Series LA-A1
Technical
METAL CASE, CASE-MOUNTED
SEMICONDUCTORS
Part Number Series LA-A1
Natural Conv. (°C/W): 28.9
Forced Air (°C/W): 8.1
Mounting Envelope: 1.31" x .90" x .25"
DESCRIPTION OF CURVES
A.
B.
C.
D.
E.
N.C. Horiz. Device Only
Mounted to G-10.
N.C Horiz. & Vert. With
Dissipator.
200 FPM w/Diss.
500 FPM w/Diss.
1000 FPM w/Diss.
•
•
•
Thermal Resistance Case to Sink is 0.5-0.7
°C/W
w/Joint Compound.
Derate 0.3
°C/watt
for unplated part in natural convection only.
Derate 0.8
°C/watt
for Insulubeâ part in natural convection only.
Ordering Information
Unplated
LA000A1U
LAD66A1U
LAIC66A1U
CTS IERC PART NO.
Comm'l. Black
Mil. Black Anodize
Anodize
LA000A1CB
LA000A1B
LAD66A1CB
LAD66A1B
LAIC66A1CB
LAIC66A1B
Semiconductor
Accommodated
Undrilled
TO-66
TO-66IC
Hole patt. ref. no.
Max. Weight
(Grams)
3.1
3.1
3.1
--
1 (see below)
7 (see below)
HOLE PATTERNS
1.
Hole Pattern no. 248 accommodates TO-66s. Available in LA-
7.
Hole pattern no. 191 accommodates To-66 Ics. Available in
A, LA-B and LB series heat dissipators only.
LA-A, LA-B, and LB series heat dissipators only.
CTS IERC, Heat Sinks and Thermal Management Solutions
413 North Moss Street, Burbank, California 91502
Tel: (818) 842-7277
Fax: (818) 848-8872
Rev. 08-29-03
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