Flash, 1MX8, PDSO8,
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 包装说明 | SOP, SOP8,.3 |
| Reach Compliance Code | unknown |
| 最大时钟频率 (fCLK) | 33 MHz |
| 数据保留时间-最小值 | 20 |
| 耐久性 | 100000 Write/Erase Cycles |
| JESD-30 代码 | R-PDSO-G8 |
| 内存密度 | 8388608 bit |
| 内存集成电路类型 | FLASH |
| 内存宽度 | 8 |
| 端子数量 | 8 |
| 字数 | 1048576 words |
| 字数代码 | 1000000 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 1MX8 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP8,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 并行/串行 | SERIAL |
| 电源 | 3/3.3 V |
| 认证状态 | Not Qualified |
| 串行总线类型 | SPI |
| 最大待机电流 | 0.000005 A |
| 最大压摆率 | 0.032 mA |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 类型 | NOR TYPE |
| 写保护 | HARDWARE/SOFTWARE |
| Base Number Matches | 1 |
| W25P80-VSSI-G | W25P16-VSSI | W25P80-VSFI | W25P32-VSSI | W25P32-VSSI-G | W25P80-VSFI-G | |
|---|---|---|---|---|---|---|
| 描述 | Flash, 1MX8, PDSO8, | Flash, 2MX8, PDSO8 | Flash, 1MX8, PDSO16 | Flash, 4MX8, PDSO8, | Flash, 4MX8, PDSO8, | Flash, 1MX8, PDSO16 |
| 是否Rohs认证 | 符合 | 不符合 | 不符合 | 不符合 | 符合 | 符合 |
| 包装说明 | SOP, SOP8,.3 | SOP, SOP8,.3 | SOP, SOP16,.4 | SOP, SOP8,.3 | SOP, SOP8,.3 | SOP, SOP16,.4 |
| Reach Compliance Code | unknown | unknown | unknown | unknow | unknow | unknow |
| 最大时钟频率 (fCLK) | 33 MHz | 33 MHz | 33 MHz | 33 MHz | 33 MHz | 33 MHz |
| 数据保留时间-最小值 | 20 | 20 | 20 | 20 | 20 | 20 |
| 耐久性 | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles |
| JESD-30 代码 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G16 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G16 |
| 内存密度 | 8388608 bit | 16777216 bit | 8388608 bit | 33554432 bi | 33554432 bi | 8388608 bi |
| 内存集成电路类型 | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 |
| 端子数量 | 8 | 8 | 16 | 8 | 8 | 16 |
| 字数 | 1048576 words | 2097152 words | 1048576 words | 4194304 words | 4194304 words | 1048576 words |
| 字数代码 | 1000000 | 2000000 | 1000000 | 4000000 | 4000000 | 1000000 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 组织 | 1MX8 | 2MX8 | 1MX8 | 4MX8 | 4MX8 | 1MX8 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | SOP | SOP | SOP | SOP | SOP |
| 封装等效代码 | SOP8,.3 | SOP8,.3 | SOP16,.4 | SOP8,.3 | SOP8,.3 | SOP16,.4 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
| 并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| 电源 | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 串行总线类型 | SPI | SPI | SPI | SPI | SPI | SPI |
| 最大待机电流 | 0.000005 A | 0.000005 A | 0.000005 A | 0.000005 A | 0.000005 A | 0.000005 A |
| 最大压摆率 | 0.032 mA | 0.032 mA | 0.032 mA | 0.032 mA | 0.032 mA | 0.032 mA |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 类型 | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE |
| 写保护 | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE |
| 厂商名称 | - | Nexflash Technologies Inc | Nexflash Technologies Inc | Nexflash Technologies Inc | Nexflash Technologies Inc | Nexflash Technologies Inc |
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