Dual-Slot PCI Express Hot-Plug Controller
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 包装说明 | TFQFP, |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| 可调阈值 | YES |
| 模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT |
| JESD-30 代码 | S-PQFP-G48 |
| JESD-609代码 | e0 |
| 长度 | 7 mm |
| 湿度敏感等级 | 3 |
| 信道数量 | 1 |
| 功能数量 | 2 |
| 端子数量 | 48 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TFQFP |
| 封装形状 | SQUARE |
| 封装形式 | FLATPACK, THIN PROFILE, FINE PITCH |
| 峰值回流温度（摄氏度） | 240 |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.2 mm |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 3 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 温度等级 | COMMERCIAL |
| 端子面层 | TIN LEAD |
| 端子形式 | GULL WING |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 7 mm |
| Base Number Matches | 1 |
| MIC2591B-3BTQ | MIC2591B | MIC2591B-2BTQ | MIC2591B-5BTQ | MIC2591B-5YTQ | MIC2591B-3YTQ | |
|---|---|---|---|---|---|---|
| 描述 | Dual-Slot PCI Express Hot-Plug Controller | Dual-Slot PCI Express Hot-Plug Controller | Dual-Slot PCI Express Hot-Plug Controller | Dual-Slot PCI Express Hot-Plug Controller | Dual-Slot PCI Express Hot-Plug Controller | Dual-Slot PCI Express Hot-Plug Controller |
| 是否Rohs认证 | 不符合 | - | 不符合 | 不符合 | 符合 | 符合 |
| 包装说明 | TFQFP, | - | TFQFP, TQFP48,.35SQ | TFQFP, | TFQFP, | TFQFP, |
| Reach Compliance Code | compli | - | compli | compliant | compli | compli |
| ECCN代码 | EAR99 | - | EAR99 | EAR99 | EAR99 | EAR99 |
| 可调阈值 | YES | - | YES | YES | YES | YES |
| 模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT | - | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT |
| JESD-30 代码 | S-PQFP-G48 | - | S-PQFP-G48 | S-PQFP-G48 | S-PQFP-G48 | S-PQFP-G48 |
| JESD-609代码 | e0 | - | e0 | e0 | e3 | e3 |
| 长度 | 7 mm | - | 7 mm | 7 mm | 7 mm | 7 mm |
| 湿度敏感等级 | 3 | - | 3 | 3 | 3 | 3 |
| 信道数量 | 1 | - | 1 | 1 | 1 | 1 |
| 功能数量 | 2 | - | 2 | 2 | 2 | 2 |
| 端子数量 | 48 | - | 48 | 48 | 48 | 48 |
| 最高工作温度 | 70 °C | - | 70 °C | 70 °C | 70 °C | 70 °C |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TFQFP | - | TFQFP | TFQFP | TFQFP | TFQFP |
| 封装形状 | SQUARE | - | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | FLATPACK, THIN PROFILE, FINE PITCH | - | FLATPACK, THIN PROFILE, FINE PITCH | FLATPACK, THIN PROFILE, FINE PITCH | FLATPACK, THIN PROFILE, FINE PITCH | FLATPACK, THIN PROFILE, FINE PITCH |
| 峰值回流温度（摄氏度） | 240 | - | 240 | 240 | 260 | 260 |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.2 mm | - | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm |
| 最大供电电压 (Vsup) | 3.6 V | - | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 3 V | - | 3 V | 3 V | 3 V | 3 V |
| 标称供电电压 (Vsup) | 3.3 V | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | - | YES | YES | YES | YES |
| 温度等级 | COMMERCIAL | - | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | TIN LEAD | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | MATTE TIN | MATTE TIN |
| 端子形式 | GULL WING | - | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.5 mm | - | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | QUAD | - | QUAD | QUAD | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | 30 | - | 30 | 30 | 40 | 40 |
| 宽度 | 7 mm | - | 7 mm | 7 mm | 7 mm | 7 mm |
| 厂商名称 | - | - | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) |
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