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89HPES24T3G2ZABR

产品描述PCI Bus Controller, PBGA676, 27 X 27 MM, 1 MM PITCH, ROHS COMPLIANT, FCBGA-676
产品类别嵌入式处理器和控制器    微控制器和处理器   
文件大小1MB,共48页
制造商IDT (Integrated Device Technology)
标准  
下载文档 详细参数 选型对比 全文预览 文档解析

89HPES24T3G2ZABR概述

PCI Bus Controller, PBGA676, 27 X 27 MM, 1 MM PITCH, ROHS COMPLIANT, FCBGA-676

89HPES24T3G2ZABR规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
零件包装代码BGA
包装说明BGA,
针数676
Reach Compliance Codenot_compliant
ECCN代码3A001.A.3
其他特性ALSO REQUIRES 3.3V SUPPLY
地址总线宽度
最大时钟频率125 MHz
驱动器接口标准IEEE 1149.1
外部数据总线宽度
JESD-30 代码S-PBGA-B676
JESD-609代码e1
长度27 mm
湿度敏感等级4
端子数量676
最高工作温度70 °C
最低工作温度
封装主体材料PLASTIC/EPOXY
封装代码BGA
封装形状SQUARE
封装形式GRID ARRAY
峰值回流温度(摄氏度)260
认证状态Not Qualified
座面最大高度3.22 mm
最大供电电压1.1 V
最小供电电压0.9 V
标称供电电压1 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层Tin/Silver/Copper (Sn/Ag/Cu)
端子形式BALL
端子节距1 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间30
宽度27 mm
uPs/uCs/外围集成电路类型BUS CONTROLLER, PCI
Base Number Matches1

文档解析

89HPES24T3G2 PCIe交换芯片通过24个集成串行通道连接最多三个端口,每个通道提供双向5Gbps带宽。设备符合PCIe 2.0规范所有要求,包括总线锁定事务处理和INTx中断仿真等传统功能。架构采用多路复用/解复用设计,集成帧缓冲器和路由表仲裁机制,支持有效负载大小达2048字节的数据包传输。 电源管理系统包含高级功率预算功能,支持PCIe活动状态电源管理(ASPM)的L0/L0s/L1/L2/L3状态切换。可靠性特性涵盖设备序列号记录、链路可靠性监控和热插拔能力,所有下游端口均支持带电插拔操作。错误处理机制包含高级错误报告(AER)和端到端CRC保护,内部存储器采用单错误校正双错误检测(SECDED)方案。 通用I/O系统允许每个引脚独立配置为输入/输出或中断源,部分GPIO提供复位信号输出等复用功能。测试模式包含主环回诊断和内部寄存器访问能力,通过SMBus或JTAG接口实现深度调试。参考时钟支持100MHz/125MHz可配置频率,满足不同系统时序需求。

文档预览

下载PDF文档
24-Lane 3-Port
Gen2 PCI Express® Switch
®
89HPES24T3G2
Data Sheet
Advance Information*
Device Overview
The 89HPES24T3G2 is a member of IDT’s PRECISE™ family of PCI
Express® switching solutions. The PES24T3G2 is a 24-lane, 3-port
Gen2 peripheral chip that performs PCI Express base switching with a
feature set optimized for high performance applications such as servers,
storage, and communications systems. It provides connectivity and
switching functions between a PCI Express upstream port and two
downstream ports and supports switching between downstream ports.
Features
High Performance PCI Express Switch
– Twenty-four 5 Gbps Gen2 PCI Express lanes supporting
5 Gbps and 2.5 Gbps operation
– Up to three switch ports
– Support for Max Payload Size up to 2048 bytes
– Supports one virtual channel and eight traffic classes
– Fully compliant with PCI Express base specification Revision
2.0
Flexible Architecture with Numerous Configuration Options
– Automatic per port link width negotiation to x8, x4, x2, or x1
– Automatic lane reversal on all ports
– Automatic polarity inversion
– Supports in-band hot-plug presence detect capability
– Supports external signal for hot plug event notification allowing
SCI/SMI generation for legacy operating systems
– Dynamic link width reconfiguration for power/performance
optimization
– Configurable downstream port PCI-to-PCI bridge device
numbering
– Crosslink support
– Supports ARI forwarding defined in the Alternative Routing-ID
Interpretation (ARI) ECN for virtualized and non-virtualized
environments
– Ability to load device configuration from serial EEPROM
Legacy Support
– PCI compatible INTx emulation
– Supports bus locked transactions, allowing use of PCI Express
with legacy software
Highly Integrated Solution
– Requires no external components
– Incorporates on-chip internal memory for packet buffering and
queueing
– Integrates twenty-four 5 Gbps / 2.5 Gbps embedded SerDes,
8B/10B encoder/decoder (no separate transceivers needed)
Reliability, Availability, and Serviceability (RAS) Features
– Ability to disable peer-to-peer communications
– Supports ECRC and Advanced Error Reporting
– All internal data and control RAMs are SECDED ECC
protected
– Supports PCI Express hot-plug on all downstream ports
– Supports upstream port hot-plug
Block Diagram
3-Port Switch Core / 24 Gen2 PCI Express Lanes
Frame Buffer
Route Table
Port
Arbitration
Scheduler
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
...
...
...
SerDes
SerDes
SerDes
SerDes
SerDes
SerDes
SerDes
SerDes
SerDes
Figure 1 Internal Block Diagram
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc.
1 of 48
©
2007 Integrated Device Technology, Inc.
*Notice: The information in this document is subject to change without notice
December 19, 2007
DSC 6930
Advance Information

89HPES24T3G2ZABR相似产品对比

89HPES24T3G2ZABR 89HPES24T3G2ZABL 89HPES24T3G2ZAAR 89HPES24T3G2ZAAL
描述 PCI Bus Controller, PBGA676, 27 X 27 MM, 1 MM PITCH, ROHS COMPLIANT, FCBGA-676 PCI Bus Controller, PBGA676, 27 X 27 MM, 1 MM PITCH, FCBGA-676 PCI Bus Controller, PBGA324, 19 X 19 MM, 1 MM PITCH, ROHS COMPLIANT, FCBGA-324 PCI Bus Controller, PBGA324, 19 X 19 MM, 1 MM PITCH, FCBGA-324
是否无铅 不含铅 含铅 不含铅 含铅
是否Rohs认证 符合 不符合 符合 不符合
零件包装代码 BGA BGA BGA BGA
包装说明 BGA, BGA, BGA, BGA,
针数 676 676 324 324
Reach Compliance Code not_compliant not_compliant compliant not_compliant
ECCN代码 3A001.A.3 3A001.A.3 3A001.A.3 3A001.A.3
其他特性 ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY
最大时钟频率 125 MHz 125 MHz 125 MHz 125 MHz
驱动器接口标准 IEEE 1149.1 IEEE 1149.1 IEEE 1149.1 IEEE 1149.1
JESD-30 代码 S-PBGA-B676 S-PBGA-B676 S-PBGA-B324 S-PBGA-B324
JESD-609代码 e1 e0 e3 e0
长度 27 mm 27 mm 19 mm 19 mm
端子数量 676 676 324 324
最高工作温度 70 °C 70 °C 70 °C 70 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 BGA BGA BGA BGA
封装形状 SQUARE SQUARE SQUARE SQUARE
封装形式 GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
峰值回流温度(摄氏度) 260 225 260 225
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 3.22 mm 3.22 mm 3.42 mm 3.42 mm
最大供电电压 1.1 V 1.1 V 1.1 V 1.1 V
最小供电电压 0.9 V 0.9 V 0.9 V 0.9 V
标称供电电压 1 V 1 V 1 V 1 V
表面贴装 YES YES YES YES
技术 CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
端子面层 Tin/Silver/Copper (Sn/Ag/Cu) Tin/Lead (Sn/Pb) Matte Tin (Sn) Tin/Lead (Sn/Pb)
端子形式 BALL BALL BALL BALL
端子节距 1 mm 1 mm 1 mm 1 mm
端子位置 BOTTOM BOTTOM BOTTOM BOTTOM
处于峰值回流温度下的最长时间 30 30 30 30
宽度 27 mm 27 mm 19 mm 19 mm
uPs/uCs/外围集成电路类型 BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI
Base Number Matches 1 1 1 -
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