5962-8680504QA概述

UVPROM, 64KX16, 170ns, CMOS, CDIP40, 0.600 INCH, WINDOWED, CERDIP-40

5962-8680504QA规格参数

参数名称	属性值
包装说明	0.600 INCH, WINDOWED, CERDIP-40
Reach Compliance Code	unknown
最长访问时间	170 ns
JESD-30 代码	R-GDIP-T40
JESD-609代码	e0
长度	52.455 mm
内存密度	1048576 bit
内存集成电路类型	UVPROM
内存宽度	16
功能数量	1
端子数量	40
字数	65536 words
字数代码	64000
工作模式	ASYNCHRONOUS
最高工作温度	125 °C
最低工作温度	-55 °C
组织	64KX16
输出特性	3-STATE
封装主体材料	CERAMIC, GLASS-SEALED
封装代码	WDIP
封装形状	RECTANGULAR
封装形式	IN-LINE, WINDOW
并行/串行	PARALLEL
认证状态	Not Qualified
座面最大高度	5.72 mm
最大供电电压 (Vsup)	5.5 V
最小供电电压 (Vsup)	4.5 V
标称供电电压 (Vsup)	5 V
表面贴装	NO
技术	CMOS
温度等级	MILITARY
端子面层	TIN LEAD
端子形式	THROUGH-HOLE
端子节距	2.54 mm
端子位置	DUAL
宽度	15.24 mm
Base Number Matches	1

文档预览

下载PDF文档

全文
预览

5962-8680504QA相似产品对比

	5962-8680504QA	5962-8680506XA	5962-8680506QC	5962-8680505XA	5962-8680504XC	5962-8680505QC
描述	UVPROM, 64KX16, 170ns, CMOS, CDIP40, 0.600 INCH, WINDOWED, CERDIP-40	UVPROM, 64KX16, 120ns, CMOS, CDIP40, 0.600 INCH, WINDOWED, CERDIP-40	UVPROM, 64KX16, 120ns, CMOS, CQCC44, WINDOWED, CERAMIC, LLCC-44	UVPROM, 64KX16, 150ns, CMOS, CDIP40, 0.600 INCH, WINDOWED, CERDIP-40	UVPROM, 64KX16, 170ns, CMOS, CQCC44, WINDOWED, CERAMIC, LLCC-44	UVPROM, 64KX16, 150ns, CMOS, CQCC44, WINDOWED, CERAMIC, LLCC-44
包装说明	0.600 INCH, WINDOWED, CERDIP-40	0.600 INCH, WINDOWED, CERDIP-40	WINDOWED, CERAMIC, LLCC-44	0.600 INCH, WINDOWED, CERDIP-40	WINDOWED, CERAMIC, LLCC-44	WINDOWED, CERAMIC, LLCC-44
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown
最长访问时间	170 ns	120 ns	120 ns	150 ns	170 ns	150 ns
JESD-30 代码	R-GDIP-T40	R-GDIP-T40	S-CQCC-N44	R-GDIP-T40	S-CQCC-N44	S-CQCC-N44
JESD-609代码	e0	e0	e4	e0	e4	e4
长度	52.455 mm	52.455 mm	16.535 mm	52.455 mm	16.535 mm	16.535 mm
内存密度	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit
内存集成电路类型	UVPROM	UVPROM	UVPROM	UVPROM	UVPROM	UVPROM
内存宽度	16	16	16	16	16	16
功能数量	1	1	1	1	1	1
端子数量	40	40	44	40	44	44
字数	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words
字数代码	64000	64000	64000	64000	64000	64000
工作模式	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
最高工作温度	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
最低工作温度	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
组织	64KX16	64KX16	64KX16	64KX16	64KX16	64KX16
输出特性	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
封装主体材料	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
封装代码	WDIP	WDIP	WQCCN	WDIP	WQCCN	WQCCN
封装形状	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR	SQUARE	SQUARE
封装形式	IN-LINE, WINDOW	IN-LINE, WINDOW	CHIP CARRIER, WINDOW	IN-LINE, WINDOW	CHIP CARRIER, WINDOW	CHIP CARRIER, WINDOW
并行/串行	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	5.72 mm	5.72 mm	3.3 mm	5.72 mm	3.3 mm	3.3 mm
最大供电电压 (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
最小供电电压 (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
标称供电电压 (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V
表面贴装	NO	NO	YES	NO	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
端子面层	TIN LEAD	TIN LEAD	GOLD	TIN LEAD	GOLD	GOLD
端子形式	THROUGH-HOLE	THROUGH-HOLE	NO LEAD	THROUGH-HOLE	NO LEAD	NO LEAD
端子节距	2.54 mm	2.54 mm	1.27 mm	2.54 mm	1.27 mm	1.27 mm
端子位置	DUAL	DUAL	QUAD	DUAL	QUAD	QUAD
宽度	15.24 mm	15.24 mm	16.535 mm	15.24 mm	16.535 mm	16.535 mm
Base Number Matches	1	1	1	1	1	-
厂商名称	-	Waferscale Integration Inc	Waferscale Integration Inc	Waferscale Integration Inc	Waferscale Integration Inc	Waferscale Integration Inc

5962-8680504QA

5962-8680504QA概述

5962-8680504QA规格参数

文档预览

5962-8680504QA相似产品对比

推荐资源