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HM66WP36513FP-65: 产品描述512KX36 ZBT SRAM, 6.5ns, PQFP100, LQFP-100; 产品类别存储存储; 文件大小261KB，共31页; 制造商Renesas(瑞萨电子); 官网地址https://www.renesas.com/

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HM66WP36513FP-65概述

512KX36 ZBT SRAM, 6.5ns, PQFP100, LQFP-100

HM66WP36513FP-65规格参数

参数名称	属性值
零件包装代码	QFP
包装说明	LQFP,
针数	100
Reach Compliance Code	compliant
ECCN代码	3A991.B.2.A
最长访问时间	6.5 ns
其他特性	FLOW-THROUGH ARCHITECTURE; CAN ALSO OPERATE AT 3.3V SUPPLY
JESD-30 代码	R-PQFP-G100
长度	20 mm
内存密度	18874368 bit
内存集成电路类型	ZBT SRAM
内存宽度	36
功能数量	1
端子数量	100
字数	524288 words
字数代码	512000
工作模式	SYNCHRONOUS
最高工作温度	70 °C
最低工作温度
组织	512KX36
封装主体材料	PLASTIC/EPOXY
封装代码	LQFP
封装形状	RECTANGULAR
封装形式	FLATPACK, LOW PROFILE
并行/串行	PARALLEL
认证状态	Not Qualified
座面最大高度	1.6 mm
最大供电电压 (Vsup)	2.625 V
最小供电电压 (Vsup)	2.375 V
标称供电电压 (Vsup)	2.5 V
表面贴装	YES
技术	CMOS
温度等级	COMMERCIAL
端子形式	GULL WING
端子节距	0.65 mm
端子位置	QUAD
宽度	14 mm
Base Number Matches	1

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HM66WP18101/HM66WP36513

18M Flow Through Zero Bus Latency (ZBL) SRAM

(HM66WP18101) 1-Mword

18-bit

(HM66WP36513) 512-Kword

36-bit

ADE-203-1299C (Z)

Preliminary

Rev. 0.3

Mar. 29, 2002

Description

The HM66WP18101 is a synchronous fast static RAM organized as 1-Mword

18-bit. The

HM66WP36513 is a synchronous fast static RAM organized as 512-Kword

36-bit. It has realized high

speed access time by employing the most advanced CMOS process and high speed circuit designing

technology. It is most appropriate for the application which requires high speed, high density memory and

wide bit width configuration, such as cache and buffer memory in system. It is packaged in standard 100-

pin LQFP and 119-pin BGA.

Note: All power supply(V

DDQ

) and ground(V

) pins must be connected for proper operation of the

device.

ZBL: Zero Bus Latency and compatible ZBT SRAM. ZBT

is trademark of Integrated Device Technology, Inc.,

Features

•

3.3 V or 2.5V power supply, 3.3 V or 2.5 V I/O supply voltage

•

Clock frequency: 133/117/100 MHz

•

Fast clock access time: 6.5/7.5/8.5 ns (max)

•

Low operating current: 250/220/200 mA (max)

•

Address data pipeline capability

•

Internal input registers (Address, Data, Control)

•

Internal self-timed write cycle

•

ADV/LD burst control pins

•

Asynchronous output enable controlled three-state outputs

•

Individual byte write control

•

Power down state via ZZ

•

Common data inputs and data outputs

•

High board density 100-pin LQFP package and 119-pin BGA package

•

Burst contorol selected pin

LBO

(Interleave or linear burst oder)

Preliminary: The specifications of this device are subject to change without notice. Please contact your

nearest Hitachi’s Sales Dept. regarding specifications.

HM66WP36513FP-65相似产品对比

	HM66WP36513FP-65	HM66WP36513BP-75	HM66WP36513FP-75	HM66WP18101BP-85	HM66WP36513BP-65	HM66WP18101FP-75	HM66WP36513FP-85	HM66WP18101BP-65	HM66WP36513BP-85
描述	512KX36 ZBT SRAM, 6.5ns, PQFP100, LQFP-100	512KX36 ZBT SRAM, 7.5ns, PBGA119, BGA-119	512KX36 ZBT SRAM, 7.5ns, PQFP100, LQFP-100	1MX18 ZBT SRAM, 8.5ns, PBGA119, BGA-119	512KX36 ZBT SRAM, 6.5ns, PBGA119, BGA-119	1MX18 ZBT SRAM, 7.5ns, PQFP100, LQFP-100	512KX36 ZBT SRAM, 8.5ns, PQFP100, LQFP-100	1MX18 ZBT SRAM, 6.5ns, PBGA119, BGA-119	512KX36 ZBT SRAM, 8.5ns, PBGA119, BGA-119
零件包装代码	QFP	BGA	QFP	BGA	BGA	QFP	QFP	BGA	BGA
包装说明	LQFP,	BGA,	LQFP,	BGA,	BGA,	LQFP,	LQFP,	BGA,	BGA,
针数	100	119	100	119	119	100	100	119	119
Reach Compliance Code	compliant	compliant	unknown	compliant	compliant	unknown	compliant	compliant	compli
ECCN代码	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A
最长访问时间	6.5 ns	7.5 ns	7.5 ns	8.5 ns	6.5 ns	7.5 ns	8.5 ns	6.5 ns	8.5 ns
其他特性	FLOW-THROUGH ARCHITECTURE; CAN ALSO OPERATE AT 3.3V SUPPLY	FLOW-THROUGH ARCHITECTURE; CAN ALSO OPERATE AT 3.3V SUPPLY	FLOW-THROUGH ARCHITECTURE; CAN ALSO OPERATE AT 3.3V SUPPLY	FLOW-THROUGH ARCHITECTURE; CAN ALSO OPERATE AT 3.3V SUPPLY	FLOW-THROUGH ARCHITECTURE; CAN ALSO OPERATE AT 3.3V SUPPLY	FLOW-THROUGH ARCHITECTURE; CAN ALSO OPERATE AT 3.3V SUPPLY	FLOW-THROUGH ARCHITECTURE; CAN ALSO OPERATE AT 3.3V SUPPLY	FLOW-THROUGH ARCHITECTURE; CAN ALSO OPERATE AT 3.3V SUPPLY	FLOW-THROUGH ARCHITECTURE; CAN ALSO OPERATE AT 3.3V SUPPLY
JESD-30 代码	R-PQFP-G100	R-PBGA-B119	R-PQFP-G100	R-PBGA-B119	R-PBGA-B119	R-PQFP-G100	R-PQFP-G100	R-PBGA-B119	R-PBGA-B119
长度	20 mm	22 mm	20 mm	22 mm	22 mm	20 mm	20 mm	22 mm	22 mm
内存密度	18874368 bit	18874368 bit	18874368 bit	18874368 bit	18874368 bit	18874368 bit	18874368 bit	18874368 bit	18874368 bi
内存集成电路类型	ZBT SRAM	ZBT SRAM	ZBT SRAM	ZBT SRAM	ZBT SRAM	ZBT SRAM	ZBT SRAM	ZBT SRAM	ZBT SRAM
内存宽度	36	36	36	18	36	18	36	18	36
功能数量	1	1	1	1	1	1	1	1	1
端子数量	100	119	100	119	119	100	100	119	119
字数	524288 words	524288 words	524288 words	1048576 words	524288 words	1048576 words	524288 words	1048576 words	524288 words
字数代码	512000	512000	512000	1000000	512000	1000000	512000	1000000	512000
工作模式	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
最高工作温度	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
组织	512KX36	512KX36	512KX36	1MX18	512KX36	1MX18	512KX36	1MX18	512KX36
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	LQFP	BGA	LQFP	BGA	BGA	LQFP	LQFP	BGA	BGA
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	FLATPACK, LOW PROFILE	GRID ARRAY	FLATPACK, LOW PROFILE	GRID ARRAY	GRID ARRAY	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	GRID ARRAY	GRID ARRAY
并行/串行	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	1.6 mm	2.35 mm	1.6 mm	2.35 mm	2.35 mm	1.6 mm	1.6 mm	2.35 mm	2.35 mm
最大供电电压 (Vsup)	2.625 V	2.625 V	2.625 V	2.625 V	2.625 V	2.625 V	2.625 V	2.625 V	2.625 V
最小供电电压 (Vsup)	2.375 V	2.375 V	2.375 V	2.375 V	2.375 V	2.375 V	2.375 V	2.375 V	2.375 V
标称供电电压 (Vsup)	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
端子形式	GULL WING	BALL	GULL WING	BALL	BALL	GULL WING	GULL WING	BALL	BALL
端子节距	0.65 mm	1.27 mm	0.65 mm	1.27 mm	1.27 mm	0.65 mm	0.65 mm	1.27 mm	1.27 mm
端子位置	QUAD	BOTTOM	QUAD	BOTTOM	BOTTOM	QUAD	QUAD	BOTTOM	BOTTOM
宽度	14 mm	14 mm	14 mm	14 mm	14 mm	14 mm	14 mm	14 mm	14 mm
厂商名称	-	Renesas(瑞萨电子)	-	Renesas(瑞萨电子)	Renesas(瑞萨电子)	Renesas(瑞萨电子)	Renesas(瑞萨电子)	Renesas(瑞萨电子)	Renesas(瑞萨电子)
JESD-609代码	-	e1	-	e1	e1	-	-	e1	e1
端子面层	-	TIN SILVER COPPER	-	TIN SILVER COPPER	TIN SILVER COPPER	-	-	TIN SILVER COPPER	TIN SILVER COPPER

HM66WP36513FP-65

HM66WP36513FP-65概述

HM66WP36513FP-65规格参数

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