IC,LOGIC GATE,HEX 2-INPUT NAND,AS-TTL,DIP,20PIN,CERAMIC
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
包装说明 | DIP, DIP20,.3 |
Reach Compliance Code | unknown |
JESD-30 代码 | R-XDIP-T20 |
JESD-609代码 | e0 |
逻辑集成电路类型 | NAND GATE |
端子数量 | 20 |
最高工作温度 | 70 °C |
最低工作温度 | |
封装主体材料 | CERAMIC |
封装代码 | DIP |
封装等效代码 | DIP20,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
电源 | 5 V |
最大电源电流(ICC) | 27 mA |
认证状态 | Not Qualified |
施密特触发器 | NO |
标称供电电压 (Vsup) | 5 V |
表面贴装 | NO |
技术 | TTL |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
Base Number Matches | 1 |
DM74AS804BJ | DM54AS804BJ/883B | DM54AS804BJ/883C | DM54AS804BJ/883 | DM74AS804AN/B+ | |
---|---|---|---|---|---|
描述 | IC,LOGIC GATE,HEX 2-INPUT NAND,AS-TTL,DIP,20PIN,CERAMIC | IC,LOGIC GATE,HEX 2-INPUT NAND,AS-TTL,DIP,20PIN,CERAMIC | IC,LOGIC GATE,HEX 2-INPUT NAND,AS-TTL,DIP,20PIN,CERAMIC | IC,LOGIC GATE,HEX 2-INPUT NAND,AS-TTL,DIP,20PIN,CERAMIC | IC,LOGIC GATE,HEX 2-INPUT NAND,AS-TTL,DIP,20PIN,PLASTIC |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
包装说明 | DIP, DIP20,.3 | DIP, DIP20,.3 | DIP, DIP20,.3 | DIP, DIP20,.3 | DIP, DIP20,.3 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
JESD-30 代码 | R-XDIP-T20 | R-XDIP-T20 | R-XDIP-T20 | R-XDIP-T20 | R-PDIP-T20 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 |
逻辑集成电路类型 | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE |
端子数量 | 20 | 20 | 20 | 20 | 20 |
最高工作温度 | 70 °C | 125 °C | 125 °C | 125 °C | 70 °C |
最低工作温度 | - | -55 °C | -55 °C | -55 °C | - |
封装主体材料 | CERAMIC | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY |
封装代码 | DIP | DIP | DIP | DIP | DIP |
封装等效代码 | DIP20,.3 | DIP20,.3 | DIP20,.3 | DIP20,.3 | DIP20,.3 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V |
最大电源电流(ICC) | 27 mA | 27 mA | 27 mA | 27 mA | 27 mA |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
施密特触发器 | NO | NO | NO | NO | NO |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | NO | NO | NO |
技术 | TTL | TTL | TTL | TTL | TTL |
温度等级 | COMMERCIAL | MILITARY | MILITARY | MILITARY | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
Base Number Matches | 1 | 1 | 1 | 1 | - |
筛选级别 | - | 38535Q/M;38534H;883B | MIL-STD-883 Class C | 38535Q/M;38534H;883B | - |
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