ISOLATION AMPLIFIER, 2000 V ISOLATION-MIN, 30 kHz BAND WIDTH, CDIP20
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Burr-Brown |
Reach Compliance Code | unknown |
Is Samacsys | N |
放大器类型 | ISOLATION AMPLIFIER |
标称带宽 (3dB) | 30 MHz |
最大共模电压 | 2000 V |
最小绝缘电压 | 2000 V |
JESD-30 代码 | S-CDIP-P20 |
JESD-609代码 | e0 |
标称负供电电压 (Vsup) | -15 V |
功能数量 | 1 |
端子数量 | 20 |
最高工作温度 | 70 °C |
最低工作温度 | |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
封装代码 | DIP |
封装等效代码 | DIP20,.9 |
封装形状 | SQUARE |
封装形式 | IN-LINE |
电源 | +-15 V |
认证状态 | Not Qualified |
最大压摆率 | 18 mA |
供电电压上限 | 16 V |
标称供电电压 (Vsup) | 15 V |
表面贴装 | NO |
技术 | BIPOLAR |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | PIN/PEG |
端子节距 | 2.54 mm |
端子位置 | DUAL |
Base Number Matches | 1 |
3656JG | 3656AG | 3656HG | 3656 | 3656BG | 3656KG | |
---|---|---|---|---|---|---|
描述 | ISOLATION AMPLIFIER, 2000 V ISOLATION-MIN, 30 kHz BAND WIDTH, CDIP20 | ISOLATION AMPLIFIER, 2000 V ISOLATION-MIN, 30 kHz BAND WIDTH, CDIP20 | ISOLATION AMPLIFIER, 2000 V ISOLATION-MIN, 30 kHz BAND WIDTH, CDIP20 | Transformer Coupled ISOLATION AMPLIFIER | ISOLATION AMPLIFIER, 2000 V ISOLATION-MIN, 30 kHz BAND WIDTH, CDIP20 | ISOLATION AMPLIFIER, 2000 V ISOLATION-MIN, 30 kHz BAND WIDTH, MDIP10 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | - | 不符合 | 不符合 |
厂商名称 | Burr-Brown | Burr-Brown | Burr-Brown | - | Burr-Brown | Burr-Brown |
Reach Compliance Code | unknown | unknown | unknown | - | unknown | unknown |
Is Samacsys | N | N | N | - | N | N |
放大器类型 | ISOLATION AMPLIFIER | ISOLATION AMPLIFIER | ISOLATION AMPLIFIER | - | ISOLATION AMPLIFIER | ISOLATION AMPLIFIER |
标称带宽 (3dB) | 30 MHz | 30 MHz | 30 MHz | - | 30 MHz | 30 MHz |
最大共模电压 | 2000 V | 2000 V | 2000 V | - | 2000 V | 2000 V |
最小绝缘电压 | 2000 V | 2000 V | 2000 V | - | 2000 V | 2000 V |
JESD-30 代码 | S-CDIP-P20 | S-CDIP-P20 | S-CDIP-P20 | - | S-CDIP-P20 | S-CDIP-P20 |
JESD-609代码 | e0 | e0 | e0 | - | e0 | e0 |
标称负供电电压 (Vsup) | -15 V | -15 V | -15 V | - | -15 V | -15 V |
功能数量 | 1 | 1 | 1 | - | 1 | 1 |
端子数量 | 20 | 20 | 20 | - | 20 | 20 |
最高工作温度 | 70 °C | 85 °C | 70 °C | - | 85 °C | 70 °C |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | - | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
封装代码 | DIP | DIP | DIP | - | DIP | DIP |
封装等效代码 | DIP20,.9 | DIP20,.9 | DIP20,.9 | - | DIP20,.9 | DIP20,.9 |
封装形状 | SQUARE | SQUARE | SQUARE | - | SQUARE | SQUARE |
封装形式 | IN-LINE | IN-LINE | IN-LINE | - | IN-LINE | IN-LINE |
电源 | +-15 V | +-15 V | +-15 V | - | +-15 V | +-15 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified |
最大压摆率 | 18 mA | 18 mA | 18 mA | - | 18 mA | 18 mA |
供电电压上限 | 16 V | 16 V | 16 V | - | 16 V | 16 V |
标称供电电压 (Vsup) | 15 V | 15 V | 15 V | - | 15 V | 15 V |
表面贴装 | NO | NO | NO | - | NO | NO |
技术 | BIPOLAR | BIPOLAR | BIPOLAR | - | BIPOLAR | BIPOLAR |
温度等级 | COMMERCIAL | OTHER | COMMERCIAL | - | OTHER | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | PIN/PEG | PIN/PEG | PIN/PEG | - | PIN/PEG | PIN/PEG |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | - | 2.54 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | - | DUAL | DUAL |
Base Number Matches | 1 | 1 | 1 | - | 1 | 1 |
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