0805 PACKAGE CHIP LED
TSP2-XF2012A3
0805 Package Chip LED
Features
•
•
•
•
•
Package in 8mm tape on 7” diameter reel
Compatible with automatic placement equipment
Compatible with infrared and vapor phase reflow solder process
Mono-color type
RoHS compliance
QSLP2XF2
Applications
•
Automotive: Backlighting in dashboards and switch
•
Telecommunication: indicator and backlighting
in telephone and fax
•
Flat backlight for LCD, switches and symbols
•
General Use
Descriptions
•
This SMD Taping is much smaller than leaded components, thus enable smaller board higher packing
density, reduced storage space and finally smaller equipment to be obtained.
•
Light weight makes them ideal for miniature applications
Device Selection Guide
Chip
Part No.
Material
AlGaInP
Emitted Color
Super Yellow
Lens Color
TSP2-XF2012A3
Water Clear
TAITRON COMPONENTS INCORPORATED
www.taitroncomponents.com
Tel: (800)-247-2232 (800)-TAITRON (661)-257-6060
Fax: (800)-TAITFAX (800)-824-8329 (661)-257-6415
Rev. A/JY 2007-07-18
Page 1 of 7
0805 PACKAGE CHIP LED
TSP2-XF2012A3
Absolute Maximum Ratings
(T
a
=25°C)
Parameter
Reverse Voltage
Forward Current
Peak Forward Current
(Duty 1/10 @1KHz)
Power Dissipation
Electrostatic Discharge
Soldering Temperature
Operating Temperature
Storage Temperature
Symbol
Value
5
25
160
60
2000
260 (for 5 seconds)
-40 ~ +85
-40 ~ +90
Unit
V
mA
mA
mW
V
°C
°C
°C
V
R
I
F
I
F(Peak)
P
d
ESD
T
sol
T
opr
T
stg
Electro-Optical Characteristics
(T
a
=25°C)
Parameter
Luminous Intensity
Viewing Angle
Peak Wavelength
Dominant wavelength
Spectrum Radiation Bandwidth
Forward Voltage
Reverse Current
Symbol
Min.
-----
41
-----
-----
-----
-----
-----
-----
Typ.
4
64
140
591
589
15
2.0
-----
Max.
-----
-----
-----
-----
-----
-----
2.4
10
Unit
mcd
mcd
deg
nm
I
F
=20mA
nm
nm
V
μA
V
R
=5V
Condition
I
F
=2mA
I
V
2
θ
1/2
λ
p
λ
d
△λ
V
F
I
R
Rev. A/JY 2007-07-18
www.taitroncomponents.com
Page 2 of 7
0805 PACKAGE CHIP LED
TSP2-XF2012A3
Typical Electro-Optical Characteristics Curves
Spectrum Distribution
Relative luminous intensity
(%)
Forward Current vs. Forward Voltage
Wavelength
λp(nm)
Luminous Intensity vs. Ambient Temperature
Relative luminous intensity
(%)
Forward Current I
F
(mA)
Forward Voltage (V
F
)-volts
Luminous Intensity vs. Forward Current
Relative luminous intensity
(%)
Ambient Temperature T
a
(°C)
Forward Current Derating Curve
Forward Current I
F
(mA)
Forward Current I
F
(mA)
Ambient Temperature T
a
(°C)
Radiation Diagram (T
a
=25°C)
Rev. A/JY 2007-07-18
www.taitroncomponents.com
Page 3 of 7
0805 PACKAGE CHIP LED
TSP2-XF2012A3
Reliability Test Items and Conditions
The reliability of products shall be satisfied with items listed below.
Confidence level: 90%,
LTPD: 10%
Test Hours /
Cycles
5 Sec
50 Cycles
Sample
Size
76 PCS.
76 PCS.
No.
1
2
Solder Heat
Items
Test Condition
Temp.: 260°C ±5°C.
H: +85°C 30min
∫
5 min
L: -55°C 15min
H: +100°C 5min
∫
10 sec
L: -10°C 5min
Temp: 100°C
Temp: -55°C
I
F
= 20 mA
85°C / 85%RH
Ac/Re
0/1
0/1
Temperature Cycle
3
4
5
6
7
Thermal Shock
High Temperature Storage
Low Temperature Storage
DC Operating Life
High Temperature / High Humidity
50 Cycles
1000 Hrs.
1000 Hrs.
1000 Hrs.
1000 Hrs.
76 PCS.
76 PCS.
76 PCS.
76 PCS.
76 PCS.
0/1
0/1
0/1
0/1
0/1
Rev. A/JY 2007-07-18
www.taitroncomponents.com
Page 4 of 7
0805 PACKAGE CHIP LED
TSP2-XF2012A3
Package Dimensions
(In mm)
Note:
The tolerances unless mentioned is
±0.1mm,
Unit = mm
Carrier Tape Dimensions
Loaded quantity 3000pcs per reel (
In mm
)
Rev. A/JY 2007-07-18
www.taitroncomponents.com
Page 5 of 7
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