IC,MICROCONTROLLER,8-BIT,SOP,28PIN,PLASTIC
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 零件包装代码 | SOIC |
| 包装说明 | SOP, SOP28,.4 |
| 针数 | 28 |
| Reach Compliance Code | compliant |
| 位大小 | 8 |
| JESD-30 代码 | R-PDSO-G28 |
| JESD-609代码 | e3 |
| 湿度敏感等级 | 1 |
| 端子数量 | 28 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP28,.4 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | 225 |
| 电源 | 3/5 V |
| 认证状态 | Not Qualified |
| RAM（字节） | 256 |
| ROM（单词） | 4096 |
| ROM可编程性 | FLASH |
| 速度 | 16 MHz |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | MATTE TIN |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER, RISC |
| Base Number Matches | 1 |
| MC9S08SE4CWLE | MC9S08SE4CTGE | MC9S08SE4MRLE | MC9S08SE4MTGE | MC9S08SE4MWLE | MC9S08SE4VRLE | MC9S08SE4VTGE | MC9S08SE4VWLE | |
|---|---|---|---|---|---|---|---|---|
| 描述 | IC,MICROCONTROLLER,8-BIT,SOP,28PIN,PLASTIC | IC,MICROCONTROLLER,8-BIT,TSSOP,16PIN,PLASTIC | IC,MICROCONTROLLER,8-BIT,DIP,28PIN,PLASTIC | IC,MICROCONTROLLER,8-BIT,TSSOP,16PIN,PLASTIC | IC,MICROCONTROLLER,8-BIT,SOP,28PIN,PLASTIC | IC,MICROCONTROLLER,8-BIT,DIP,28PIN,PLASTIC | IC,MICROCONTROLLER,8-BIT,TSSOP,16PIN,PLASTIC | IC,MICROCONTROLLER,8-BIT,SOP,28PIN,PLASTIC |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | SOIC | TSSOP | DIP | TSSOP | SOIC | DIP | TSSOP | SOIC |
| 包装说明 | SOP, SOP28,.4 | TSSOP, TSSOP16,.25 | DIP, DIP28,.6 | TSSOP, TSSOP16,.25 | SOP, SOP28,.4 | DIP, DIP28,.6 | TSSOP, TSSOP16,.25 | SOP, SOP28,.4 |
| 针数 | 28 | 16 | 28 | 16 | 28 | 28 | 16 | 28 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| 位大小 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| JESD-30 代码 | R-PDSO-G28 | R-PDSO-G16 | R-PDIP-T28 | R-PDSO-G16 | R-PDSO-G28 | R-PDIP-T28 | R-PDSO-G16 | R-PDSO-G28 |
| JESD-609代码 | e3 | e3 | e3 | e3 | e3 | e3 | e3 | e3 |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 28 | 16 | 28 | 16 | 28 | 28 | 16 | 28 |
| 最高工作温度 | 85 °C | 85 °C | 125 °C | 125 °C | 125 °C | 105 °C | 105 °C | 105 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | TSSOP | DIP | TSSOP | SOP | DIP | TSSOP | SOP |
| 封装等效代码 | SOP28,.4 | TSSOP16,.25 | DIP28,.6 | TSSOP16,.25 | SOP28,.4 | DIP28,.6 | TSSOP16,.25 | SOP28,.4 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | IN-LINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | IN-LINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | 225 | 225 | 225 | 225 | 225 | 225 | 225 | 225 |
| 电源 | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM（字节） | 256 | 256 | 256 | 256 | 256 | 256 | 256 | 256 |
| ROM（单词） | 4096 | 4096 | 4096 | 4096 | 4096 | 4096 | 4096 | 4096 |
| ROM可编程性 | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH |
| 速度 | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz |
| 表面贴装 | YES | YES | NO | YES | YES | NO | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | MATTE TIN | MATTE TIN | MATTE TIN | MATTE TIN | MATTE TIN | MATTE TIN | MATTE TIN | MATTE TIN |
| 端子形式 | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | GULL WING |
| 端子节距 | 1.27 mm | 0.635 mm | 2.54 mm | 0.635 mm | 1.27 mm | 2.54 mm | 0.635 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
