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MAX9890BEBL+TG29

产品描述Consumer Circuit,
产品类别其他集成电路(IC)    消费电路   
文件大小1MB,共12页
制造商Maxim(美信半导体)
官网地址https://www.maximintegrated.com/en.html
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MAX9890BEBL+TG29概述

Consumer Circuit,

MAX9890BEBL+TG29规格参数

参数名称属性值
包装说明,
Reach Compliance Codeunknown
商用集成电路类型CONSUMER CIRCUIT
Base Number Matches1

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EVALUATION KIT AVAILABLE
MAX9890
Audio Click-Pop Suppressor
General Description
The MAX9890 provides click-and-pop suppression for
devices such as CODECs with test integrated headphone
amplifiers that lack a clickless/popless startup/power-up
or shutdown/power-down. The device controls the ramp-
ing of the DC bias voltage on the output-coupling capaci-
tors and the application of the audio signal to ensure that
no audible transients are present at the headphones. The
MAX9890A features a 200ms startup time for use with up
to 100μF coupling capacitors. The MAX9890B features
a 330ms startup time for use with greater than 100μF
coupling capacitors.
The MAX9890 consumes 14μA of supply current and
0.001μA in shutdown, while contributing less than 0.003%
THD+N into a 32Ω load. ESD (Human Body Model) pro-
tection circuitry on the outputs protect the MAX9890 and
devices further up the signal chain from ESD strikes up
to ±8kV.
The MAX9890 is available in a miniature (1.5mm x 1.5mm
x 0.6mm) 9-bump chip-scale package (UCSP™), as well
as an 8-pin TDFN package (3mm x 3mm x 0.8mm), and is
specified for operation over the -40°C to +85°C extended
temperature range.
Features
● 36dB Click-Pop Suppression
● 2.7V to 5.5V Single-Supply Operation
● Clickless/Popless Startup/Power-Up and
Shutdown/Power-Down
● 0.001μA Low-Power Shutdown Mode
● THD+N < 0.003% Into 32Ω
● ±8kV ESD Protected Outputs (Human Body Model)
● Requires Only One 0.1μF Capacitor to Complete the
Circuit
● Low 14μA Supply Current
● Tiny Packaging
9-Bump UCSP (1.5mm x 1.5mm x 0.6mm)
8-Pin TDFN (3mm x 3mm x 0.8mm)
Ordering Information
PART
MAX9890AEBL+T
MAX9890AETA
MAX9890BEBL+T
MAX9890BETA
MAX9890BETA/V+
TEMP RANGE
PIN-
PACKAGE
TOP
MARK
ADV
AHA
ADW
AHB
BRQ
-40°C to +85°C 9 UCSP-9
-40°C to +85°C 8 TDFN-EP**
-40°C to +85°C 9 UCSP-9
-40°C to +85°C 8 TDFN-EP**
-40°C to +85°C 8 TDFN-EP**
Applications
High-End Notebook
Audio
● Portable DVD Players
● Portable MP3 Players
● PDAs
● Cell Phones
Simplified Block Diagram
SINGLE SUPPLY
2.7V TO 5.5V
**EP
= Exposed pad.
+ Denotes a lead(Pb)-free/RoHS-compliant package.
T = Tape and reel.
/V denotes an automotive qualified part that conforms to
AEC-Q100.
Selector Guide
OUTL
INL
PART
MAX9890AEBL+T
PIN-PACKAGE
9 UCSP-9
8 TDFN-EP
9 UCSP-9
8 TDFN-EP
8 TDFN-EP
SWITCH TURN-ON
TIME (ms)
200
200
330
330
330
RAMP
UP
RAMP
DOWN
MAX9890AETA
MAX9890BEBL+T
MAX9890BETA
MAX9890BETA/V+
INR
OUTR
MAX9890
Typical Application Circuit and Pin Configurations appear
at end of data sheet.
UCSP is a trademark of Maxim Integrated Products, Inc.
19-2932; Rev 4; 5/17

MAX9890BEBL+TG29相似产品对比

MAX9890BEBL+TG29 MAX9890BETA/V+T MAX9890BETA-T MAX9890AETA-T MAX9890AEBL+T MAX9890AETA+T MAX9890BETA/V+
描述 Consumer Circuit, IC codec audio i2s ulp tdfn Audio Amplifiers Audio Amplifiers IC SUPP CLICK-POP 9-UCSP IC SUPP CLICK-POP 8-TDFN Consumer Circuit, BICMOS, PDSO8, TDFN-8
包装说明 , , 3 X 3 MM, 0.80 MM HEIGHT, TDFN-8 3 X 3 MM, 0.80 MM HEIGHT, TDFN-8 VFBGA, BGA9,3X3,20 HVSON, SOLCC8,.12,25 HVSON,
Reach Compliance Code unknown compli not_compliant not_compliant compliant compliant compliant
商用集成电路类型 CONSUMER CIRCUIT CONSUMER CIRCUIT CONSUMER CIRCUIT CONSUMER CIRCUIT CONSUMER CIRCUIT CONSUMER CIRCUIT CONSUMER CIRCUIT
Base Number Matches 1 - 1 1 1 1 1
是否Rohs认证 - 符合 不符合 不符合 符合 符合 符合
峰值回流温度(摄氏度) - NOT SPECIFIED 245 245 260 260 NOT SPECIFIED
处于峰值回流温度下的最长时间 - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
是否无铅 - - 含铅 含铅 不含铅 不含铅 -
零件包装代码 - - DFN DFN BGA DFN -
针数 - - 8 8 9 8 -
JESD-30 代码 - - S-XDSO-N8 S-XDSO-N8 S-XBGA-B9 S-XDSO-N8 S-PDSO-N8
JESD-609代码 - - e0 e0 e3 e3 -
长度 - - 3 mm 3 mm 1.52 mm 3 mm 3 mm
湿度敏感等级 - - 1 1 1 1 -
功能数量 - - 1 1 1 1 1
端子数量 - - 8 8 9 8 8
最高工作温度 - - 85 °C 85 °C 85 °C 85 °C 85 °C
最低工作温度 - - -40 °C -40 °C -40 °C -40 °C -40 °C
封装主体材料 - - UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED PLASTIC/EPOXY
封装代码 - - HVSON HVSON VFBGA HVSON HVSON
封装等效代码 - - SOLCC8,.12,25 SOLCC8,.12,25 BGA9,3X3,20 SOLCC8,.12,25 -
封装形状 - - SQUARE SQUARE SQUARE SQUARE SQUARE
封装形式 - - SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE GRID ARRAY, VERY THIN PROFILE, FINE PITCH SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
电源 - - 3/5 V 3/5 V 3/5 V 3/5 V -
认证状态 - - Not Qualified Not Qualified Not Qualified Not Qualified -
座面最大高度 - - 0.8 mm 0.8 mm 0.69 mm 0.8 mm 0.8 mm
最大压摆率 - - 0.022 mA 0.022 mA 0.022 mA 0.022 mA -
最大供电电压 (Vsup) - - 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) - - 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V
表面贴装 - - YES YES YES YES YES
技术 - - BICMOS BICMOS BICMOS BICMOS BICMOS
温度等级 - - INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子面层 - - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Matte Tin (Sn) Matte Tin (Sn) -
端子形式 - - NO LEAD NO LEAD BALL NO LEAD NO LEAD
端子节距 - - 0.65 mm 0.65 mm 0.5 mm 0.65 mm 0.65 mm
端子位置 - - DUAL DUAL BOTTOM DUAL DUAL
宽度 - - 3 mm 3 mm 1.52 mm 3 mm 3 mm

 
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