32-BIT, OTHER DSP, PBGA561, 0.80 MM PITCH, PLASTIC, BGA-561
| 参数名称 | 属性值 |
| 零件包装代码 | BGA |
| 包装说明 | FBGA, |
| 针数 | 561 |
| Reach Compliance Code | unknown |
| 地址总线宽度 | 14 |
| 桶式移位器 | NO |
| 边界扫描 | YES |
| 外部数据总线宽度 | 32 |
| 格式 | FIXED POINT |
| 内部总线架构 | MULTIPLE |
| JESD-30 代码 | S-PBGA-B561 |
| 长度 | 23 mm |
| 低功率模式 | YES |
| 端子数量 | 561 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | FBGA |
| 封装形状 | SQUARE |
| 封装形式 | GRID ARRAY, FINE PITCH |
| 认证状态 | Not Qualified |
| 座面最大高度 | 3.3 mm |
| 最大供电电压 | 1.155 V |
| 最小供电电压 | 1.045 V |
| 标称供电电压 | 1.1 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 端子形式 | BALL |
| 端子节距 | 0.8 mm |
| 端子位置 | BOTTOM |
| 宽度 | 23 mm |
| uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, OTHER |
| Base Number Matches | 1 |
| TMS320TCI6487GUN8 | TMS320TCI6487ZUN | TMS320TCI6487ZUN8 | TMS320TCI6487GUN | TMS320TCI6487CUN8 | |
|---|---|---|---|---|---|
| 描述 | 32-BIT, OTHER DSP, PBGA561, 0.80 MM PITCH, PLASTIC, BGA-561 | 32-BIT, OTHER DSP, PBGA561, 0.80 MM PITCH, LEAD FREE, PLASTIC, BGA-561 | IC 32-BIT, OTHER DSP, PBGA561, 0.80 MM PITCH, LEAD FREE, PLASTIC, BGA-561, Digital Signal Processor | 32-BIT, OTHER DSP, PBGA561, 0.80 MM PITCH, PLASTIC, BGA-561 | 32-BIT, OTHER DSP, PBGA561, 0.80 MM PITCH, LEAD FREE, PLASTIC, BGA-561 |
| 零件包装代码 | BGA | BGA | BGA | BGA | BGA |
| 包装说明 | FBGA, | FBGA, | FBGA, | FBGA, | FBGA, |
| 针数 | 561 | 561 | 561 | 561 | 561 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| 地址总线宽度 | 14 | 14 | 14 | 14 | 14 |
| 桶式移位器 | NO | NO | NO | NO | NO |
| 边界扫描 | YES | YES | YES | YES | YES |
| 外部数据总线宽度 | 32 | 32 | 32 | 32 | 32 |
| 格式 | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT |
| 内部总线架构 | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE |
| JESD-30 代码 | S-PBGA-B561 | S-PBGA-B561 | S-PBGA-B561 | S-PBGA-B561 | S-PBGA-B561 |
| 长度 | 23 mm | 23 mm | 23 mm | 23 mm | 23 mm |
| 低功率模式 | YES | YES | YES | YES | YES |
| 端子数量 | 561 | 561 | 561 | 561 | 561 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | FBGA | FBGA | FBGA | FBGA | FBGA |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 3.3 mm | 3.3 mm | 3.3 mm | 3.3 mm | 3.3 mm |
| 最大供电电压 | 1.155 V | 1.155 V | 1.155 V | 1.155 V | 1.155 V |
| 最小供电电压 | 1.045 V | 1.045 V | 1.045 V | 1.045 V | 1.045 V |
| 标称供电电压 | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| 表面贴装 | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 端子形式 | BALL | BALL | BALL | BALL | BALL |
| 端子节距 | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| 宽度 | 23 mm | 23 mm | 23 mm | 23 mm | 23 mm |
| uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 |
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