D/A Converter, 1 Func, Serial Input Loading, CDIP16, 0.300 INCH, CERAMIC, DIP-16
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 零件包装代码 | DIP |
| 包装说明 | 0.300 INCH, CERAMIC, DIP-16 |
| 针数 | 16 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | 3A001.A.2.C |
| 转换器类型 | D/A CONVERTER |
| 输入位码 | BINARY, OFFSET BINARY |
| 输入格式 | SERIAL |
| JESD-30 代码 | R-GDIP-T16 |
| JESD-609代码 | e0 |
| 最大线性误差 (EL) | 0.0122% |
| 湿度敏感等级 | 1 |
| 位数 | 12 |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | 245 |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-STD-883 Class B |
| 座面最大高度 | 5.08 mm |
| 标称供电电压 | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | TIN LEAD |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.62 mm |
| Base Number Matches | 1 |
| MX7543TQ/883B | MX7543GKEWE | MX7543GTQ/883B | MX7543JP | |
|---|---|---|---|---|
| 描述 | D/A Converter, 1 Func, Serial Input Loading, CDIP16, 0.300 INCH, CERAMIC, DIP-16 | D/A Converter, 1 Func, Serial Input Loading, PDSO16, 0.300 INCH, SOIC-16 | D/A Converter, 1 Func, Serial Input Loading, CDIP16, 0.300 INCH, CERAMIC, DIP-16 | D/A Converter, 1 Func, Serial Input Loading, PQCC20, 0.453 X 0.453 INCH, PLASTIC, LCC-20 |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | DIP | SOIC | DIP | QLCC |
| 包装说明 | 0.300 INCH, CERAMIC, DIP-16 | 0.300 INCH, SOIC-16 | 0.300 INCH, CERAMIC, DIP-16 | 0.453 X 0.453 INCH, PLASTIC, LCC-20 |
| 针数 | 16 | 16 | 16 | 20 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant |
| ECCN代码 | 3A001.A.2.C | EAR99 | 3A001.A.2.C | EAR99 |
| 转换器类型 | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER |
| 输入位码 | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY |
| 输入格式 | SERIAL | SERIAL | SERIAL | SERIAL |
| JESD-30 代码 | R-GDIP-T16 | R-PDSO-G16 | R-GDIP-T16 | S-PQCC-J20 |
| JESD-609代码 | e0 | e0 | e0 | e0 |
| 最大线性误差 (EL) | 0.0122% | 0.0122% | 0.0122% | 0.0244% |
| 湿度敏感等级 | 1 | 1 | 1 | 1 |
| 位数 | 12 | 12 | 12 | 12 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端子数量 | 16 | 16 | 16 | 20 |
| 最高工作温度 | 125 °C | 85 °C | 125 °C | 70 °C |
| 最低工作温度 | -55 °C | -40 °C | -55 °C | - |
| 封装主体材料 | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY |
| 封装代码 | DIP | SOP | DIP | QCCJ |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE |
| 封装形式 | IN-LINE | SMALL OUTLINE | IN-LINE | CHIP CARRIER |
| 峰值回流温度（摄氏度） | 245 | 245 | 245 | 245 |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.08 mm | 2.65 mm | 5.08 mm | 4.57 mm |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | INDUSTRIAL | MILITARY | COMMERCIAL |
| 端子面层 | TIN LEAD | Tin/Lead (Sn/Pb) | TIN LEAD | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | GULL WING | THROUGH-HOLE | J BEND |
| 端子节距 | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 7.62 mm | 7.5 mm | 7.62 mm | 8.965 mm |
| 厂商名称 | - | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
