Registered Bus Transceiver, FCT Series, 1-Func, 8-Bit, True Output, CMOS, CDIP24, CERAMIC, DIP-24
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
零件包装代码 | DIP |
包装说明 | DIP, DIP24,.3 |
针数 | 24 |
Reach Compliance Code | not_compliant |
其他特性 | MASTER CONTROL FOR LATCH AND OUTPUT ENABLES IN EACH DIRECTION |
控制类型 | INDEPENDENT CONTROL |
计数方向 | BIDIRECTIONAL |
系列 | FCT |
JESD-30 代码 | R-GDIP-T24 |
JESD-609代码 | e0 |
长度 | 30.861 mm |
负载电容(CL) | 50 pF |
逻辑集成电路类型 | REGISTERED BUS TRANSCEIVER |
最大I(ol) | 0.048 A |
位数 | 8 |
功能数量 | 1 |
端口数量 | 2 |
端子数量 | 24 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
输出特性 | 3-STATE |
输出极性 | TRUE |
封装主体材料 | CERAMIC, GLASS-SEALED |
封装代码 | DIP |
封装等效代码 | DIP24,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | 5 V |
Prop。Delay @ Nom-Sup | 6.1 ns |
传播延迟(tpd) | 8 ns |
认证状态 | Not Qualified |
筛选级别 | MIL-STD-883 Class B |
座面最大高度 | 4.445 mm |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
翻译 | N/A |
宽度 | 10.16 mm |
Base Number Matches | 1 |
IDT54FCT543CDB | IDT54FCT543DB | IDT54FCT543ALB | IDT54FCT543CLB | IDT54FCT543LB | IDT74FCT543SO | |
---|---|---|---|---|---|---|
描述 | Registered Bus Transceiver, FCT Series, 1-Func, 8-Bit, True Output, CMOS, CDIP24, CERAMIC, DIP-24 | Registered Bus Transceiver, FCT Series, 1-Func, 8-Bit, True Output, CMOS, CDIP24, CERDIP-24 | Registered Bus Transceiver, FCT Series, 1-Func, 8-Bit, True Output, CMOS, CQCC28, LCC-28 | Registered Bus Transceiver, FCT Series, 1-Func, 8-Bit, True Output, CMOS, CQCC28, LCC-28 | Registered Bus Transceiver, FCT Series, 1-Func, 8-Bit, True Output, CMOS, CQCC28, LCC-28 | Registered Bus Transceiver, FCT Series, 1-Func, 8-Bit, True Output, CMOS, PDSO24, SOIC-24 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
零件包装代码 | DIP | DIP | QLCC | QLCC | QLCC | SOIC |
包装说明 | DIP, DIP24,.3 | CERDIP-24 | LCC-28 | QCCN, LCC28,.45SQ | QCCN, LCC28,.45SQ | SOP, SOP24,.4 |
针数 | 24 | 24 | 28 | 28 | 28 | 24 |
Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
其他特性 | MASTER CONTROL FOR LATCH AND OUTPUT ENABLES IN EACH DIRECTION | MASTER CONTROL FOR LATCH AND OUTPUT ENABLES IN EACH DIRECTION | MASTER CONTROL FOR LATCH AND OUTPUT ENABLES IN EACH DIRECTION | MASTER CONTROL FOR LATCH AND OUTPUT ENABLES IN EACH DIRECTION | MASTER CONTROL FOR LATCH AND OUTPUT ENABLES IN EACH DIRECTION | MASTER CONTROL FOR LATCH AND OUTPUT ENABLES IN EACH DIRECTION |
控制类型 | INDEPENDENT CONTROL | INDEPENDENT CONTROL | INDEPENDENT CONTROL | INDEPENDENT CONTROL | INDEPENDENT CONTROL | INDEPENDENT CONTROL |
计数方向 | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL |
系列 | FCT | FCT | FCT | FCT | FCT | FCT |
JESD-30 代码 | R-GDIP-T24 | R-GDIP-T24 | S-CQCC-N28 | S-CQCC-N28 | S-CQCC-N28 | R-PDSO-G24 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
长度 | 30.861 mm | 32.004 mm | 11.4554 mm | 11.4554 mm | 11.4554 mm | 15.4 mm |
负载电容(CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
逻辑集成电路类型 | REGISTERED BUS TRANSCEIVER | REGISTERED BUS TRANSCEIVER | REGISTERED BUS TRANSCEIVER | REGISTERED BUS TRANSCEIVER | REGISTERED BUS TRANSCEIVER | REGISTERED BUS TRANSCEIVER |
最大I(ol) | 0.048 A | 0.048 A | 0.048 A | 0.048 A | 0.048 A | 0.064 A |
位数 | 8 | 8 | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端口数量 | 2 | 2 | 2 | 2 | 2 | 2 |
端子数量 | 24 | 24 | 28 | 28 | 28 | 24 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 70 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | - |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY |
封装代码 | DIP | DIP | QCCN | QCCN | QCCN | SOP |
封装等效代码 | DIP24,.3 | DIP24,.3 | LCC28,.45SQ | LCC28,.45SQ | LCC28,.45SQ | SOP24,.4 |
封装形状 | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | SQUARE | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | SMALL OUTLINE |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
Prop。Delay @ Nom-Sup | 6.1 ns | 10 ns | 7.5 ns | 6.1 ns | 10 ns | 8.5 ns |
传播延迟(tpd) | 8 ns | 10 ns | 7.5 ns | 8 ns | 10 ns | 12.5 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 4.445 mm | 4.826 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.65 mm |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.25 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.75 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | NO LEAD | NO LEAD | GULL WING |
端子节距 | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | DUAL | QUAD | QUAD | QUAD | DUAL |
翻译 | N/A | N/A | N/A | N/A | N/A | N/A |
宽度 | 10.16 mm | 15.24 mm | 11.4554 mm | 11.4554 mm | 11.4554 mm | 7.5 mm |
峰值回流温度(摄氏度) | NOT SPECIFIED | 225 | 225 | NOT SPECIFIED | 225 | - |
筛选级别 | MIL-STD-883 Class B | MIL-STD-883 Class B | MIL-STD-883 Class B | MIL-STD-883 Class B | MIL-STD-883 Class B | - |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | 20 | 30 | NOT SPECIFIED | 30 | - |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | - |
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