D Flip-Flop, SSTV Series, 1-Func, Positive Edge Triggered, 13-Bit, True Output, PDSO64, GREEN, TSSOP-64
参数名称 | 属性值 |
是否Rohs认证 | 符合 |
零件包装代码 | TSSOP |
包装说明 | TSSOP, TSSOP64,.32,20 |
针数 | 64 |
Reach Compliance Code | unknown |
其他特性 | 220 MHZ FOR PC3200 OPERATION |
系列 | SSTV |
JESD-30 代码 | R-PDSO-G64 |
JESD-609代码 | e3 |
长度 | 17 mm |
逻辑集成电路类型 | D FLIP-FLOP |
湿度敏感等级 | 1 |
位数 | 13 |
功能数量 | 1 |
端子数量 | 64 |
最高工作温度 | 70 °C |
最低工作温度 | |
输出极性 | TRUE |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TSSOP |
封装等效代码 | TSSOP64,.32,20 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度) | 260 |
电源 | 2.5 V |
传播延迟(tpd) | 2.7 ns |
认证状态 | Not Qualified |
座面最大高度 | 1.1 mm |
最大供电电压 (Vsup) | 2.7 V |
最小供电电压 (Vsup) | 2.3 V |
标称供电电压 (Vsup) | 2.5 V |
表面贴装 | YES |
温度等级 | COMMERCIAL |
端子面层 | Matte Tin (Sn) - annealed |
端子形式 | GULL WING |
端子节距 | 0.5 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | 30 |
触发器类型 | POSITIVE EDGE |
宽度 | 6.1 mm |
最小 fmax | 200 MHz |
Base Number Matches | 1 |
IDT74SSTVN16859PAG | IDT74SSTVN16859PAG8 | IDT74SSTVN16859NLG | IDT74SSTVN16859NLG8 | |
---|---|---|---|---|
描述 | D Flip-Flop, SSTV Series, 1-Func, Positive Edge Triggered, 13-Bit, True Output, PDSO64, GREEN, TSSOP-64 | D Flip-Flop, SSTV Series, 1-Func, Positive Edge Triggered, 13-Bit, True Output, PDSO64, GREEN, TSSOP-64 | D Flip-Flop, SSTV Series, 1-Func, Positive Edge Triggered, 13-Bit, True Output, PQCC56, GREEN, PLASTIC, VFQFN-56 | D Flip-Flop, SSTV Series, 1-Func, Positive Edge Triggered, 13-Bit, True Output, PQCC56, GREEN, PLASTIC, VFQFN-56 |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 |
零件包装代码 | TSSOP | TSSOP | QFN | QFN |
包装说明 | TSSOP, TSSOP64,.32,20 | TSSOP, TSSOP64,.32,20 | GREEN, PLASTIC, VFQFN-56 | GREEN, PLASTIC, VFQFN-56 |
针数 | 64 | 64 | 56 | 56 |
Reach Compliance Code | unknown | unknown | unknown | unknown |
其他特性 | 220 MHZ FOR PC3200 OPERATION | 220 MHZ FOR PC3200 OPERATION | 220 MHZ FOR PC3200 OPERATION | 220 MHZ FOR PC3200 OPERATION |
系列 | SSTV | SSTV | SSTV | SSTV |
JESD-30 代码 | R-PDSO-G64 | R-PDSO-G64 | S-PQCC-N56 | S-PQCC-N56 |
JESD-609代码 | e3 | e3 | e3 | e3 |
长度 | 17 mm | 17 mm | 8 mm | 8 mm |
逻辑集成电路类型 | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP |
湿度敏感等级 | 1 | 1 | 3 | 3 |
位数 | 13 | 13 | 13 | 13 |
功能数量 | 1 | 1 | 1 | 1 |
端子数量 | 64 | 64 | 56 | 56 |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C |
输出极性 | TRUE | TRUE | TRUE | TRUE |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | TSSOP | TSSOP | VQCCN | VQCCN |
封装等效代码 | TSSOP64,.32,20 | TSSOP64,.32,20 | LCC56,.31SQ,20 | LCC56,.31SQ,20 |
封装形状 | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | CHIP CARRIER, VERY THIN PROFILE | CHIP CARRIER, VERY THIN PROFILE |
峰值回流温度(摄氏度) | 260 | 260 | 260 | 260 |
电源 | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
传播延迟(tpd) | 2.7 ns | 2.7 ns | 2.5 ns | 2.5 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.1 mm | 1.1 mm | 1 mm | 1 mm |
最大供电电压 (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
最小供电电压 (Vsup) | 2.3 V | 2.3 V | 2.3 V | 2.3 V |
标称供电电压 (Vsup) | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
表面贴装 | YES | YES | YES | YES |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子面层 | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed |
端子形式 | GULL WING | GULL WING | NO LEAD | NO LEAD |
端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
端子位置 | DUAL | DUAL | QUAD | QUAD |
处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 |
触发器类型 | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
宽度 | 6.1 mm | 6.1 mm | 8 mm | 8 mm |
最小 fmax | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
Base Number Matches | 1 | 1 | 1 | 1 |
厂商名称 | - | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
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