0603 PACKAGE CHIP LED
(0.6mm HEIGHT)
TSP1-BF1608H6-L1M2Y
0603 Package Chip LED (0.6mm Height)
Features
•
Package in 8mm tape on 7" diameter reel
•
Compatible with automatic placement equipment
•
Compatible with infrared and vapor phase reflow
solder process
•
Mono-color type
•
RoHS Compliant
Applications
•
•
•
•
Backlighting in dashboard and switch
Telecommunication: indicator and backlighting in telephone and fax
Flat backlight for LCD, switch and symbol
General use
QSLP1BF1
Descriptions
•
The TSP1 SMD Taping is much smaller than lead frame type components, thus enable smaller
board size, higher packing density, reduced storage space and finally smaller equipment to be
obtained.
•
Besides, lightweight makes them ideal for miniature applications. etc.
Device Selection Guide
Chip
Part No.
TSP1-BF1608H6-L1M2Y
Material
InGaN
Emitted Color
Blue
Lens Color
Water Clear
TAITRON COMPONENTS INCORPORATED
www.taitroncomponents.com
Tel: (800)-247-2232
Fax: (800)-TAITFAX
(800)-TAITRON
(800)-824-8329
(661)-257-6060
(661)-257-6415
Rev. A/WW 2006-02-13
Page 1 of 9
0603 Package Chip LED (0.6mm Height)
TSP1-BF1608H6-L1M2Y
Absolute Maximum Ratings
(T
amb
=25°C)
Parameter
Reverse Voltage
Forward Current
Operating Temperature
Storage Temperature
Soldering Temperature
Electrostatic Discharge (HBM)
Power Dissipation
Peak Forward Current
(Duty 1/10 @1KHz)
Symbol
Value
5
25
-40 ~ +85
-40 ~ +90
Reflow soldering: 260 (for 10 seconds)
Hand soldering:
350 (for 3 seconds)
150
110
100
Unit
V
mA
°C
°C
°C
V
mW
mA
V
R
I
F
T
opr
T
stg
T
sol
ESD
P
d
I
FP
Electro-Optical Characteristics
(T
amb
=25°C)
Parameter
Luminous Intensity
Viewing Angle
Peak Wavelength
Dominant wavelength
Spectrum Radiation Bandwidth
Forward Voltage
Reverse Current
Symbol
Min.
11.5
-----
-----
465
-----
2.5
-----
Typ.
-----
120
468
-----
25
-----
-----
Max.
28.5
-----
-----
475
-----
3.1
50
Unit
mcd
deg
nm
Condition
I
V
2θ1/2
λ
p
λ
d
△λ
I
F
=5mA
nm
nm
V
µA
V
F
I
R
V
R
=5V
Notes:
1.
Tolerance of Luminous Intensity is ±10%
2.
Tolerance of Dominant Wavelength is ±1nm
3.
Tolerance of Forward Voltage is ±0.1V
Rev. A/WW 2006-02-10
www.taitroncomponents.com
Page 2 of 9
0603 Package Chip LED (0.6mm Height)
TSP1-BF1608H6-L1M2Y
Typical Electro-Optical Characteristics Curves
Relative luminous intensity
(%)
Spectrum Distribution
Forward Current I
F
(mA)
Wavelength
λp(nm)
Luminous Intensity vs. Ambient Temperature
Relative luminous intensity
(%)
Forward Current vs. Forward Voltage
Forward Voltage (V
F
)-volts
Luminous Intensity vs. Forward Current (T
a
=25°C)
Relative luminous intensity
(%)
Ambient Temperature T
a
(°C)
Forward Current Derating Curve
Forward Current I
F
(mA)
Forward Current I
F
(A)
Ambient Temperature T
a
(°C)
Radiation Diagram
Rev. A/WW 2006-02-10
www.taitroncomponents.com
Page 3 of 9
0603 Package Chip LED (0.6mm Height)
TSP1-BF1608H6-L1M2Y
Reliability Test Items and Conditions
The reliability of products shall be satisfied with items listed below.
Confidence level：90%
LTPD：10%
No.
Items
Test Condition
Temp.: 260°C ±5°C
Min. 5sec.
H: +100°C 15min
∫
5 min
L: -40°C 15min
H: +100°C 5min
∫
10 sec
L: -10°C 5min
Temp.: 100°C
Temp.: -40°C
I
F
= 20 mA
85°C / 85%RH
Test Hours /
Cycles
6 Min.
Sample
Size
22 PCS.
Ac/Re
1
Reflow Soldering
0/1
2
Temperature Cycle
300 Cycles
22 PCS.
0/1
3
Thermal Shock
300 Cycles
22 PCS.
0/1
4
5
6
7
High Temperature Storage
Low Temperature Storage
DC Operating Life
High Temperature / High Humidity
1000 Hrs.
1000 Hrs.
1000 Hrs.
1000 Hrs.
22 PCS.
22 PCS.
22 PCS.
22 PCS.
0/1
0/1
0/1
0/1
Rev. A/WW 2006-02-10
www.taitroncomponents.com
Page 4 of 9
0603 Package Chip LED (0.6mm Height)
TSP1-BF1608H6-L1M2Y
Package Dimensions
(In mm)
-
+
Note:
The tolerances unless mentioned is ±0.1mm
Rev. A/WW 2006-02-10
www.taitroncomponents.com
Page 5 of 9
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