Flash, 16MX1, PDSO8, 8 X 6 MM, LEAD FREE, PLASTIC, WSON-8
参数名称 | 属性值 |
是否Rohs认证 | 符合 |
零件包装代码 | SON |
包装说明 | HVSON, |
针数 | 8 |
Reach Compliance Code | compliant |
ECCN代码 | EAR99 |
最大时钟频率 (fCLK) | 50 MHz |
JESD-30 代码 | R-PDSO-N8 |
JESD-609代码 | e3 |
长度 | 8 mm |
内存密度 | 16777216 bit |
内存集成电路类型 | FLASH |
内存宽度 | 1 |
湿度敏感等级 | 3 |
功能数量 | 1 |
端子数量 | 8 |
字数 | 16777216 words |
字数代码 | 16000000 |
工作模式 | SYNCHRONOUS |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
组织 | 16MX1 |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | HVSON |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
并行/串行 | SERIAL |
峰值回流温度(摄氏度) | 260 |
编程电压 | 3 V |
认证状态 | Not Qualified |
座面最大高度 | 0.8 mm |
最大供电电压 (Vsup) | 3.6 V |
最小供电电压 (Vsup) | 2.7 V |
标称供电电压 (Vsup) | 3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | MATTE TIN |
端子形式 | NO LEAD |
端子节距 | 1.27 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | 40 |
类型 | NOR TYPE |
宽度 | 6 mm |
Base Number Matches | 1 |
S25FL016M0LNFI003 | S25FL016M0LMAI001 | S25FL016M0LNAI001 | S25FL016M0LMFI001 | S25FL016M0LNAI003 | S25FL016M0LMAI003 | S25FL016M0LMFI003 | S25FL016M0LNFI001 | |
---|---|---|---|---|---|---|---|---|
描述 | Flash, 16MX1, PDSO8, 8 X 6 MM, LEAD FREE, PLASTIC, WSON-8 | Flash, 16MX1, PDSO16, 0.300 INCH, PLASTIC, MS-013AA, SO-16 | Flash, 16MX1, PDSO8, 8 X 6 MM, PLASTIC, WSON-8 | Flash, 16MX1, PDSO16, 0.300 INCH, LEAD FREE, PLASTIC, MS-013AA, SO-16 | Flash, 16MX1, PDSO8, 8 X 6 MM, PLASTIC, WSON-8 | Flash, 16MX1, PDSO16, 0.300 INCH, PLASTIC, MS-013AA, SO-16 | Flash, 16MX1, PDSO16, 0.300 INCH, LEAD FREE, PLASTIC, MS-013AA, SO-16 | Flash, 16MX1, PDSO8, 8 X 6 MM, LEAD FREE, PLASTIC, WSON-8 |
是否Rohs认证 | 符合 | 不符合 | 不符合 | 符合 | 不符合 | 不符合 | 符合 | 符合 |
零件包装代码 | SON | SOIC | SON | SOIC | SON | SOIC | SOIC | SON |
包装说明 | HVSON, | SOP, | HVSON, | SOP, | HVSON, | SOP, | SOP, | HVSON, |
针数 | 8 | 16 | 8 | 16 | 8 | 16 | 16 | 8 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
最大时钟频率 (fCLK) | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz |
JESD-30 代码 | R-PDSO-N8 | R-PDSO-G16 | R-PDSO-N8 | R-PDSO-G16 | R-PDSO-N8 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-N8 |
JESD-609代码 | e3 | e0 | e0 | e3 | e0 | e0 | e3 | e3 |
长度 | 8 mm | 10.3 mm | 8 mm | 10.3 mm | 8 mm | 10.3 mm | 10.3 mm | 8 mm |
内存密度 | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit |
内存集成电路类型 | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH |
内存宽度 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 8 | 16 | 8 | 16 | 8 | 16 | 16 | 8 |
字数 | 16777216 words | 16777216 words | 16777216 words | 16777216 words | 16777216 words | 16777216 words | 16777216 words | 16777216 words |
字数代码 | 16000000 | 16000000 | 16000000 | 16000000 | 16000000 | 16000000 | 16000000 | 16000000 |
工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
组织 | 16MX1 | 16MX1 | 16MX1 | 16MX1 | 16MX1 | 16MX1 | 16MX1 | 16MX1 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | HVSON | SOP | HVSON | SOP | HVSON | SOP | SOP | HVSON |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
峰值回流温度(摄氏度) | 260 | 240 | 240 | 260 | 240 | 240 | 260 | 260 |
编程电压 | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 0.8 mm | 2.65 mm | 0.8 mm | 2.65 mm | 0.8 mm | 2.65 mm | 2.65 mm | 0.8 mm |
最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
最小供电电压 (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
标称供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | MATTE TIN | TIN LEAD | TIN LEAD | MATTE TIN | TIN LEAD | TIN LEAD | MATTE TIN | MATTE TIN |
端子形式 | NO LEAD | GULL WING | NO LEAD | GULL WING | NO LEAD | GULL WING | GULL WING | NO LEAD |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | 40 | 30 | 30 | 40 | 30 | 30 | 40 | 40 |
类型 | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE |
宽度 | 6 mm | 7.5 mm | 6 mm | 7.5 mm | 6 mm | 7.5 mm | 7.5 mm | 6 mm |
厂商名称 | - | - | SPANSION | SPANSION | SPANSION | SPANSION | SPANSION | SPANSION |
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