IC HCT SERIES, OTHER DECODER/DRIVER, INVERTED OUTPUT, UUC, CHIP ON WAFER, Decoder/Driver
| 参数名称 | 属性值 |
| 零件包装代码 | WAFER |
| 包装说明 | DIE, |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 系列 | HCT |
| 输入调节 | STANDARD |
| JESD-30 代码 | X-XUUC-N |
| 逻辑集成电路类型 | OTHER DECODER/DRIVER |
| 功能数量 | 1 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 输出极性 | INVERTED |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | DIE |
| 封装形状 | UNSPECIFIED |
| 封装形式 | UNCASED CHIP |
| 传播延迟（tpd） | 53 ns |
| 认证状态 | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子形式 | NO LEAD |
| 端子位置 | UPPER |
| Base Number Matches | 1 |
| 933824900005 | 933824320025 | 933824320005 | 74HCT138U | 935174380698 | |
|---|---|---|---|---|---|
| 描述 | IC HCT SERIES, OTHER DECODER/DRIVER, INVERTED OUTPUT, UUC, CHIP ON WAFER, Decoder/Driver | IC HC/UH SERIES, OTHER DECODER/DRIVER, INVERTED OUTPUT, UUC, CHIP ON WAFER, Decoder/Driver | IC HC/UH SERIES, OTHER DECODER/DRIVER, INVERTED OUTPUT, UUC, CHIP ON WAFER, Decoder/Driver | IC HCT SERIES, OTHER DECODER/DRIVER, INVERTED OUTPUT, UUC, CHIP ON WAFER, Decoder/Driver | IC HC/UH SERIES, OTHER DECODER/DRIVER, INVERTED OUTPUT, PDSO16, TSSOP-16, Decoder/Driver |
| 零件包装代码 | WAFER | WAFER | WAFER | WAFER | TSSOP |
| 包装说明 | DIE, | DIE, | DIE, | DIE, | TSSOP, |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 系列 | HCT | HC/UH | HC/UH | HCT | HC/UH |
| 输入调节 | STANDARD | STANDARD | STANDARD | STANDARD | STANDARD |
| JESD-30 代码 | X-XUUC-N | X-XUUC-N | X-XUUC-N | X-XUUC-N | R-PDSO-G16 |
| 逻辑集成电路类型 | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出极性 | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED |
| 封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | PLASTIC/EPOXY |
| 封装代码 | DIE | DIE | DIE | DIE | TSSOP |
| 封装形状 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | RECTANGULAR |
| 封装形式 | UNCASED CHIP | UNCASED CHIP | UNCASED CHIP | UNCASED CHIP | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 传播延迟（tpd） | 53 ns | 225 ns | 225 ns | 53 ns | 225 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V | 6 V | 6 V | 5.5 V | 6 V |
| 最小供电电压 (Vsup) | 4.5 V | 2 V | 2 V | 4.5 V | 2 V |
| 标称供电电压 (Vsup) | 5 V | 4.5 V | 4.5 V | 5 V | 4.5 V |
| 表面贴装 | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | GULL WING |
| 端子位置 | UPPER | UPPER | UPPER | UPPER | DUAL |
| Base Number Matches | 1 | 1 | 1 | 1 | - |
| 厂商名称 | - | NXP(恩智浦) | NXP(恩智浦) | - | NXP(恩智浦) |
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