FMA3015
FMA3015
X-BAND 7.5W HIGH POWER AMPLIFIER G
A
A
S
MMIC
Package Style: Bare Die
Product Description
The FMA3015 is a high performance X-Band Gallium Arsenide monolithic amplifier.
It is suitable for use in communication, instrumentation and electronic warfare
applications. The die is fabricated using RFMD’s 0.5µm process.
Features
12dB Gain
7.5W Saturated Output Power
at 9V
pHEMT Technology
Applications
Optimum Technology
Matching® Applied
GaAs HBT
GaAs MESFET
InGaP HBT
SiGe BiCMOS
Si BiCMOS
SiGe HBT
GaAs pHEMT
Si CMOS
Si BJT
GaN HEMT
InP HBT
RF MEMS
LDMOS
VD1
VD2
Test Instrumentation
Electronic Warfare
Communication Infrastruc-
ture
RF OUT
RF IN
VG1
VG2
Parameter
Electrical Specifications
Gain
Input Return Loss
Output Return Loss
Reverse Isolation
Output Saturated Power
Drain Current
Min.
Specification
Typ.
>12
-10
-10
-40
38.7
Max.
Unit
dB
dB
dB
dB
dBm
Condition
T
AMBIENT
=25°C, Z
0
=50Ω
9GHz to 10GHz, V
D
=9V, V
G
=-0.5V
9GHz to 10GHz, V
D
=9V, V
G
=-0.5V
9GHz to 10GHz, V
D
=9V, V
G
=-0.5V
9GHz to 10GHz, V
D
=9V, V
G
=-0.5V
Drain voltage and input power pulsed at a prf of
1kHz, 5% duty cycle. V
D
=9V, V
G
=-0.5V, input
power=27dBm, frequency=9.5GHz
Drain voltage and input power pulsed at a prf of
1kHz, 5% duty cycle. V
D
=9V, V
G
=-0.5V, input
power=0dBm
80
135
mA
RF MICRO DEVICES®, RFMD®, Optimum Technology Matching®, Enabling Wireless Connectivity™, PowerStar®, POLARIS™ TOTAL RADIO™ and UltimateBlue™ are trademarks of RFMD, LLC. BLUETOOTH is a trade-
mark owned by Bluetooth SIG, Inc., U.S.A. and licensed for use by RFMD. All other trade names, trademarks and registered trademarks are the property of their respective owners. ©2006, RF Micro Devices, Inc.
Rev A1 DS090306
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
1 of 4
FMA3015
Absolute Maximum Ratings
Parameter
Maximum Input Power (P
IN
)
Drain Voltage (V
DD
)
Operating Temperature (T
OPER
)
Storage Temperature (T
STOR
)
Rating
+29
+12
-40 to 85
-55 to 150
Unit
dBm
V
°C
°C
Caution! ESD sensitive device.
Exceeding any one or a combination of the Absolute Maximum Rating conditions may
cause permanent damage to the device. Extended application of Absolute Maximum
Rating conditions to the device may reduce device reliability. Specified typical perfor-
mance or functional operation of the device under Absolute Maximum Rating condi-
tions is not implied.
RoHS status based on EUDirective2002/95/EC (at time of this document revision).
The information in this publication is believed to be accurate and reliable. However, no
responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use, nor for any
infringement of patents, or other rights of third parties, resulting from its use. No
license is granted by implication or otherwise under any patent or patent rights of
RFMD. RFMD reserves the right to change component circuitry, recommended appli-
cation circuitry and specifications at any time without prior notice.
Pad Layout
Pad
A
B
C
D
E
F
G
H
I
J
Name
IN
VG1
VD1
VG2
VD2
OUT
VD2
VG2
VD1
VG1
Description
RF input
South gate voltage 1
South drain voltage 1
South gate voltage 2
South drain voltage 2
RF output
North drain voltage 2
North gate voltage 2
North drain voltage 1
North gate voltage 1
Die Size (μm)
4521x3048
Die Thickness (μm) Min. Bond Pad Pitch (μm) Min. Bond Pad Opening (μmxμm)
100
200
92x92
2 of 4
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
Rev A1 DS090306
FMA3015
Preferred Assembly Instructions
GaAs devices are fragile and should be handled with great care. Specially designed collets should be used where possible.
The back of the die is metallized and the recommended mounting method is by the use of conductive epoxy. Epoxy should be
applied to the attachment surface uniformly and sparingly to avoid encroachment of epoxy on to the top face of the die, and
ideally should not exceed half the chip height. For automated dispense Ablestick LMISR4 is recommended, and for manual dis-
pense Ablestick 84-1 LMI or 84-1 LMIT are recommended. These should be cured at a temperature of 150°C for 1 hour in an
oven especially set aside for epoxy curing only. If possible the curing oven should be flushed with dry nitrogen. The gold-tin
(80% Au 20% Sn) eutectic die attach has a melting point of approximately 280°C but the absolute temperature being used
depends on the leadframe material used and the particular application. The maximum time at used should be kept to a mini-
mum.
This part has gold (Au) bond pads requiring the use of gold (99.99% pure) bondwire. It is recommended that 25.4µm diameter
gold wire be used. Recommended lead bond technique is thermocompression wedge bonding with 0.001” (25µm) diameter
wire. The bond tool force shall be 35grams to 38grams. Bonding stage temperature shall be 230°C to 240°C, heated tool
(150°C to 160°C) is recommended. Ultrasonic or thermosonic bonding is not recommended.
Bonds should be made from the die first and then to the mounting substrate or package. The physical length of the bondwires
should be minimized especially when making RF or ground connections.
Handling Precautions
To avoid damage to the devices, care should be exercised during handling. Proper Electro-
static Discharge (ESD) precautions should be observed at all stages of storage, handling,
assembly, and testing.
ESD/MSL Rating
These devices should be treated as Class 0 (0V to 250V) using the human body model as defined in JEDEC Standard No. 22-
A114. Further information on ESD control measures can be found in MIL-STD-1686 and MIL-HDBK-263. This is an unpackaged
part and therefore no MSL rating applies.
Application Notes and Design Data
Application Notes and design data including S-parameters are available on request from www.rfmd.com.
Reliability
An MTTF of 4.2 million hours ata channel temperature of 150°C is achieved for the process used to manufacture this device.
Disclaimers
This product is not designed for use in any space-based or life-sustaining/supporting equipment.
Ordering Information
Quantity
Standard order quanity (waffle pack)
Small quantity (25)
Sample quantity (3)
Ordering Code
FMA3015-000
FMA3015-000SQ
FMA3015-000S3
Rev A1 DS090306
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
3 of 4
FMA3015
4 of 4
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
Rev A1 DS090306
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