No. STSE-CC7085A
<Cat.No.070608>
SPECIFICATIONS FOR NICHIA CHIP TYPE
GREEN
LED
MODEL :
NS6G083T
NICHIA CORPORATION
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Nichia STSE-CC7085A
<Cat.No.070608>
1.SPECIFICATIONS
(1) Absolute Maximum Ratings
Item
Forward Current
Pulse Forward Current
Allowable Reverse Current
Power Dissipation
Operating Temperature
Storage Temperature
Dice Temperature
Symbol
I
F
I
FP
I
R
P
D
T
opr
T
stg
T
j
Absolute Maximum Rating
350
600
85
1.54
-30 ~ + 85
-40 ~ +100
120
(Ta=25°C)
Unit
mA
mA
mA
W
°C
°C
°C
I
FP
Conditions : Pulse Width
<
10msec. and Duty
<
1/10
=
=
(2) Initial Electrical/Optical Characteristics
Item
Symbol
Forward Voltage
V
F
Luminous Flux
φv
x
-
Chromaticity Coordinate
y
-
Please refer to CIE 1931 chromaticity diagram.
Condition
I
F
=300[mA]
I
F
=300[mA]
I
F
=300[mA]
I
F
=300[mA]
Typ.
(3.5)
(55)
0.189
0.718
(Ta=25°C)
Max.
Unit
4.4
V
-
lm
-
-
-
-
(3) Ranking
Item
Rank H
Rank M
Rank L
Rank K
Rank P15
Rank P14
Rank P13
Rank P12
Symbol
Condition
Min.
4.0
3.6
3.2
2.8
60.5
51.0
42.8
36.0
Forward Voltage
V
F
I
F
=300[mA]
Luminous Flux
φ
V
I
F
=300[mA]
(Ta=25°C)
Max.
Unit
4.4
4.0
V
3.6
3.2
72.0
60.5
lm
51.0
42.8
Forward Voltage Measurement allowance is ± 3%.
Luminous Flux Measurement allowance is ± 10%.
Color Ranks
x
y
0.14
0.64
Rank G
0.14
0.22
0.74
0.74
0.22
0.64
x
y
0.21
0.65
(I
F
=300mA,Ta=25°C)
Rank H
0.21
0.28
0.28
0.73
0.73
0.65
Color Coordinates Measurement allowance is ± 0.01.
2.INITIAL OPTICAL/ELECTRICAL CHARACTERISTICS
Please refer to figure’s page.
-1-
Nichia STSE-CC7085A
<Cat.No.070608>
3.OUTLINE DIMENSIONS AND MATERIALS
Please refer to figure’s page.
Material as follows ; Package
Encapsulating Resin
Electrodes
:
:
:
Heat-Resistant Polymer
Silicone Resin (with Diffused)
Ag Plating Copper Alloy
4.PACKAGING
· The LEDs are packed in cardboard boxes after taping.
Please refer to figure’s page.
The label on the minimum packing unit shows ; Part Number, Lot Number, Ranking, Quantity
· In order to protect the LEDs from mechanical shock, we pack them in cardboard boxes for transportation.
· The LEDs may be damaged if the boxes are dropped or receive a strong impact against them,
so precautions must be taken to prevent any damage.
· The boxes are not water resistant and therefore must be kept away from water and moisture.
· When the LEDs are transported, we recommend that you use the same packing method as Nichia.
5.LOT NUMBER
The first six digits number shows
lot number.
The lot number is composed of the following characters;
-
- Year
( 6 for 2006, 7 for 2007 )
- Month ( 1 for Jan., 9 for Sep., A for Oct.,
- Nichia's Product Number
- Ranking by Color Coordinates
- Ranking by Luminous Flux
- Ranking by Forward Voltage
B for Nov. )
-2-
Nichia STSE-CC7085A
<Cat.No.070608>
6.RELIABILITY
(1) TEST ITEMS AND RESULTS
Test Item
Resistance to
Soldering Heat
(Reflow Soldering)
Solderability
(Reflow Soldering)
Thermal Shock
Temperature Cycle
Moisture Resistance Cyclic
High Temperature Storage
Temperature Humidity
Storage
Low Temperature Storage
Steady State Operating Life
Steady State Operating Life
of High Temperature
Steady State Operating Life
of High Humidity Heat
Steady State Operating Life
of Low Temperature
Vibration
Standard
Test Method
JEITA ED-4701
300 301
JEITA ED-4701
300 303
JEITA ED-4701
300 307
JEITA ED-4701
100 105
JEITA ED-4701
200 203
JEITA ED-4701
200 201
JEITA ED-4701
100 103
JEITA ED-4701
200 202
Test Conditions
Tsld=260°C, 10sec.
(Pre treatment 30°C,70%,168hrs.)
Tsld=215 ± 5°C, 3sec.
(Lead Solder)
0°C ~ 100°C
15sec. 15sec.
-40°C ~ 25°C ~ 100°C ~ 25°C
30min. 5min. 30min. 5min.
25°C ~ 65°C ~ -10°C
90%RH 24hrs./1cycle
Ta=100°C
Ta=60°C, RH=90%
Ta=-40°C
Ta=25°C, I
F
=350mA
Tested with Nichia standard circuit board.
Note
2 times
Number of
Damaged
0/22
1 time
over 95%
20 cycles
100 cycles
10 cycles
1000 hrs.
1000 hrs.
1000 hrs.
1000 hrs.
1000 hrs.
500 hrs.
1000 hrs.
48min.
0/22
0/50
0/50
0/22
0/22
0/22
0/22
0/22
0/22
0/22
0/22
0/22
Ta=85°C, I
F
=160mA
Tested with Nichia standard circuit board.
60°C, RH=90%, I
F
=250mA
Tested with Nichia standard circuit board.
Ta=-30°C, I
F
=300mA
Tested with Nichia standard circuit board.
JEITA ED-4701
400 403
JEITA ED-4702
JEITA ED-4702
JEITA ED-4701
300 304
Substrate Bending
Adhesion Strength
Electrostatic Discharges
100 ~ 2000 ~ 100Hz Sweep 4min.
200m/s
2
3directions, 4cycles
3mm, 5 ± 1 sec.
5N,
10 ± 1 sec.
1 time
1 time
3 times
Negative/Positive
0/22
0/22
0/22
R=1.5kΩ, C=100pF
Test Voltage=2kV
Thermal resistance of LED with Nichia standard circuit board : Rja
≒
65°C/W
Nichia standard circuit board : FR4, t=1.6mm, Copper foil, t=0.07mm
(2) CRITERIA FOR JUDGING DAMAGE
Item
Symbol Test Conditions
Forward Voltage
V
F
I
F
=300mA
-
Initial Level
Luminous Flux
φv
I
F
=300mA
Initial Level 0.7
-
The test is performed after the board is cooled down to the room temperature.
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Criteria for Judgement
Min.
Max.
1.1
Nichia STSE-CC7085A-1
<Cat.No.071213>
7.CAUTIONS
(1) Moisture Proof Package
· When moisture is absorbed into the SMT package it may vaporize and expand during soldering.
There is a possibility that this can cause exfoliation of the contacts and damage the optical
characteristics of the LEDs.
For this reason, the moisture proof package is used to keep moisture
to a minimum in the package.
· The moisture proof package is made of an aluminum moisture proof bag. A package of
a moisture absorbent material (silica gel) is inserted into the aluminium moisture proof bag.
The silica gel changes its color from blue to pink as it absorbs moisture.
(2) Storage
· Storage Conditions
Before opening the package :
The LEDs should be kept at 30°C or less and 90%RH or less. The LEDs should be used within
a year.
When storing the LEDs, moisture proof packaging with absorbent material (silica gel)
is recommended.
After opening the package :
The LEDs should be kept at 30°C or less and 70%RH or less. The LEDs should be soldered
within 168 hours (7days) after opening the package.
If unused LEDs remain, they should be
stored in the moisture proof packages, such as sealed containers with packages of moisture
absorbent material (silica gel).
It is also recommended to return the LEDs to the original
moisture proof bag and to reseal the moisture proof bag again.
· If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage
time, baking treatment should be performed using the following condition.
Baking treatment : more than 24 hours at 65 ± 5°C
· This product has silver plated metal parts that are inside and/or outside the package body. The silver
plating becomes tarnished when being exposed to an environment which contains corrosive gases.
Any LED with tarnished leads may lead to poor solderability and deterioration of optical characteristics.
Please do not expose the LEDs to corrosive atmosphere during storage.
· After assembly and during use, silver plating can be affected by the corrosive gases emitted by
components and materials in close proximity of the LEDs within an end product, and the gases entering
into the product from the external atmosphere. The above should be taken into consideration when
designing.
· Please avoid rapid transitions in ambient temperature, especially in high humidity environments where
condensation can occur.
(3) Recommended circuit
· In designing a circuit, the current through each LED must not exceed its absolute maximum rating.
It is recommended to use Circuit B which regulates the current flowing through each LED.
In the meanwhile, when driving LEDs with a constant voltage in Circuit A, the current through
the LEDs may vary due to the variation in forward voltage (V
F
) of the LEDs. In the worst case,
some LED may be subjected to stresses in excess of the absolute maximum rating.
(A)
...
(B)
...
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