UMA5817, UMA5818, and UMA5819
U
LTRA
M
ITE™ SURFACE MOUNT
SCOTTSDALE DIVISION
SCHOTTKY BARRIER RECTIFIERS
DESCRIPTION
The UMA5817 thru UMA5819 UltraMite™ series offers small efficient
surface mount packaging with the same electrical features as the popular
1N5817, 1N5818, and 1N5819 Schottky rectifiers. It provides the same
size footprint as other small surface mount DO-214AC or BA package
options except with a much lower profile height. Its configuration in a “2010
MELF” style robust package design prevents lead damage to terminals and
also minimizes parasitics by eliminating internal wire bonds and providing
very short internal conduction paths.
IMPORTANT:
For the most current data, consult
MICROSEMI’s
website:
http://www.microsemi.com
APPEARANCE
WWW .
Microsemi
.C
OM
UltraMite™
FEATURES
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Plastic package has Underwriters Laboratory
Flammability classification 94V-0
Metal to silicon rectifier, majority carrier conduction
High current capability, low V
F
Built-in stress relief with similar COE as PC boards
Optional Lead-Free design/finish (UMAF5817-19)
Options for screening in accordance with MIL-PRF-
19500/586 for JAN, JANTX, JANTXV, and JANS
are available by adding MQ, MX, MV, or MSP
prefixes respectively to part numbers. For
example, designate a MXUMAJ5819 for a JANTX
screen.
•
•
APPLICATIONS / BENEFITS
For surface mount applications
For use in low-voltage high-frequency switching
power supplies, inverters, free wheeling, and
polarity protection applications
Low power loss, High efficiency
Low inductive parasitics for minimal Ldi/dt effects
Fits same small PCB footprints as popular
“SMAJxxx” or “SMBJxxx” Schottky devices in
JEDEC outlines DO-214AC (or BA) and DO-214AA
respectively except with much lower height profile
Robust 2010 MELF style package configuration for
pick-and-place handling
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MAXIMUM RATINGS
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MECHANICAL AND PACKAGING
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FRP substrate material and epoxy under-fill
package meeting UL94V-0
Terminals solder plated (solderable per MIL-STD-
750, Method 2026)
Body marked with 5817, 5818, or 5819
Cathode designated with band
Weight: 0.020 grams
Tape & Reel packaging per EIA-481-2 with 12 mm
tape and 3000 units/reel (7 inch reel) or 10,000
units/reel (13 inch reel)
See package dimensions on last page
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Operating junction and storage temperature
range (T
J
and T
STG
): -50
o
C to +125
o
C
Forward average rectified current (I
O
)
@T
C
=75
o
C: 1.0 Amp
Forward surge current (I
FSM
) 8.3 ms single
half-sine waveform superimposed on rated
load (JEDEC Method): 25 Amps
Typical thermal resistance (R
θJL
): 50
o
C/W
Typical junction capacitance (C
J
) at 1.0 MHz
and V
R
of 5.0 Volts: 65 pF for UMA5817, and
46 pF for UMA5818 and UMA5819
Solder temperatures: 260 C for 10 s (maximum)
º
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ELECTRICAL CHARACTERISTICS @ 25
o
C
Working
Peak
Reverse
Voltage
V
RWM
Volts
20
30
40
Maximum
RMS
Voltage;
V
RMS
Volts
14
21
28
Maximum
Peak
Repetitive
Voltage;
V
RRM
Volts
20
30
40
unless specified otherwise
UMA5817 thru
UMA5819
UMA5819
Part
Number
UMA5817
UMA5818
UMA5819
Copyright
2002
10-16-03 REV B
Maximum
Forward
Voltage at 1.0A
(note 1)
V
F
Volts
0.45
0.55
0.60
Maximum
Forward
Voltage at 3.0A
(note 1)
V
F
Volts
0.75
0.875
0.90
Maximum
dc reverse
current @
V
RWM
I
R
mA
0.5
0.5
0.5
Maximum dc
reverse
current @
o
V
RWM
,100 C
I
R
mA
10
10
10
NOTES:
(1) Pulse test with P
W
=300
µsec,
1% duty cycle.
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
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