ADC, Successive Approximation, 12-Bit, 1 Func, 1 Channel, Parallel, 8 Bits, Parallel, Word Access, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
包装说明 | 0.300 INCH, PLASTIC, DIP-28 |
Reach Compliance Code | unknown |
最大模拟输入电压 | 10 V |
最小模拟输入电压 | -10 V |
最长转换时间 | 4.7 µs |
转换器类型 | ADC, SUCCESSIVE APPROXIMATION |
JESD-30 代码 | R-PDIP-T28 |
长度 | 36.035 mm |
最大线性误差 (EL) | 0.0183% |
湿度敏感等级 | 1 |
模拟输入通道数量 | 1 |
位数 | 12 |
功能数量 | 1 |
端子数量 | 28 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
输出位码 | OFFSET BINARY |
输出格式 | PARALLEL, 8 BITS, PARALLEL, WORD |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | DIP |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
峰值回流温度(摄氏度) | 225 |
认证状态 | Not Qualified |
采样速率 | 0.333 MHz |
采样并保持/跟踪并保持 | SAMPLE |
座面最大高度 | 5.334 mm |
最大压摆率 | 21 mA |
标称供电电压 | 5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 7.62 mm |
Base Number Matches | 1 |
SP8505BN | SP8503BS | SP8503BN | SP8510BN | SP8505BS | SP8510BS | |
---|---|---|---|---|---|---|
描述 | ADC, Successive Approximation, 12-Bit, 1 Func, 1 Channel, Parallel, 8 Bits, Parallel, Word Access, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28 | ADC, Successive Approximation, 12-Bit, 1 Func, 1 Channel, Parallel, 8 Bits, Parallel, Word Access, CMOS, PDSO28, 0.300 INCH, SOIC-28 | ADC, Successive Approximation, 12-Bit, 1 Func, 1 Channel, Parallel, 8 Bits, Parallel, Word Access, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28 | ADC, Successive Approximation, 12-Bit, 1 Func, 1 Channel, Parallel, 8 Bits, Parallel, Word Access, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28 | ADC, Successive Approximation, 12-Bit, 1 Func, 1 Channel, Parallel, 8 Bits, Parallel, Word Access, CMOS, PDSO28, 0.300 INCH, SOIC-28 | ADC, Successive Approximation, 12-Bit, 1 Func, 1 Channel, Parallel, 8 Bits, Parallel, Word Access, CMOS, PDSO28, 0.300 INCH, SOIC-28 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
包装说明 | 0.300 INCH, PLASTIC, DIP-28 | 0.300 INCH, SOIC-28 | 0.300 INCH, PLASTIC, DIP-28 | 0.300 INCH, PLASTIC, DIP-28 | 0.300 INCH, SOIC-28 | 0.300 INCH, SOIC-28 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknow |
最大模拟输入电压 | 10 V | 10 V | 10 V | 10 V | 10 V | 10 V |
最小模拟输入电压 | -10 V | -10 V | -10 V | -10 V | -10 V | -10 V |
最长转换时间 | 4.7 µs | 2.7 µs | 2.7 µs | 9.7 µs | 4.7 µs | 9.7 µs |
转换器类型 | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION |
JESD-30 代码 | R-PDIP-T28 | R-PDSO-G28 | R-PDIP-T28 | R-PDIP-T28 | R-PDSO-G28 | R-PDSO-G28 |
长度 | 36.035 mm | 17.9 mm | 36.035 mm | 36.035 mm | 17.9 mm | 17.9 mm |
最大线性误差 (EL) | 0.0183% | 0.0183% | 0.0183% | 0.0183% | 0.0183% | 0.0183% |
湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 |
模拟输入通道数量 | 1 | 1 | 1 | 1 | 1 | 1 |
位数 | 12 | 12 | 12 | 12 | 12 | 12 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 28 | 28 | 28 | 28 | 28 | 28 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
输出位码 | OFFSET BINARY | OFFSET BINARY | OFFSET BINARY | OFFSET BINARY | OFFSET BINARY | OFFSET BINARY |
输出格式 | PARALLEL, 8 BITS, PARALLEL, WORD | PARALLEL, 8 BITS, PARALLEL, WORD | PARALLEL, 8 BITS, PARALLEL, WORD | PARALLEL, 8 BITS, PARALLEL, WORD | PARALLEL, 8 BITS, PARALLEL, WORD | PARALLEL, 8 BITS, PARALLEL, WORD |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | DIP | SOP | DIP | DIP | SOP | SOP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | SMALL OUTLINE | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE |
峰值回流温度(摄氏度) | 225 | 225 | 225 | 225 | 225 | 225 |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
采样速率 | 0.333 MHz | 0.333 MHz | 0.333 MHz | 0.333 MHz | 0.333 MHz | 0.333 MHz |
采样并保持/跟踪并保持 | SAMPLE | SAMPLE | SAMPLE | SAMPLE | SAMPLE | SAMPLE |
座面最大高度 | 5.334 mm | 2.65 mm | 5.334 mm | 5.334 mm | 2.65 mm | 2.65 mm |
最大压摆率 | 21 mA | 21 mA | 21 mA | 21 mA | 21 mA | 21 mA |
标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | YES | NO | NO | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子形式 | THROUGH-HOLE | GULL WING | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING |
端子节距 | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 7.62 mm | 7.5 mm | 7.62 mm | 7.62 mm | 7.5 mm | 7.5 mm |
Base Number Matches | 1 | 1 | 1 | 1 | - | - |
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