SN54AHCT240WR概述

AHCT/VHCT SERIES, DUAL 4-BIT DRIVER, INVERTED OUTPUT, CDFP20, CERAMIC, FP-20

SN54AHCT240WR规格参数

参数名称	属性值
零件包装代码	DFP
包装说明	DFP,
针数	20
Reach Compliance Code	unknown
系列	AHCT/VHCT
JESD-30 代码	R-GDFP-F20
长度	13.09 mm
负载电容（CL）	50 pF
逻辑集成电路类型	BUS DRIVER
位数	4
功能数量	2
端口数量	2
端子数量	20
最高工作温度	125 °C
最低工作温度	-55 °C
输出特性	3-STATE
输出极性	INVERTED
封装主体材料	CERAMIC, GLASS-SEALED
封装代码	DFP
封装形状	RECTANGULAR
封装形式	FLATPACK
传播延迟（tpd）	9.5 ns
认证状态	Not Qualified
座面最大高度	2.54 mm
最大供电电压 (Vsup)	5.5 V
最小供电电压 (Vsup)	4.5 V
标称供电电压 (Vsup)	5 V
表面贴装	YES
技术	CMOS
温度等级	MILITARY
端子形式	FLAT
端子节距	1.27 mm
端子位置	DUAL
宽度	6.92 mm
Base Number Matches	1

SN54AHCT240WR相似产品对比

	SN54AHCT240WR	SN74AHCT240DBLE	SN74AHCT240DGV	SN74AHCT240DGVR	SN74AHCT240DGVRE4	SN54AHCT240FKR	SN54AHCT240FK
描述	AHCT/VHCT SERIES, DUAL 4-BIT DRIVER, INVERTED OUTPUT, CDFP20, CERAMIC, FP-20	Octal Buffers/Drivers With 3-State Outputs 20-SSOP -40 to 85	AHCT/VHCT SERIES, DUAL 4-BIT DRIVER, INVERTED OUTPUT, PDSO20, PLASTIC, TVSOP-20	AHCT/VHCT/VT SERIES, DUAL 4-BIT DRIVER, INVERTED OUTPUT, PDSO20, TVSOP-20	AHCT/VHCT/VT SERIES, DUAL 4-BIT DRIVER, INVERTED OUTPUT, PDSO20, TVSOP-20	AHCT/VHCT SERIES, DUAL 4-BIT DRIVER, INVERTED OUTPUT, CQCC20, CERAMIC, LCC-20	AHCT/VHCT SERIES, DUAL 4-BIT DRIVER, INVERTED OUTPUT, CQCC20, CERAMIC, LCC-20
零件包装代码	DFP	SSOP	SOIC	SOIC	SOIC	QLCC	QLCC
包装说明	DFP,	SSOP, SSOP20,.3	TSSOP, TSSOP20,.25,16	TSSOP, TSSOP20,.25,16	TSSOP, TSSOP20,.25,16	QCCN,	QCCN,
针数	20	20	20	20	20	20	20
Reach Compliance Code	unknown	not_compliant	unknown	compliant	compliant	unknown	unknown
系列	AHCT/VHCT	AHCT/VHCT/VT	AHCT/VHCT	AHCT/VHCT/VT	AHCT/VHCT/VT	AHCT/VHCT	AHCT/VHCT
JESD-30 代码	R-GDFP-F20	R-PDSO-G20	R-PDSO-G20	R-PDSO-G20	R-PDSO-G20	S-CQCC-N20	S-CQCC-N20
长度	13.09 mm	7.2 mm	5 mm	5 mm	5 mm	8.89 mm	8.89 mm
逻辑集成电路类型	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER
位数	4	4	4	4	4	4	4
功能数量	2	2	2	2	2	2	2
端口数量	2	2	2	2	2	2	2
端子数量	20	20	20	20	20	20	20
最高工作温度	125 °C	85 °C	85 °C	85 °C	85 °C	125 °C	125 °C
最低工作温度	-55 °C	-40 °C	-40 °C	-40 °C	-40 °C	-55 °C	-55 °C
输出特性	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
输出极性	INVERTED	INVERTED	INVERTED	INVERTED	INVERTED	INVERTED	INVERTED
封装主体材料	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
封装代码	DFP	SSOP	TSSOP	TSSOP	TSSOP	QCCN	QCCN
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE	SQUARE
封装形式	FLATPACK	SMALL OUTLINE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	CHIP CARRIER	CHIP CARRIER
传播延迟（tpd）	9.5 ns	9.5 ns	9.5 ns	9.5 ns	9.5 ns	9.5 ns	9.5 ns
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	2.54 mm	2 mm	1.2 mm	1.2 mm	1.2 mm	2.03 mm	2.03 mm
最大供电电压 (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
最小供电电压 (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
标称供电电压 (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V
表面贴装	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	MILITARY	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	MILITARY	MILITARY
端子形式	FLAT	GULL WING	GULL WING	GULL WING	GULL WING	NO LEAD	NO LEAD
端子节距	1.27 mm	0.65 mm	0.4 mm	0.4 mm	0.4 mm	1.27 mm	1.27 mm
端子位置	DUAL	DUAL	DUAL	DUAL	DUAL	QUAD	QUAD
宽度	6.92 mm	5.3 mm	4.4 mm	4.4 mm	4.4 mm	8.89 mm	8.89 mm
负载电容（CL）	50 pF	50 pF	-	50 pF	-	50 pF	50 pF
厂商名称	-	Texas Instruments(德州仪器)	Texas Instruments(德州仪器)	Texas Instruments(德州仪器)	Texas Instruments(德州仪器)	Texas Instruments(德州仪器)	Texas Instruments(德州仪器)
封装等效代码	-	SSOP20,.3	TSSOP20,.25,16	TSSOP20,.25,16	TSSOP20,.25,16	-	-

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