Ceramic Capacitor, Multilayer, Ceramic, 25V, 5% +Tol, 5% -Tol, X7R, 15% TC, 0.027uF, Surface Mount, 0603, CHIP
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 包装说明 | , 0603 |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| 电容 | 0.027 µF |
| 电容器类型 | CERAMIC CAPACITOR |
| 介电材料 | CERAMIC |
| 高度 | 0.8 mm |
| JESD-609代码 | e3 |
| 长度 | 1.6 mm |
| 安装特点 | SURFACE MOUNT |
| 多层 | Yes |
| 负容差 | 5% |
| 端子数量 | 2 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装形状 | RECTANGULAR PACKAGE |
| 封装形式 | SMT |
| 包装方法 | TR, PAPER, 7 INCH |
| 正容差 | 5% |
| 额定(直流)电压(URdc) | 25 V |
| 尺寸代码 | 0603 |
| 表面贴装 | YES |
| 温度特性代码 | X7R |
| 温度系数 | 15% ppm/°C |
| 端子面层 | Tin (Sn) |
| 端子形状 | WRAPAROUND |
| 宽度 | 0.8 mm |
| Base Number Matches | 1 |

| 器件名 | 厂商 | 描述 |
|---|---|---|
| 0603B273J250CB | Fenghua (HK) Electronics Ltd | Ceramic Capacitor, Multilayer, Ceramic, 25V, 5% +Tol, 5% -Tol, X7R, 15% TC, 0.027uF, Surface Mount, 0603, CHIP |
| 225491645542 | YAGEO(国巨) | Ceramic Capacitor, Multilayer, Ceramic, 25V, 5% +Tol, 5% -Tol, X7R, 15% TC, 0.027uF, Surface Mount, 0603, CHIP |
| 0603J0250273JXT | Syfer | Ceramic Capacitor, Multilayer, Ceramic, 25V, 5% +Tol, 5% -Tol, X7R, 15% TC, 0.027uF, Surface Mount, 0603, CHIP |
| CS0603JC8273 | YAGEO(国巨) | CAPACITOR, CERAMIC, MULTILAYER, 25V, X7R, 0.027uF, SURFACE MOUNT, 0603, CHIP, HALOGEN FREE AND ROHS COMPLIANT |
| 0603Y0250273JXT | Syfer | Ceramic Capacitor, Multilayer, Ceramic, 25V, 5% +Tol, 5% -Tol, X7R, 15% TC, 0.027uF, Surface Mount, 0603, CHIP, ROHS COMPLIANT |
| 0603J0250273JXR | Syfer | Ceramic Capacitor, Multilayer, Ceramic, 25V, 5% +Tol, 5% -Tol, X7R, 15% TC, 0.027uF, Surface Mount, 0603, CHIP |
| CS0603JP8273 | YAGEO(国巨) | CAPACITOR, CERAMIC, MULTILAYER, 25V, X7R, 0.027uF, SURFACE MOUNT, 0603, CHIP, HALOGEN FREE AND ROHS COMPLIANT |
| 223891655542 | YAGEO(国巨) | Ceramic Capacitor, Multilayer, Ceramic, 25V, 5% +Tol, 5% -Tol, X7R, 15% TC, 0.027uF, Surface Mount, 0603, CHIP |
| CS0603JR8273 | YAGEO(国巨) | CAPACITOR, CERAMIC, MULTILAYER, 25V, X7R, 0.027uF, SURFACE MOUNT, 0603, CHIP, HALOGEN FREE AND ROHS COMPLIANT |
| 0603B273J250CT | Walsin_Technology_Corporation | Ceramic Capacitor, Multilayer, Ceramic, 25V, 5% +Tol, 5% -Tol, X7R, 15% TC, 0.027uF, Surface Mount, 0603, CHIP |
| C0603X273J3RACTM | KEMET(基美) | Ceramic Capacitor, Multilayer, Ceramic, 25V, 5% +Tol, 5% -Tol, X7R, 15% TC, 0.027uF, Surface Mount, 0603, CHIP, ROHS COMPLIANT |
| 0603B273J250NT | Fenghua (HK) Electronics Ltd | Ceramic Capacitor, Multilayer, Ceramic, 25V, 5% +Tol, 5% -Tol, X7R, 15% TC, 0.027uF, Surface Mount, 0603, CHIP |
| 0603B273J250C | Fenghua (HK) Electronics Ltd | Ceramic Capacitor, Multilayer, Ceramic, 25V, 5% +Tol, 5% -Tol, X7R, 15% TC, 0.027uF, Surface Mount, 0603, CHIP |
| 0603B273J250SB | Fenghua (HK) Electronics Ltd | Ceramic Capacitor, Multilayer, Ceramic, 25V, 5% +Tol, 5% -Tol, X7R, 15% TC, 0.027uF, Surface Mount, 0603, CHIP |
| 0603B273J250N | Fenghua (HK) Electronics Ltd | Ceramic Capacitor, Multilayer, Ceramic, 25V, 5% +Tol, 5% -Tol, X7R, 15% TC, 0.027uF, Surface Mount, 0603, CHIP |
| 0603B273J250NB | Fenghua (HK) Electronics Ltd | Ceramic Capacitor, Multilayer, Ceramic, 25V, 5% +Tol, 5% -Tol, X7R, 15% TC, 0.027uF, Surface Mount, 0603, CHIP |
| C0603X273J3RALTM | KEMET(基美) | Ceramic Capacitor, Multilayer, Ceramic, 25V, 5% +Tol, 5% -Tol, X7R, 15% TC, 0.027uF, Surface Mount, 0603, CHIP |
| 0603B273J250S | Fenghua (HK) Electronics Ltd | Ceramic Capacitor, Multilayer, Ceramic, 25V, 5% +Tol, 5% -Tol, X7R, 15% TC, 0.027uF, Surface Mount, 0603, CHIP |
| 0603B273J250ST | Fenghua (HK) Electronics Ltd | Ceramic Capacitor, Multilayer, Ceramic, 25V, 5% +Tol, 5% -Tol, X7R, 15% TC, 0.027uF, Surface Mount, 0603, CHIP |
| 0603B273J250CR | Walsin_Technology_Corporation | Ceramic Capacitor, Multilayer, Ceramic, 25V, 5% +Tol, 5% -Tol, X7R, 15% TC, 0.027uF, Surface Mount, 0603, CHIP, ROHS COMPLIANT |
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