PUMX1
40 V, 100 mA NPN/NPN general-purpose transistor
Rev. 04 — 20 January 2010
Product data sheet
1. Product profile
1.1 General description
NPN/NPN general-purpose transistor with two independently operating transistors in a
SOT363 (SC-88) very small Surface-Mounted Device (SMD) plastic package.
Table 1.
Product overview
Package
NXP
PUMX1
SOT363
JEITA
SC-88
PNP/PNP
complement
PUMT1
NPN/PNP
complement
PUMZ1
Type number
1.2 Features
Double general-purpose transistor
Board-space reduction
Very small SMD plastic package
1.3 Applications
General-purpose switching and amplification
2. Pinning information
Table 2.
Pin
1
2
3
4
5
6
Pinning
Description
emitter TR1
base TR1
collector TR2
emitter TR2
base TR2
collector TR1
1
2
3
1
2
sym020
Simplified outline
6
5
4
Graphic symbol
6
5
4
TR2
TR1
3
NXP Semiconductors
PUMX1
40 V, 100 mA NPN general-purpose double transistor
3. Ordering information
Table 3.
Ordering information
Package
Name
PUMX1
SC-88
Description
plastic surface-mounted package; 6 leads
Version
SOT363
Type number
4. Marking
Table 4.
PUMX1
[1]
* = -: made in Hong Kong
* = p: made in Hong Kong
* = t: made in Malaysia
* = W: made in China
Marking codes
Marking code
[1]
Z*Z
Type number
5. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
V
CBO
V
CEO
V
EBO
I
C
I
CM
I
BM
P
tot
Per device
P
tot
T
j
T
amb
T
stg
[1]
Parameter
collector-base voltage
collector-emitter voltage
emitter-base voltage
collector current
peak collector current
peak base current
total power dissipation
total power dissipation
junction temperature
ambient temperature
storage temperature
Conditions
open emitter
open base
open collector
Min
-
-
-
-
-
-
Max
50
40
5
100
200
200
200
300
150
+150
+150
Unit
V
V
V
mA
mA
mA
mW
mW
°C
°C
°C
Per transistor
T
amb
≤
25
°C
T
amb
≤
25
°C
[1]
-
-
-
−65
−65
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
PUMX1_4
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 04 — 20 January 2010
2 of 8
NXP Semiconductors
PUMX1
40 V, 100 mA NPN general-purpose double transistor
6. Thermal characteristics
Table 6.
Symbol
Per device
R
th(j-a)
[1]
Thermal characteristics
Parameter
Conditions
[1]
Min
-
Typ
-
Max
416
Unit
K/W
thermal resistance from junction in free air
to ambient
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
7. Characteristics
Table 7.
Characteristics
T
amb
= 25
°
C unless otherwise specified.
Symbol
I
CBO
Parameter
collector-base cut-off current
Conditions
V
CB
= 30 V;
I
E
= 0 A
V
CB
= 30 V;
I
E
= 0 A;
T
j
= 150
°C
I
EBO
h
FE
V
CEsat
f
T
emitter-base cut-off current
DC current gain
collector-emitter saturation
voltage
transition frequency
V
EB
= 4 V;
I
C
= 0 A
V
CE
= 6 V;
I
C
= 1 mA
I
C
= 50 mA;
I
B
= 5 mA
I
C
= 2 mA;
V
CE
= 12 V;
f = 100 MHz
V
CB
= 12 V;
I
E
= i
e
= 0 A;
f = 1 MHz
[1]
Min
-
-
Typ
-
-
Max
100
10
Unit
nA
μA
Per transistor
-
120
-
100
-
-
-
-
100
-
200
-
nA
mV
MHz
C
c
collector capacitance
-
-
1.5
pF
[1]
Pulse test: t
p
≤
300
μs; δ ≤
0.02.
PUMX1_4
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 04 — 20 January 2010
3 of 8
NXP Semiconductors
PUMX1
40 V, 100 mA NPN general-purpose double transistor
8. Package outline
2.2
1.8
6
5
4
0.45
0.15
1.1
0.8
2.2 1.35
2.0 1.15
pin 1
index
1
0.65
1.3
Dimensions in mm
2
3
0.3
0.2
0.25
0.10
06-03-16
Fig 1.
Package outline PUMX1 (SOT363/SC-88)
9. Packing information
Table 8.
Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.
[1]
Type
number
PUMX1
Package
SOT363
Description
4 mm pitch, 8 mm tape and reel; T1
4 mm pitch, 8 mm tape and reel; T2
[1]
[2]
[3]
[2]
[3]
Packing quantity
3000
-115
-125
10000
-135
-165
For further information and the availability of packing methods, see
Section 12.
T1: normal taping
T2: reverse taping
PUMX1_4
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 04 — 20 January 2010
4 of 8
NXP Semiconductors
PUMX1
40 V, 100 mA NPN general-purpose double transistor
10. Revision history
Table 9.
PUMX1_4
Modifications:
Revision history
Release date
20100120
Data sheet status
Product data sheet
Change notice
-
Supersedes
PUMX1_3
Document ID
•
•
•
•
•
•
•
•
•
The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
Legal texts have been adapted to the new company name where appropriate.
Table 1 “Product overview”:
added
Section 1.2 “Features”:
updated
Section 1.3 “Applications”:
amended
Section 2 “Pinning information”:
amended
Figure 1:
superseded by minimized package outline drawing
Section 9 “Packing information”:
added
Section 11 “Legal information”:
updated
Preliminary specification
Preliminary specification
-
-
PUMX1_2
PUMX1_1
PUMX1_3
PUMX1_2
19990414
19970709
PUMX1_4
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 04 — 20 January 2010
5 of 8
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