Loadable PLD, CMOS, PQFP144, TQFP-144
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
包装说明 | LFQFP, QFP144,.63SQ,20 |
Reach Compliance Code | compliant |
ECCN代码 | 3A991 |
其他特性 | ALSO CONFIGURABLE WITH 5V VCC |
最大时钟频率 | 133 MHz |
JESD-30 代码 | S-PQFP-G144 |
JESD-609代码 | e0 |
长度 | 20 mm |
湿度敏感等级 | 3 |
专用输入次数 | 4 |
I/O 线路数量 | 117 |
输入次数 | 117 |
逻辑单元数量 | 1960 |
输出次数 | 117 |
端子数量 | 144 |
组织 | 4 DEDICATED INPUTS, 117 I/O |
输出函数 | MACROCELL |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | LFQFP |
封装等效代码 | QFP144,.63SQ,20 |
封装形状 | SQUARE |
封装形式 | FLATPACK, LOW PROFILE, FINE PITCH |
峰值回流温度(摄氏度) | 220 |
电源 | 2.5/3.3,3.3 V |
可编程逻辑类型 | LOADABLE PLD |
认证状态 | Not Qualified |
座面最大高度 | 1.6 mm |
最大供电电压 | 3.6 V |
最小供电电压 | 3 V |
标称供电电压 | 3.3 V |
表面贴装 | YES |
技术 | CMOS |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING |
端子节距 | 0.5 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 20 mm |
Base Number Matches | 1 |
EPF6024ATI144-3 | EPF6016BI256-3 | EPF6016ATI100-3 | EPF6016QI240-3 | EPF6016ABC256-3 | |
---|---|---|---|---|---|
描述 | Loadable PLD, CMOS, PQFP144, TQFP-144 | Loadable PLD, CMOS, PBGA256, BGA-256 | Loadable PLD, CMOS, PQFP100, TQFP-100 | Loadable PLD, CMOS, PQFP240, PLASTIC, QFP-240 | Field Programmable Gate Array, 1320-Cell, CMOS, PBGA256, |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 |
输入次数 | 117 | 204 | 81 | 199 | 204 |
逻辑单元数量 | 1960 | 1320 | 1320 | 1320 | 1320 |
输出次数 | 117 | 204 | 81 | 199 | 204 |
端子数量 | 144 | 256 | 100 | 240 | 256 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | LFQFP | BGA | LFQFP | FQFP | BGA |
封装等效代码 | QFP144,.63SQ,20 | BGA256(UNSPEC) | QFP100,.63SQ,20 | QFP240,1.3SQ,20 | BGA256(UNSPEC) |
封装形式 | FLATPACK, LOW PROFILE, FINE PITCH | GRID ARRAY | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, FINE PITCH | GRID ARRAY |
电源 | 2.5/3.3,3.3 V | 3.3/5,5 V | 2.5/3.3,3.3 V | 3.3/5,5 V | 3.3,3.3/5 V |
可编程逻辑类型 | LOADABLE PLD | LOADABLE PLD | LOADABLE PLD | LOADABLE PLD | FIELD PROGRAMMABLE GATE ARRAY |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
表面贴装 | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING | BALL | GULL WING | GULL WING | BALL |
端子位置 | QUAD | BOTTOM | QUAD | QUAD | BOTTOM |
包装说明 | LFQFP, QFP144,.63SQ,20 | BGA, BGA256(UNSPEC) | LFQFP, QFP100,.63SQ,20 | FQFP, QFP240,1.3SQ,20 | - |
ECCN代码 | 3A991 | 3A991 | EAR99 | 3A991 | - |
其他特性 | ALSO CONFIGURABLE WITH 5V VCC | ALSO CONFIGURABLE WITH 5V VCC | ALSO CONFIGURABLE WITH 5V VCC | ALSO CONFIGURABLE WITH 5V VCC | - |
最大时钟频率 | 133 MHz | 133 MHz | 133 MHz | 133 MHz | - |
JESD-30 代码 | S-PQFP-G144 | S-PBGA-B256 | S-PQFP-G100 | S-PQFP-G240 | - |
长度 | 20 mm | 27 mm | 14 mm | 32 mm | - |
湿度敏感等级 | 3 | - | 3 | 3 | - |
专用输入次数 | 4 | 4 | 4 | 4 | - |
I/O 线路数量 | 117 | 218 | 81 | 199 | - |
组织 | 4 DEDICATED INPUTS, 117 I/O | 4 DEDICATED INPUTS, 218 I/O | 4 DEDICATED INPUTS, 81 I/O | 4 DEDICATED INPUTS, 199 I/O | - |
输出函数 | MACROCELL | MACROCELL | MACROCELL | MACROCELL | - |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | - |
峰值回流温度(摄氏度) | 220 | 220 | 220 | 220 | - |
座面最大高度 | 1.6 mm | 2.3 mm | 1.27 mm | 4.1 mm | - |
最大供电电压 | 3.6 V | 5.5 V | 3.6 V | 5.5 V | - |
最小供电电压 | 3 V | 4.5 V | 3 V | 4.5 V | - |
标称供电电压 | 3.3 V | 5 V | 3.3 V | 5 V | - |
端子节距 | 0.5 mm | 1.27 mm | 0.5 mm | 0.5 mm | - |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
宽度 | 20 mm | 27 mm | 14 mm | 32 mm | - |
Base Number Matches | 1 | 1 | 1 | 1 | - |
电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved