These dual monolithic silicon TVS diodes are designed for
applications requiring transient overvoltage protection capability. They
are intended for use in voltage and ESD sensitive equipment such as
computers, printers, business machines, communication systems,
medical equipment and other applications. Their dual junction common
anode design protects two separate lines using only one package. These
devices are ideal for situations where board space is at a premium.
Specification Features:
1
2
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SOT−23
CASE 318
STYLE 12
PIN 1. CATHODE
2. CATHODE
3. ANODE
3
SOT−23 Package Allows Either Two Separate Unidirectional
Configurations or a Single Bidirectional Configuration
Working Peak Reverse Voltage Range
−
5.0 V to 24 V
Peak Power
−
300 Watt (8
X
20
ms)
Low Leakage
Flammability Rating UL 94 V−0
SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
These are Pb−Free Devices*
MARKING DIAGRAM
xxM MG
G
1
xxM = Device Code
xx = 05, 12, 15, 24, 36
M
= Date Code*
G
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or overbar may
vary depending upon manufacturing location.
Mechanical Characteristics:
CASE:
Void-Free, Transfer-Molded, Thermosetting Plastic Case
FINISH:
Corrosion Resistant Finish, Easily Solderable
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
260C for 10 Seconds
Package Designed for Optimal Automated Board Assembly
Small Package Size for High Density Applications
Available in 8 mm Tape and Reel
Use the Device Number to Order the 7 Inch/3,000 Unit Reel
Replace the “T1” with “T3” in the Device Number to Order the
13 Inch/10,000 Unit Reel
ORDERING INFORMATION
Device
SM05T1G
SZSM05T1G
SM12T1G
SM15T1G
SM24T1G
SM36T1G
Package
SOT−23
(Pb−Free)
SOT−23
(Pb−Free)
SOT−23
(Pb−Free)
SOT−23
(Pb−Free)
SOT−23
(Pb−Free)
SOT−23
(Pb−Free)
Shipping
†
3,000/Tape & Reel
3,000/Tape & Reel
3,000/Tape & Reel
3,000/Tape & Reel
3,000/Tape & Reel
3,000/Tape & Reel
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
Semiconductor Components Industries, LLC, 2012
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
February, 2012
−
Rev. 6
1
Publication Order Number:
SM05T1/D
SM05T1G Series, SZSM05T1G
MAXIMUM RATINGS
Rating
Peak Power Dissipation @ 20
ms
(Note 1) @ T
L
25C
IEC 61000−4−2 (ESD)
Air
Contact
IEC 61000−4−4 (EFT)
IEC 61000−4−5 (Lightening)
Total Power Dissipation on FR−5 Board (Note 2) @ T
A
= 25C
Derate above 25C
Thermal Resistance, Junction−to−Ambient
Total Power Dissipation on Alumina Substrate (Note 3) @ T
A
= 25C
Derate above 25C
Thermal Resistance, Junction−to−Ambient
Junction and Storage Temperature Range
Lead Solder Temperature
−
Maximum (10 Second Duration)
P
D
R
qJA
P
D
R
qJA
T
J
, T
stg
T
L
Symbol
P
pk
Value
300
15
8.0
40
12
225
1.8
556
300
2.4
417
−
55 to +150
260
A
A
mW
mW/C
C/W
mW
mW/C
C/W
C
C
Unit
W
kV
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Non−repetitive current pulse per Figure 3
2. FR−5 = 1.0 x 0.75 x 0.62 in.
3. Alumina = 0.4 x 0.3 x 0.024 in., 99.5% alumina
NOTE: Other voltages may be available upon request
ELECTRICAL CHARACTERISTICS
UNIDIRECTIONAL
(Circuit tied to Pins 1 and 3 or 2 and 3)
Symbol
I
PP
V
C
V
RWM
I
R
V
BR
I
T
QV
BR
I
F
V
F
Z
ZT
I
ZK
Z
ZK
Parameter
Maximum Reverse Peak Pulse Current
Clamping Voltage @ I
PP
Working Peak Reverse Voltage
Maximum Reverse Leakage Current @ V
RWM
Breakdown Voltage @ I
T
Test Current
Maximum Temperature Coefficient of V
BR
Forward Current
Forward Voltage @ I
F
Maximum Zener Impedance @ I
ZT
Reverse Current
Maximum Zener Impedance @ I
ZK
I
PP
V
C
V
BR
V
RWM
I
R
V
F
I
T
V
I
F
I
Uni−Directional TVS
ELECTRICAL CHARACTERISTICS
(T
A
= 25C unless otherwise noted)
V
BR
, Breakdown Voltage
V
RWM
Device*
SM05T1G
SM12T1G
SM15T1G
SM24T1G
SM36T1G
Device
Marking
05M
12M
15M
24M
36M
(Volts)
5
12
15
24
36
I
R
@ V
RWM
(mA)
10
1.0
1.0
1.0
1.0
Min
6.2
13.3
16.7
26.7
40.0
(Volts)
Max
7.3
15.75
19.6
31.35
46.95
I
T
mA
1.0
1.0
1.0
1.0
1.0
V
C
@
I
PP
=
1 Amp
(Volts)
9.8
19
24
43
60
Max I
PP
(Note 4)
(Amps)
17
12
10
5.0
4.0
Typical
Capacitance
(pF)
Pin 1 to 3
@ 0 Volts
225
95
100
60
45
4. 8
20
ms
pulse waveform per Figure 3
*Include SZ-prefix devices where applicable.
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2
SM05T1G Series, SZSM05T1G
TYPICAL CHARACTERISTICS
10
P
PP
, PEAK PULSE POWER (kW)
P
D
, POWER DISSIPATION (mW)
300
250
200
150
100
50
0
ALUMINA SUBSTRATE
1
0.1
FR−5 BOARD
0.01
0.1
1
100
10
t
p
, PULSE DURATION (ms)
1000
0
25
50
75
100
125
TEMPERATURE (C)
150
175
Figure 1. Non−Repetitive Peak Pulse Power
versus Pulse Time
Figure 2. Steady State Power Derating Curve
100
% OF PEAK PULSE CURRENT
90
80
70
60
50
40
30
20
10
0
0
t
r
PEAK VALUE I
RSM
@ 8
ms
C, CAPACITANCE (pF)
PULSE WIDTH (t
P
) IS DEFINED
AS THAT POINT WHERE THE
PEAK CURRENT DECAY = 8
ms
HALF VALUE I
RSM
/2 @ 20
ms
250
210
170
t
P
130
20
40
t, TIME (ms)
60
80
90
0
1
2
3
BIAS VOLTAGE (VOLTS)
4
5
Figure 3. 8
20
ms
Pulse Waveform
Figure 4. Typical Diode Capacitance (SM05)
100
90
C, CAPACITANCE (pF)
80
70
60
50
40
30
20
10
0
0
1
5
8
BIAS VOLTAGE (VOLTS)
12
Figure 5. Typical Diode Capacitance (SM12)
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3
SM05T1G Series, SZSM05T1G
TYPICAL COMMON ANODE APPLICATIONS
A quad junction common anode design in a SOT−23
package protects four separate lines using only one package.
This adds flexibility and creativity to PCB design especially
when board space is at a premium. Two simplified examples
of TVS applications are illustrated below.
Computer Interface Protection
A
KEYBOARD
TERMINAL
PRINTER
ETC.
B
I/O
C
D
FUNCTIONAL
DECODER
GND
SM05T1G
Series
Microprocessor Protection
V
DD
V
GG
ADDRESS BUS
RAM
ROM
DATA BUS
I/O
CPU
CLOCK
CONTROL BUS
SM05T1
Series
GND
SM05T1G
Series
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4
SM05T1G Series, SZSM05T1G
PACKAGE DIMENSIONS
SOT−23 (TO−236)
CASE 318−08
ISSUE AP
D
SEE VIEW C
3
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS.
DIM
A
A1
b
c
D
E
e
L
L1
H
E
q
MIN
0.89
0.01
0.37
0.09
2.80
1.20
1.78
0.10
0.35
2.10
0
MILLIMETERS
NOM
MAX
1.00
1.11
0.06
0.10
0.44
0.50
0.13
0.18
2.90
3.04
1.30
1.40
1.90
2.04
0.20
0.30
0.54
0.69
2.40
2.64
−−−
10
MIN
0.035
0.001
0.015
0.003
0.110
0.047
0.070
0.004
0.014
0.083
0
INCHES
NOM
0.040
0.002
0.018
0.005
0.114
0.051
0.075
0.008
0.021
0.094
−−−
MAX
0.044
0.004
0.020
0.007
0.120
0.055
0.081
0.012
0.029
0.104
10
E
1
2
HE
c
e
b
q
0.25
A
A1
L
L1
VIEW C
STYLE 12:
PIN 1. CATHODE
2. CATHODE
3. ANODE
SOLDERING FOOTPRINT
0.95
0.037
0.95
0.037
2.0
0.079
0.9
0.035
SCALE 10:1
0.8
0.031
mm
inches
ON Semiconductor
and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
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