Buffer/Line Driver 8-CH Non-Inverting 3-ST CMOS 20-Pin TSSOP Bulk
参数名称 | 属性值 |
欧盟限制某些有害物质的使用 | Compliant |
ECCN (US) | EAR99 |
Part Status | LTB |
HTS | 8542.39.00.01 |
Logic Family | LVC |
Logic Function | Buffer/Line Driver |
Number of Elements per Chip | 1 |
Number of Channels per Chip | 8 |
Number of Inputs per Chip | 8 |
Number of Input Enables per Chip | 0 |
Number of Outputs per Chip | 8 |
Number of Output Enables per Chip | 2 Low |
Bus Hold | No |
Polarity | Non-Inverting |
Maximum Propagation Delay Time @ Maximum CL (ns) | 2.9(Typ)@3.3V|3.5(Typ)@2.7V |
Absolute Propagation Delay Time (ns) | 18.5 |
Process Technology | CMOS |
Input Signal Type | Single-Ended |
输出类型 Output Type | 3-State |
Maximum Low Level Output Current (mA) | 24 |
Maximum High Level Output Current (mA) | -24 |
Minimum Operating Supply Voltage (V) | 1.2 |
Typical Operating Supply Voltage (V) | 3.3|2.5|1.8 |
Maximum Operating Supply Voltage (V) | 3.6 |
Tolerant I/Os (V) | 5 |
Typical Quiescent Current (uA) | 0.1 |
Maximum Quiescent Current (uA) | 40 |
Propagation Delay Test Condition (pF) | 50 |
Maximum Power Dissipation (mW) | 500 |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Temperature (°C) | 125 |
系列 Packaging | Bulk |
Standard Package Name | SOP |
Pin Count | 20 |
Supplier Package | TSSOP |
Mounting | Surface Mount |
Package Height | 0.95(Max) |
Package Length | 6.6(Max) |
Package Width | 4.5(Max) |
PCB changed | 20 |
Lead Shape | Gull-wing |
74LVC541APW,112 | 74LVC541AD,112 | 74LVC541AD,118 | 74LVC541ABQ,115 | 74LVC541APW,118 | 74LVC541ADB,112 | 74LVC541ADB,118 | |
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描述 | Buffer/Line Driver 8-CH Non-Inverting 3-ST CMOS 20-Pin TSSOP Bulk | Buffer/Line Driver 8-CH Non-Inverting 3-ST CMOS 20-Pin SO Bulk | Buffer/Line Driver 8-CH Non-Inverting 3-ST CMOS 20-Pin SO T/R | Buffer/Line Driver 8-CH Non-Inverting 3-ST CMOS 20-Pin DHVQFN EP T/R | Buffer/Line Driver 8-CH Non-Inverting 3-ST CMOS 20-Pin TSSOP T/R | Buffer/Line Driver 8-CH Non-Inverting 3-ST CMOS 20-Pin SSOP Bulk | Buffer/Line Driver 8-CH Non-Inverting 3-ST CMOS 20-Pin SSOP T/R |
欧盟限制某些有害物质的使用 | Compliant | - | - | Compliant | Compliant | Compliant | Compliant |
ECCN (US) | EAR99 | - | - | EAR99 | EAR99 | EAR99 | EAR99 |
Part Status | LTB | - | - | Active | Active | Obsolete | LTB |
HTS | 8542.39.00.01 | - | - | 8542.39.00.01 | 8542.39.00.01 | 8542.39.00.01 | 8542.39.00.01 |
Logic Family | LVC | - | - | LVC | LVC | LVC | LVC |
Logic Function | Buffer/Line Driver | - | - | Buffer/Line Driver | Buffer/Line Driver | Buffer/Line Driver | Buffer/Line Driver |
Number of Elements per Chip | 1 | - | - | 1 | 1 | 1 | 1 |
Number of Channels per Chip | 8 | - | - | 8 | 8 | 8 | 8 |
Number of Inputs per Chip | 8 | - | - | 8 | 8 | 8 | 8 |
Number of Outputs per Chip | 8 | - | - | 8 | 8 | 8 | 8 |
Number of Output Enables per Chip | 2 Low | - | - | 2 Low | 2 Low | 2 Low | 2 Low |
Bus Hold | No | - | - | No | No | No | No |
Polarity | Non-Inverting | - | - | Non-Inverting | Non-Inverting | Non-Inverting | Non-Inverting |
Maximum Propagation Delay Time @ Maximum CL (ns) | 2.9(Typ)@3.3V|3.5(Typ)@2.7V | - | - | 3.5(Typ)@2.7V|2.9(Typ)@3.3V | 2.9(Typ)@3.3V|3.5(Typ)@2.7V | 2.9(Typ)@3.3V|3.5(Typ)@2.7V | 3.5(Typ)@2.7V|2.9(Typ)@3.3V |
Absolute Propagation Delay Time (ns) | 18.5 | - | - | 18.5 | 18.5 | 18.5 | 18.5 |
Process Technology | CMOS | - | - | CMOS | CMOS | CMOS | CMOS |
Input Signal Type | Single-Ended | - | - | Single-Ended | Single-Ended | Single-Ended | Single-Ended |
输出类型 Output Type |
3-State | - | - | 3-State | 3-State | 3-State | 3-State |
Maximum Low Level Output Current (mA) | 24 | - | - | 24 | 24 | 24 | 24 |
Maximum High Level Output Current (mA) | -24 | - | - | -24 | -24 | -24 | -24 |
Minimum Operating Supply Voltage (V) | 1.2 | - | - | 1.2 | 1.2 | 1.2 | 1.2 |
Typical Operating Supply Voltage (V) | 3.3|2.5|1.8 | - | - | 1.8|2.5|3.3 | 3.3|2.5|1.8 | 3.3|2.5|1.8 | 1.8|2.5|3.3 |
Maximum Operating Supply Voltage (V) | 3.6 | - | - | 3.6 | 3.6 | 3.6 | 3.6 |
Tolerant I/Os (V) | 5 | - | - | 5 | 5 | 5 | 5 |
Typical Quiescent Current (uA) | 0.1 | - | - | 0.1 | 0.1 | 0.1 | 0.1 |
Maximum Quiescent Current (uA) | 40 | - | - | 40 | 40 | 40 | 40 |
Propagation Delay Test Condition (pF) | 50 | - | - | 50 | 50 | 50 | 50 |
Maximum Power Dissipation (mW) | 500 | - | - | 500 | 500 | 500 | 500 |
Minimum Operating Temperature (°C) | -40 | - | - | -40 | -40 | -40 | -40 |
Maximum Operating Temperature (°C) | 125 | - | - | 125 | 125 | 125 | 125 |
系列 Packaging |
Bulk | - | - | Tape and Reel | Tape and Reel | Bulk | Tape and Reel |
Pin Count | 20 | - | - | 20 | 20 | 20 | 20 |
Supplier Package | TSSOP | - | - | DHVQFN EP | TSSOP | SSOP | SSOP |
Mounting | Surface Mount | - | - | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
Package Height | 0.95(Max) | - | - | 0.88 | 0.95(Max) | 1.8(Max) | 1.8(Max) |
Package Length | 6.6(Max) | - | - | 4.5 | 6.6(Max) | 7.4(Max) | 7.4(Max) |
Package Width | 4.5(Max) | - | - | 2.5 | 4.5(Max) | 5.4(Max) | 5.4(Max) |
PCB changed | 20 | - | - | 20 | 20 | 20 | 20 |
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