EE PLD, 15ns, PAL-Type, CMOS, CQCC20, CERAMIC, LCC-20
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 零件包装代码 | QLCC |
| 包装说明 | QCCN, LCC20,.35SQ |
| 针数 | 20 |
| Reach Compliance Code | unknown |
| ECCN代码 | 3A001.A.2.C |
| 其他特性 | PROGRAMMABLE OUTPUT POLARITY; 8 MACROCELLS; REGISTER PRELOAD; POWER-UP RESET |
| 架构 | PAL-TYPE |
| 最大时钟频率 | 41.6 MHz |
| JESD-30 代码 | S-CQCC-N20 |
| JESD-609代码 | e0 |
| 长度 | 8.89 mm |
| 专用输入次数 | 8 |
| I/O 线路数量 | 8 |
| 输入次数 | 18 |
| 输出次数 | 8 |
| 产品条款数 | 64 |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 组织 | 8 DEDICATED INPUTS, 8 I/O |
| 输出函数 | MACROCELL |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCN |
| 封装等效代码 | LCC20,.35SQ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 电源 | 5 V |
| 可编程逻辑类型 | EE PLD |
| 传播延迟 | 15 ns |
| 认证状态 | Not Qualified |
| 筛选级别 | 38535Q/M;38534H;883B |
| 座面最大高度 | 2.54 mm |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 4.5 V |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | NO LEAD |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 宽度 | 8.89 mm |
| Base Number Matches | 1 |
| PALCE16V8H-15E4/B2A | PALCE16V8H-15E4/BRA | PALCE16V8H-20/B2A | PALCE16V8H-20/BRA | PALCE16V8H-25/B2A | PALCE16V8H-25E4/BRA | PALCE16V8H-25/BRA | PALCE16V8H-20E4/B2A | PALCE16V8H-20E4/BRA | PALCE16V8H-25E4/B2A | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | EE PLD, 15ns, PAL-Type, CMOS, CQCC20, CERAMIC, LCC-20 | EE PLD, 15ns, PAL-Type, CMOS, CDIP20, CERAMIC, DIP-20 | EE PLD, 20ns, PAL-Type, CMOS, CQCC20, CERAMIC, LCC-20 | EE PLD, 20ns, PAL-Type, CMOS, CDIP20, CERAMIC, DIP-20 | EE PLD, 55ns, PAL-Type, CMOS, CQCC20, CERAMIC, LCC-20 | EE PLD, 55ns, PAL-Type, CMOS, CDIP20, CERAMIC, DIP-20 | EE PLD, 55ns, PAL-Type, CMOS, CDIP20, CERAMIC, DIP-20 | EE PLD, 20ns, PAL-Type, CMOS, CQCC20, CERAMIC, LCC-20 | EE PLD, 20ns, PAL-Type, CMOS, CDIP20, CERAMIC, DIP-20 | EE PLD, 55ns, PAL-Type, CMOS, CQCC20, CERAMIC, LCC-20 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | QLCC | DIP | QLCC | DIP | QLCC | DIP | DIP | QLCC | DIP | QLCC |
| 包装说明 | QCCN, LCC20,.35SQ | DIP, DIP20,.3 | QCCN, LCC20,.35SQ | DIP, DIP20,.3 | QCCN, LCC20,.35SQ | DIP, DIP20,.3 | DIP, DIP20,.3 | QCCN, LCC20,.35SQ | DIP, DIP20,.3 | QCCN, LCC20,.35SQ |
| 针数 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
| 其他特性 | PROGRAMMABLE OUTPUT POLARITY; 8 MACROCELLS; REGISTER PRELOAD; POWER-UP RESET | PROGRAMMABLE OUTPUT POLARITY; 8 MACROCELLS; REGISTER PRELOAD; POWER-UP RESET | PROGRAMMABLE OUTPUT POLARITY; 8 MACROCELLS; REGISTER PRELOAD; POWER-UP RESET | PROGRAMMABLE OUTPUT POLARITY; 8 MACROCELLS; REGISTER PRELOAD; POWER-UP RESET | PROGRAMMABLE OUTPUT POLARITY; 8 MACROCELLS; REGISTER PRELOAD; POWER-UP RESET | PROGRAMMABLE OUTPUT POLARITY; 8 MACROCELLS; REGISTER PRELOAD; POWER-UP RESET | PROGRAMMABLE OUTPUT POLARITY; 8 MACROCELLS; REGISTER PRELOAD; POWER-UP RESET | PROGRAMMABLE OUTPUT POLARITY; 8 MACROCELLS; REGISTER PRELOAD; POWER-UP RESET | PROGRAMMABLE OUTPUT POLARITY; 8 MACROCELLS; REGISTER PRELOAD; POWER-UP RESET | PROGRAMMABLE OUTPUT POLARITY; 8 MACROCELLS; REGISTER PRELOAD; POWER-UP RESET |
| 架构 | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE |
| 最大时钟频率 | 41.6 MHz | 41.6 MHz | 33.3 MHz | 33.3 MHz | 28.6 MHz | 28.6 MHz | 28.6 MHz | 33.3 MHz | 33.3 MHz | 28.6 MHz |
| JESD-30 代码 | S-CQCC-N20 | R-CDIP-T20 | S-CQCC-N20 | R-CDIP-T20 | S-CQCC-N20 | R-CDIP-T20 | R-CDIP-T20 | S-CQCC-N20 | R-CDIP-T20 | S-CQCC-N20 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 8.89 mm | 24.257 mm | 8.89 mm | 24.257 mm | 8.89 mm | 24.257 mm | 24.257 mm | 8.89 mm | 24.257 mm | 8.89 mm |
| 专用输入次数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| I/O 线路数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 输入次数 | 18 | 18 | 18 | 18 | 18 | 18 | 18 | 18 | 18 | 18 |
| 输出次数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 产品条款数 | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 |
| 端子数量 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 组织 | 8 DEDICATED INPUTS, 8 I/O | 8 DEDICATED INPUTS, 8 I/O | 8 DEDICATED INPUTS, 8 I/O | 8 DEDICATED INPUTS, 8 I/O | 8 DEDICATED INPUTS, 8 I/O | 8 DEDICATED INPUTS, 8 I/O | 8 DEDICATED INPUTS, 8 I/O | 8 DEDICATED INPUTS, 8 I/O | 8 DEDICATED INPUTS, 8 I/O | 8 DEDICATED INPUTS, 8 I/O |
| 输出函数 | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCN | DIP | QCCN | DIP | QCCN | DIP | DIP | QCCN | DIP | QCCN |
| 封装等效代码 | LCC20,.35SQ | DIP20,.3 | LCC20,.35SQ | DIP20,.3 | LCC20,.35SQ | DIP20,.3 | DIP20,.3 | LCC20,.35SQ | DIP20,.3 | LCC20,.35SQ |
| 封装形状 | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE |
| 封装形式 | CHIP CARRIER | IN-LINE | CHIP CARRIER | IN-LINE | CHIP CARRIER | IN-LINE | IN-LINE | CHIP CARRIER | IN-LINE | CHIP CARRIER |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 可编程逻辑类型 | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD |
| 传播延迟 | 15 ns | 15 ns | 20 ns | 20 ns | 55 ns | 55 ns | 55 ns | 20 ns | 20 ns | 55 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 筛选级别 | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B |
| 座面最大高度 | 2.54 mm | 5.08 mm | 2.54 mm | 5.08 mm | 2.54 mm | 5.08 mm | 5.08 mm | 2.54 mm | 5.08 mm | 2.54 mm |
| 最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | YES | NO | YES | NO | NO | YES | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | NO LEAD | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | NO LEAD |
| 端子节距 | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm |
| 端子位置 | QUAD | DUAL | QUAD | DUAL | QUAD | DUAL | DUAL | QUAD | DUAL | QUAD |
| 宽度 | 8.89 mm | 7.62 mm | 8.89 mm | 7.62 mm | 8.89 mm | 7.62 mm | 7.62 mm | 8.89 mm | 7.62 mm | 8.89 mm |
| 峰值回流温度（摄氏度） | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | NOT SPECIFIED |
| 处于峰值回流温度下的最长时间 | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | NOT SPECIFIED |
| 厂商名称 | - | - | - | - | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) |
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