®
SM2T
TRANSIL™
FEATURES
■
High Peak pulse power:
200 W (10/1000 µs )
1000 W ( 8/20 µs)
■
Stand-off voltage range 5 to 24V
■
Unidirectional types
■
Low clamping factor V
CL
/V
BR
■
■
A
K
Fast response time
1.0mm overall component height
STmite
(JEDEC DO-216AA)
DESCRIPTION
The SM2T series are Transil diodes designed spe-
cifically for portable equipment and miniaturized
electronics devices subject to ESD transient over-
voltages.
Fully compatible with pick and place equipment
and inspectable soldering joints.
Table 1: Order Codes
Part Number
SM2T6V8A
SM2T14A
SM2T18A
SM2T27A
Marking
MUA
MUE
MUG
MUJ
Table 2: Absolute Ratings
(T
amb
= 25°C)
Symbol
P
PP
P
I
FSM
T
stg
T
j
T
L
Parameter
Peak pulse power dissipation (see note
1
)
Power dissipation on infinite heatsink
Non repetitive surge peak forward current
Storage temperature range
Maximum junction temperature
Maximum lead temperature for soldering during 10 s.
T
j
initial = T
amb
T
amb
= 100°C
t
p
= 10 ms
T
j
initial = T
amb
Value
200
2.5
25
-65 to 175
150
260
Unit
W
W
A
°C
°C
Note 1:
10/1000µs pulse waveform.
Table 3: Thermal Resistances
Symbol
Parameter
Rth(j-t) Junction to tab
Rth(j-a) Junction to ambient on PCB with recommended pad layout
Value
20
250
Unit
°C/W
°C/W
January 2005
REV. 3
1/6
SM2T
Table 4: Electrical Characteristics
(T
amb
= 25°C)
Symbol
V
RM
V
BR
V
CL
I
RM
I
PP
αT
V
F
Parameter
IF
I
Stand-off voltage
Breakdown voltage
Clamping voltage
Leakage current @ V
RM
Peak pulse current
Voltage temperature coefficient
Forward voltage drop
I PP
VCL
VBR
V RM
VF
I RM
V
I
RM
Types
max
µA
SM2T6V8A
SM2T14A
SM2T18A
SM2T27A
Note 1:
10/1000µs pulse waveform.
@
V
RM
V
BR
min
@
I
R
V
CL
@
max
note1
I
PP
α
T
max
C
typ
@ 0V
pF
1600
650
500
350
V
5
12
16
24
V
6.4
13.3
17.1
25.7
mA
10
1
1
1
V
9.2
19.9
26
28.9
A
19.6
9
7
4.6
50
1
1
1
10
-4
/°C
5.7
8.3
8.8
9.6
2/6
SM2T
Figure 1: Peak pulse power versus exponential
pulse duration
P
PP
(W)
1.E+04
T
j
initial = 25°C
Figure 2: Relative variation of peak pulse
power versus initial junction temperature
%
110
100
90
80
1.E+03
70
60
50
1.E+02
40
30
20
t
p
(ms)
1.E+01
0.01
0.10
1.00
10.00
10
0
0
25
50
75
T
j
(°C)
100
125
150
175
Figure 3: Average power dissipation versus
ambient temperature
P(W)
3.0
T
AMB
= T
tab
Figure 4: Variation of thermal impedance
junction to ambient versus pulse duration
Z
th(j-c)
/R
th(j-c)
1000.0
S=0.135cm²
2.5
100.0
2.0
S=2cm²
1.5
10.0
1.0
Printed circuit board FR4, recommended pad layout
1.0
0.5
T
AMB
(°C)
0.0
0
25
50
75
100
125
150
0.1
1.E-03
1.E-02
1.E-01
t
p
(s)
1.E+00
1.E+01
1.E+02
1.E+03
Figure 5: Thermal resistance junction to
ambient versus copper surface under tab
R
th(j-a)
(°C/W)
250
Figure 6: Reverse leakage current versus
junction temperature (typical values)
I
R
(nA)
1.E+02
V
R
= V
RM
200
1.E+01
150
1.E+00
100
1.E-01
50
S(cm²)
0
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
T
j
(°C)
1.E-02
0
25
50
75
100
125
150
3/6
SM2T
Figure 7: Clamping voltage versus peak pulse
current (maximum values)
I
PP
(A)
100.0
T
j
initial = 25°C
Figure 8: Junction capacitance versus reverse
voltage applied (typical values)
C(pF)
10000
8/20µs
F=1MHz
V
OSC
=30mV
RMS
T
j
=25°C
10/1000µs
10.0
1000
SM2T6V8A
SM2T6V8A
SM2T14A
SM2T18A
SM2T14A
1.0
100
SM2T27A
SM2T18A
SM2T27A
V
CL
(V)
0.1
0
5
10
15
20
25
30
35
40
45
V
R
(V)
10
1
10
100
Fig. 9: Forward voltage drop versus forward
current (typical values)
I
FM
(A)
1.E+02
1.E+01
T
j
= 150°C
1.E+00
T
j
= 25°C
1.E-01
V
FM
(V)
1.E-02
0.0
0.5
1.0
1.5
2.0
2.5
3.0
4/6
SM2T
Figure 10: STmite Package Mechanical Data
DIMENSIONS
Millimeters
Inches
Min. Typ. Max. Min. Typ.
0.85 1.00 1.15 0.033 0.039
0.10
0.40
0.65 0.016
0.70
1.00 0.027
0.10
0.25 0.004
1.75 1.90 2.05 0.069 0.007
1.75 1.90 2.05 0.069 0.007
3.60 3.75 3.90 0.142 0.148
0.50 0.63 0.80 0.020 0.025
1.20 1.35 1.50 0.047 0.053
0.50
0.019
ref
ref
0.07
0.003
0.07
0.003
REF.
A
A1
b
b2
c
D
E
H
L
L2
L3
R
R1
L3
D
b2
b
H
L2
L
R
E
C
A1
R1
0° to 6°
A
Max.
0.045
0.004
0.025
0.039
0.010
0.081
0.081
0.154
0.031
0.059
Figure 11: STmite Foot Print Dimensions
(in millimeters)
2.67
0.762
2.54
1.27
0.635
Table 5: Ordering Information
Part Number
SM2T6V8A
SM2T14A
SM2T18A
SM2T27A
Table 6: Revision History
Date
April-2002
Aug-2004
14-Jan-2005
Revision
1A
2
3
Last update.
STmite package dimensions update.
Minor layout update. No content change.
Description of Changes
Marking
MUA
MUE
MUG
MUJ
STmite
15.5 mg
12000
Tape & reel
Package
Weight
Base qty
Delivery mode
5/6
嵌入式系统
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
