4-CHANNEL, SGL ENDED MULTIPLEXER, PDSO14, SOIC-14
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 零件包装代码 | SOIC |
| 包装说明 | SOP, |
| 针数 | 14 |
| Reach Compliance Code | compliant |
| 模拟集成电路 - 其他类型 | SINGLE-ENDED MULTIPLEXER |
| JESD-30 代码 | R-PDSO-G14 |
| JESD-609代码 | e0 |
| 长度 | 8.65 mm |
| 信道数量 | 4 |
| 功能数量 | 1 |
| 端子数量 | 14 |
| 标称断态隔离度 | 50 dB |
| 通态电阻匹配规范 | 30 Ω |
| 最大通态电阻 (Ron) | 200 Ω |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | 240 |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.75 mm |
| 最大供电电压 (Vsup) | 12 V |
| 最小供电电压 (Vsup) | 2 V |
| 标称供电电压 (Vsup) | 4.5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | TIN LEAD |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 3.9 mm |
| Base Number Matches | 1 |
| MC74HC4006ADR2 | MC74HC4006ADR2G | MC74HC4006AD | MC74HC4006ADTR2 | MC74HC4006ANG | MC74HC4006AFELG | MC74HC4006AN | MC74HC4006AFEL | |
|---|---|---|---|---|---|---|---|---|
| 描述 | 4-CHANNEL, SGL ENDED MULTIPLEXER, PDSO14, SOIC-14 | 4-CHANNEL, SGL ENDED MULTIPLEXER, PDSO14, LEAD FREE, SOIC-14 | 4-CHANNEL, SGL ENDED MULTIPLEXER, PDSO14, SOIC-14 | IC 4-CHANNEL, SGL ENDED MULTIPLEXER, PDSO14, LEAD FREE, TSSOP-14, Multiplexer or Switch | 4-CHANNEL, SGL ENDED MULTIPLEXER, PDIP14, LEAD FREE, PLASTIC, DIP-14 | 4-CHANNEL, SGL ENDED MULTIPLEXER, PDSO14, LEAD FREE, SOIC EIAJ-14 | IC 4-CHANNEL, SGL ENDED MULTIPLEXER, PDIP14, PLASTIC, DIP-14, Multiplexer or Switch | 4-CHANNEL, SGL ENDED MULTIPLEXER, PDSO14, SOIC EIAJ-14 |
| 是否无铅 | 含铅 | 不含铅 | 含铅 | 含铅 | 不含铅 | 不含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 符合 | 不符合 | 不符合 | 符合 | 符合 | 不符合 | 不符合 |
| 零件包装代码 | SOIC | SOIC | SOIC | TSSOP | DIP | SOIC | DIP | SOIC |
| 包装说明 | SOP, | SOP, | SOP, | TSSOP, | DIP, | SOP, | PLASTIC, DIP-14 | SOIC EIAJ-14 |
| 针数 | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compli |
| 模拟集成电路 - 其他类型 | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER |
| JESD-30 代码 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDIP-T14 | R-PDSO-G14 | R-PDIP-T14 | R-PDSO-G14 |
| JESD-609代码 | e0 | e3 | e0 | e0 | e3 | e4 | e0 | e0 |
| 长度 | 8.65 mm | 8.65 mm | 8.65 mm | 5 mm | 18.48 mm | 10.2 mm | 18.48 mm | 10.2 mm |
| 信道数量 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
| 标称断态隔离度 | 50 dB | 50 dB | 50 dB | 50 dB | 50 dB | 50 dB | 50 dB | 50 dB |
| 通态电阻匹配规范 | 30 Ω | 30 Ω | 30 Ω | 30 Ω | 30 Ω | 30 Ω | 30 Ω | 30 Ω |
| 最大通态电阻 (Ron) | 200 Ω | 200 Ω | 200 Ω | 200 Ω | 200 Ω | 200 Ω | 200 Ω | 200 Ω |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | SOP | SOP | TSSOP | DIP | SOP | DIP | SOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | IN-LINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | 240 | 260 | 240 | 240 | NOT SPECIFIED | 260 | NOT SPECIFIED | 225 |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.75 mm | 1.75 mm | 1.75 mm | 1.2 mm | 4.69 mm | 2.05 mm | 4.69 mm | 2.05 mm |
| 最大供电电压 (Vsup) | 12 V | 12 V | 12 V | 12 V | 12 V | 12 V | 12 V | 12 V |
| 最小供电电压 (Vsup) | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V |
| 标称供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 表面贴装 | YES | YES | YES | YES | NO | YES | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子面层 | TIN LEAD | MATTE TIN | TIN LEAD | TIN LEAD | MATTE TIN | NICKEL PALLADIUM GOLD | TIN LEAD | TIN LEAD |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | THROUGH-HOLE | GULL WING |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 0.65 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | 40 | 30 | 30 | NOT SPECIFIED | 40 | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 3.9 mm | 3.9 mm | 3.9 mm | 4.4 mm | 7.62 mm | 5.275 mm | 7.62 mm | 5.275 mm |
| 厂商名称 | - | ON Semiconductor(安森美) | - | ON Semiconductor(安森美) | ON Semiconductor(安森美) | ON Semiconductor(安森美) | ON Semiconductor(安森美) | ON Semiconductor(安森美) |
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