1-CH 10-BIT FLASH METHOD ADC, PARALLEL ACCESS, PDSO28, PLASTIC, MO-153AE, TSSOP-28
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
零件包装代码 | TSSOP |
包装说明 | TSSOP, |
针数 | 28 |
Reach Compliance Code | unknown |
转换器类型 | ADC, FLASH METHOD |
JESD-30 代码 | R-PDSO-G28 |
JESD-609代码 | e0 |
长度 | 9.7 mm |
最大线性误差 (EL) | 0.1172% |
湿度敏感等级 | 1 |
模拟输入通道数量 | 1 |
位数 | 10 |
功能数量 | 1 |
端子数量 | 28 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
输出位码 | OFFSET BINARY, 2'S COMPLEMENT BINARY |
输出格式 | PARALLEL, WORD |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TSSOP |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度) | 240 |
采样速率 | 80 MHz |
采样并保持/跟踪并保持 | SAMPLE |
座面最大高度 | 1.2 mm |
标称供电电压 | 3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | TIN LEAD |
端子形式 | GULL WING |
端子节距 | 0.65 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | 30 |
宽度 | 4.4 mm |
Base Number Matches | 1 |
AD9215BRU-80 | AD9215BRURL7-65 | AD9215BRURL7-80 | AD9215BRU-105 | AD9215BRU-65 | AD9215BCP-105 | AD9215BCP-65 | AD9215BCP-80 | |
---|---|---|---|---|---|---|---|---|
描述 | 1-CH 10-BIT FLASH METHOD ADC, PARALLEL ACCESS, PDSO28, PLASTIC, MO-153AE, TSSOP-28 | 1-CH 10-BIT FLASH METHOD ADC, PARALLEL ACCESS, PDSO28, PLASTIC, MO-153AE, TSSOP-28 | 1-CH 10-BIT FLASH METHOD ADC, PARALLEL ACCESS, PDSO28, PLASTIC, MO-153AE, TSSOP-28 | 1-CH 10-BIT FLASH METHOD ADC, PARALLEL ACCESS, PDSO28, PLASTIC, MO-153AE, TSSOP-28 | 1-CH 10-BIT FLASH METHOD ADC, PARALLEL ACCESS, PDSO28, PLASTIC, MO-153AE, TSSOP-28 | 1-CH 10-BIT FLASH METHOD ADC, PARALLEL ACCESS, QCC32, MO-220-VHHD-2, LFCSP-32 | 1-CH 10-BIT FLASH METHOD ADC, PARALLEL ACCESS, QCC32, MO-220-VHHD-2, LFCSP-32 | 1-CH 10-BIT FLASH METHOD ADC, PARALLEL ACCESS, QCC32, MO-220-VHHD-2, LFCSP-32 |
是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
零件包装代码 | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP | QFN | QFN | QFN |
包装说明 | TSSOP, | TSSOP, | TSSOP, | TSSOP, | TSSOP, | VQCCN, | VQCCN, | VQCCN, |
针数 | 28 | 28 | 28 | 28 | 28 | 32 | 32 | 32 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknow |
转换器类型 | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD |
JESD-30 代码 | R-PDSO-G28 | R-PDSO-G28 | R-PDSO-G28 | R-PDSO-G28 | R-PDSO-G28 | S-XQCC-N32 | S-XQCC-N32 | S-XQCC-N32 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
长度 | 9.7 mm | 9.7 mm | 9.7 mm | 9.7 mm | 9.7 mm | 5 mm | 5 mm | 5 mm |
最大线性误差 (EL) | 0.1172% | 0.1172% | 0.1172% | 0.1172% | 0.1172% | 0.1172% | 0.1172% | 0.1172% |
湿度敏感等级 | 1 | NOT SPECIFIED | NOT SPECIFIED | 1 | 1 | 3 | 3 | 3 |
模拟输入通道数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
位数 | 10 | 10 | 10 | 10 | 10 | 10 | 10 | 10 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 28 | 28 | 28 | 28 | 28 | 32 | 32 | 32 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
输出位码 | OFFSET BINARY, 2'S COMPLEMENT BINARY | OFFSET BINARY, 2'S COMPLEMENT BINARY | OFFSET BINARY, 2'S COMPLEMENT BINARY | OFFSET BINARY, 2'S COMPLEMENT BINARY | OFFSET BINARY, 2'S COMPLEMENT BINARY | OFFSET BINARY, 2\'S COMPLEMENT BINARY | OFFSET BINARY, 2\'S COMPLEMENT BINARY | OFFSET BINARY, 2\'S COMPLEMENT BINARY |
输出格式 | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
封装代码 | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP | VQCCN | VQCCN | VQCCN |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | SQUARE |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | CHIP CARRIER, VERY THIN PROFILE | CHIP CARRIER, VERY THIN PROFILE | CHIP CARRIER, VERY THIN PROFILE |
峰值回流温度(摄氏度) | 240 | NOT APPLICABLE | NOT APPLICABLE | 240 | 240 | 240 | 240 | 240 |
采样速率 | 80 MHz | 65 MHz | 80 MHz | 105 MHz | 65 MHz | 105 MHz | 65 MHz | 80 MHz |
采样并保持/跟踪并保持 | SAMPLE | SAMPLE | SAMPLE | SAMPLE | SAMPLE | SAMPLE | SAMPLE | SAMPLE |
座面最大高度 | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1 mm | 1 mm | 1 mm |
标称供电电压 | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | NO LEAD | NO LEAD | NO LEAD |
端子节距 | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.5 mm | 0.5 mm | 0.5 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | QUAD | QUAD | QUAD |
处于峰值回流温度下的最长时间 | 30 | NOT APPLICABLE | NOT APPLICABLE | 30 | 30 | 30 | 30 | 30 |
宽度 | 4.4 mm | 4.4 mm | 4.4 mm | 4.4 mm | 4.4 mm | 5 mm | 5 mm | 5 mm |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | - | - | - |
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