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FM25V01-G

产品描述Memory Circuit, 16KX8, CMOS, PDSO8, GREEN, MS-012AA, SOIC-8
产品类别存储    存储   
文件大小503KB,共15页
制造商Ramtron International Corporation (Cypress Semiconductor Corporation)
官网地址http://www.cypress.com/
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FM25V01-G概述

Memory Circuit, 16KX8, CMOS, PDSO8, GREEN, MS-012AA, SOIC-8

FM25V01-G规格参数

参数名称属性值
零件包装代码SOIC
包装说明SOP,
针数8
Reach Compliance Codeunknown
JESD-30 代码R-PDSO-G8
长度4.9 mm
内存密度131072 bit
内存集成电路类型MEMORY CIRCUIT
内存宽度8
功能数量1
端子数量8
字数16384 words
字数代码16000
工作模式SYNCHRONOUS
最高工作温度85 °C
最低工作温度-40 °C
组织16KX8
封装主体材料PLASTIC/EPOXY
封装代码SOP
封装形状RECTANGULAR
封装形式SMALL OUTLINE
认证状态Not Qualified
座面最大高度1.75 mm
最大供电电压 (Vsup)3.6 V
最小供电电压 (Vsup)2 V
标称供电电压 (Vsup)3.3 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子形式GULL WING
端子节距1.27 mm
端子位置DUAL
宽度3.9 mm
Base Number Matches1

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FM25V01
128Kb Serial 3V F-RAM Memory
Features
128K bit Ferroelectric Nonvolatile RAM
Organized as 16,384 x 8 bits
High Endurance 100 Trillion (10
14
) Read/Writes
10 Year Data Retention
NoDelay™ Writes
Advanced High-Reliability Ferroelectric Process
Very Fast Serial Peripheral Interface - SPI
Up to 40 MHz Frequency
Direct Hardware Replacement for Serial Flash
SPI Mode 0 & 3 (CPOL, CPHA=0,0 & 1,1)
Write Protection Scheme
Hardware Protection
Software Protection
Device ID
Device ID reads out Manufacturer ID & Part ID
Low Voltage, Low Power
Low Voltage Operation 2.0V – 3.6V
Active Current 120
A
(typ. @ 1MHz)
Standby Current 90
A
(typ.)
Sleep Mode Current 5
A
(typ.)
Industry Standard Configurations
Industrial Temperature -40C to +85C
8-pin “Green”/RoHS SOIC Package
Description
The FM25V01 is a 128-kilobit nonvolatile memory
employing an advanced ferroelectric process. A
ferroelectric random access memory or F-RAM is
nonvolatile and performs reads and writes like a
RAM. It provides reliable data retention for 10 years
while eliminating the complexities, overhead, and
system level reliability problems caused by Serial
Flash and other nonvolatile memories.
Unlike Serial Flash, the FM25V01 performs write
operations at bus speed. No write delays are incurred.
Data is written to the memory array immediately
after it has been transferred to the device. The next
bus cycle may commence without the need for data
polling. The product offers very high write
endurance, orders of magnitude more endurance than
Serial Flash. Also, F-RAM exhibits lower power
consumption than Serial Flash.
These capabilities make the FM25V01 ideal for
nonvolatile memory applications requiring frequent
or rapid writes or low power operation. Examples
range from data collection, where the number of
write cycles may be critical, to demanding industrial
controls where the long write time of Serial Flash can
cause data loss.
The FM25V01 provides substantial benefits to users
of Serial Flash as a hardware drop-in replacement.
The device uses the high-speed SPI bus, which
enhances the high-speed write capability of F-RAM
technology. The device incorporates a read-only
Device ID that allows the host to determine the
manufacturer, product density, and product revision.
The device is guaranteed over an industrial
temperature range of -40°C to +85°C.
Pin Configuration
S
Q
W
VSS
1
2
3
4
8
7
6
5
VDD
HOLD
C
D
Pin Name
/S
/W
/HOLD
C
D
Q
VDD
VSS
Function
Chip Select
Write Protect
Hold
Serial Clock
Serial Data Input
Serial Data Output
Supply Voltage
Ground
This product conforms to specifications per the terms of the Ramtron
standard warranty. The product has completed Ramtron’s internal
qualification testing and has reached production status.
Rev. 3.0
Jan. 2012
Ramtron International Corporation
1850 Ramtron Drive, Colorado Springs, CO 80921
(800) 545-FRAM, (719) 481-7000
http://www.ramtron.com
Page 1 of 15

FM25V01-G相似产品对比

FM25V01-G FM25V01-GTR
描述 Memory Circuit, 16KX8, CMOS, PDSO8, GREEN, MS-012AA, SOIC-8 Memory Circuit, 16KX8, CMOS, PDSO8, GREEN, MS-012AA, SOIC-8
零件包装代码 SOIC SOIC
包装说明 SOP, SOP,
针数 8 8
Reach Compliance Code unknown unknown
JESD-30 代码 R-PDSO-G8 R-PDSO-G8
长度 4.9 mm 4.9 mm
内存密度 131072 bit 131072 bit
内存集成电路类型 MEMORY CIRCUIT MEMORY CIRCUIT
内存宽度 8 8
功能数量 1 1
端子数量 8 8
字数 16384 words 16384 words
字数代码 16000 16000
工作模式 SYNCHRONOUS SYNCHRONOUS
最高工作温度 85 °C 85 °C
最低工作温度 -40 °C -40 °C
组织 16KX8 16KX8
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 SOP SOP
封装形状 RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE SMALL OUTLINE
认证状态 Not Qualified Not Qualified
座面最大高度 1.75 mm 1.75 mm
最大供电电压 (Vsup) 3.6 V 3.6 V
最小供电电压 (Vsup) 2 V 2 V
标称供电电压 (Vsup) 3.3 V 3.3 V
表面贴装 YES YES
技术 CMOS CMOS
温度等级 INDUSTRIAL INDUSTRIAL
端子形式 GULL WING GULL WING
端子节距 1.27 mm 1.27 mm
端子位置 DUAL DUAL
宽度 3.9 mm 3.9 mm
Base Number Matches 1 1

 
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