Quadruple Bus Buffer Gates With 3-State Outputs 14-SSOP -40 to 85
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 零件包装代码 | SSOP |
| 包装说明 | SSOP, SSOP14,.3 |
| 针数 | 14 |
| Reach Compliance Code | not_compliant |
| 其他特性 | DUMMY VAL |
| 控制类型 | ENABLE HIGH |
| 系列 | AHCT/VHCT/VT |
| JESD-30 代码 | R-PDSO-G14 |
| 长度 | 6.2 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER |
| 最大I（ol） | 0.008 A |
| 位数 | 4 |
| 功能数量 | 1 |
| 端口数量 | 2 |
| 端子数量 | 14 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SSOP |
| 封装等效代码 | SSOP14,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, SHRINK PITCH |
| 包装方法 | TAPE AND REEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5 V |
| Prop。Delay @ Nom-Sup | 8.5 ns |
| 传播延迟（tpd） | 8.5 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 5.3 mm |
| Base Number Matches | 1 |
| SN74AHCT126DBLE | 2220Y2000223MRR | 5962-9686301Q2A | SNJ54AHCT126J | SN74AHCT126DGV | SN54AHCT126WR | SN54AHCT126FK | SN54AHCT126FKR | SNJ54AHCT126FK | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | Quadruple Bus Buffer Gates With 3-State Outputs 14-SSOP -40 to 85 | Ceramic Capacitor, Multilayer, Ceramic, 200V, 20% +Tol, 20% -Tol, BZ, 15% TC, 0.022uF, Surface Mount, 2220, CHIP | Quadruple Bus Buffer Gates With 3-State Outputs 20-LCCC -55 to 125 | Quadruple Bus Buffer Gates With 3-State Outputs 14-CDIP -55 to 125 | AHCT/VHCT SERIES, QUAD 1-BIT DRIVER, TRUE OUTPUT, PDSO14, TVSOP-14 | AHCT/VHCT SERIES, QUAD 1-BIT DRIVER, TRUE OUTPUT, CDFP14, CERAMIC, FP-14 | AHCT/VHCT SERIES, QUAD 1-BIT DRIVER, TRUE OUTPUT, CQCC20, CERAMIC, CC-20 | AHCT/VHCT SERIES, QUAD 1-BIT DRIVER, TRUE OUTPUT, CQCC20, CERAMIC, CC-20 | Quadruple Bus Buffer Gates With 3-State Outputs 20-LCCC -55 to 125 |
| 包装说明 | SSOP, SSOP14,.3 | , 2220 | QCCN, LCC20,.35SQ | DIP, DIP14,.3 | TSSOP, TSSOP14,.25,16 | DFP, | QCCN, | QCCN, | QCCN, LCC20,.35SQ |
| Reach Compliance Code | not_compliant | compliant | not_compliant | not_compliant | unknown | unknown | unknown | unknown | not_compliant |
| 系列 | AHCT/VHCT/VT | 2220(200/250,BZ) | AHCT/VHCT/VT | AHCT/VHCT/VT | AHCT/VHCT | AHCT/VHCT | AHCT/VHCT | AHCT/VHCT | AHCT/VHCT/VT |
| 长度 | 6.2 mm | 5.7 mm | 8.89 mm | 19.56 mm | 4.4 mm | 9.21 mm | 8.89 mm | 8.89 mm | 8.89 mm |
| 端子数量 | 14 | 2 | 20 | 14 | 14 | 14 | 20 | 20 | 20 |
| 最高工作温度 | 85 °C | 125 °C | 125 °C | 125 °C | 85 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -55 °C | -55 °C | -55 °C | -40 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 封装形状 | RECTANGULAR | RECTANGULAR PACKAGE | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | SQUARE |
| 封装形式 | SMALL OUTLINE, SHRINK PITCH | SMT | CHIP CARRIER | IN-LINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | FLATPACK | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
| 表面贴装 | YES | YES | YES | NO | YES | YES | YES | YES | YES |
| 宽度 | 5.3 mm | 5 mm | 8.89 mm | 7.62 mm | 3.6 mm | 6.29 mm | 8.89 mm | 8.89 mm | 8.89 mm |
| 是否无铅 | 含铅 | 不含铅 | 含铅 | 含铅 | - | - | - | - | 含铅 |
| 是否Rohs认证 | 不符合 | 符合 | 不符合 | 不符合 | - | - | - | - | 不符合 |
| 零件包装代码 | SSOP | - | QLCC | DIP | SOIC | DFP | QFN | QFN | QLCC |
| 针数 | 14 | - | 20 | 14 | 14 | 14 | 20 | 20 | 20 |
| JESD-30 代码 | R-PDSO-G14 | - | S-CQCC-N20 | R-GDIP-T14 | R-PDSO-G14 | R-GDFP-F14 | S-CQCC-N20 | S-CQCC-N20 | S-CQCC-N20 |
| 负载电容（CL） | 50 pF | - | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER | - | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 位数 | 4 | - | 4 | 4 | 1 | 1 | 1 | 1 | 4 |
| 功能数量 | 1 | - | 1 | 1 | 4 | 4 | 4 | 4 | 1 |
| 端口数量 | 2 | - | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| 输出特性 | 3-STATE | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | - | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | PLASTIC/EPOXY | - | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | SSOP | - | QCCN | DIP | TSSOP | DFP | QCCN | QCCN | QCCN |
| 封装等效代码 | SSOP14,.3 | - | LCC20,.35SQ | DIP14,.3 | TSSOP14,.25,16 | - | - | - | LCC20,.35SQ |
| 传播延迟（tpd） | 8.5 ns | - | 8.5 ns | 8.5 ns | 8.5 ns | 8.5 ns | 8.5 ns | 8.5 ns | 8.5 ns |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2 mm | - | 2.03 mm | 5.08 mm | 1.2 mm | 2.03 mm | 2.03 mm | 2.03 mm | 2.03 mm |
| 最大供电电压 (Vsup) | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | - | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | - | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 技术 | CMOS | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | - | MILITARY | MILITARY | INDUSTRIAL | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | GULL WING | - | NO LEAD | THROUGH-HOLE | GULL WING | FLAT | NO LEAD | NO LEAD | NO LEAD |
| 端子节距 | 0.65 mm | - | 1.27 mm | 2.54 mm | 0.4 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | - | QUAD | DUAL | DUAL | DUAL | QUAD | QUAD | QUAD |
| 厂商名称 | - | - | - | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
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