
0.02
0.01
0.01
SINGLE PULSE
0.001
0.00001
0.0001
0.001
0.01
0.1
t, TIME (s)
1.0
10
100
1000
0.1
Figure 5. Normalized Thermal Response
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3
BAW56TT1G, SBAW56TT1G
PACKAGE DIMENSIONS
SC−75/SOT−416
CASE 463−01
ISSUE F
−E−
2
3
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
e
1
−D−
b
3 PL
0.20 (0.008)
M
D
H
E
0.20 (0.008) E
DIM
A
A1
b
C
D
E
e
L
H
E
MILLIMETERS
MIN
NOM MAX
0.70
0.80
0.90
0.00
0.05
0.10
0.15
0.20
0.30
0.10
0.15
0.25
1.55
1.60
1.65
0.70
0.80
0.90
1.00 BSC
0.10
0.15
0.20
1.50
1.60
1.70
INCHES
NOM MAX
0.031 0.035
0.002 0.004
0.008 0.012
0.006 0.010
0.063 0.067
0.031 0.035
0.04 BSC
0.004 0.006 0.008
0.061 0.063 0.065
MIN
0.027
0.000
0.006
0.004
0.059
0.027
C
A
L
A1
STYLE 4:
PIN 1. CATHODE
2. CATHODE
3. ANODE
SOLDERING FOOTPRINT*
0.356
0.014
1.803
0.071
0.787
0.031
0.508
0.020
1.000
0.039
SCALE 10:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor
and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
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